JPH033735U - - Google Patents
Info
- Publication number
- JPH033735U JPH033735U JP6496289U JP6496289U JPH033735U JP H033735 U JPH033735 U JP H033735U JP 6496289 U JP6496289 U JP 6496289U JP 6496289 U JP6496289 U JP 6496289U JP H033735 U JPH033735 U JP H033735U
- Authority
- JP
- Japan
- Prior art keywords
- fluid rubber
- semiconductor device
- annular
- annular groove
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 5
- 238000010073 coating (rubber) Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Thyristors (AREA)
- Formation Of Insulating Films (AREA)
Description
第１図は本考案の実施例におけるゴム塗布方法
の説明図、第２図は従来半導体素子の要部断面図
である。
１……半導体素子、２……環状溝、３……流動
性ゴム塗布部、４……接合部、５……非流動性ゴ
ム塗布部。
FIG. 1 is an explanatory diagram of a rubber coating method according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part of a conventional semiconductor element. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Annular groove, 3... Fluid rubber coated part, 4... Joint part, 5... Non-flowable rubber coated part.
Claims (1)
た部分に環状に流動性ゴムを塗布して接合部保護
をしたものにおいて、 前記半導体素子の流動性ゴム塗布部の内側に環
状の非流動性ゴム塗布部を設け、前記流動性ゴム
が半導体素子の塗布不要部分に流れ出るのを防止
したことを特徴とした半導体素子。[Scope of Claim for Utility Model Registration] A semiconductor element in which an annular groove is provided, and a fluid rubber is coated in an annular manner on the portion where the annular groove is provided to protect the bonding portion, the fluid rubber coated portion of the semiconductor element. 1. A semiconductor device, characterized in that an annular non-fluid rubber coating portion is provided inside the semiconductor device to prevent the fluid rubber from flowing out to areas of the semiconductor device where coating is not required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6496289U JPH033735U (en) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6496289U JPH033735U (en) | 1989-06-02 | 1989-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033735U true JPH033735U (en) | 1991-01-16 |
Family
ID=31596365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6496289U Pending JPH033735U (en) | 1989-06-02 | 1989-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033735U (en) |
-
1989
- 1989-06-02 JP JP6496289U patent/JPH033735U/ja active Pending