JPH033742U - - Google Patents
Info
- Publication number
- JPH033742U JPH033742U JP6452689U JP6452689U JPH033742U JP H033742 U JPH033742 U JP H033742U JP 6452689 U JP6452689 U JP 6452689U JP 6452689 U JP6452689 U JP 6452689U JP H033742 U JPH033742 U JP H033742U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- semiconductor element
- flat surface
- tape carrier
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の熱圧着具による接合状態を示
す一実施例の要部側断面図、第２図は第１図の熱
圧着具を先端から見た平面図、第３図は従来技術
の熱圧着具による接合状態を示す一実施例の要部
側断面図、第４図は第３図の熱圧着具を先端から
見た平面図、第５図は半導体素子の斜視図である
。
図において、１……熱圧着具、１ａ……熱圧着
部、１ｂ……押圧弾性部材、２……テープキヤリ
ア、２ａ……アウターリード、２ｂ……インナー
リード、３……半導体素子、３ａ……ダイ、４…
…回路基板を示す。
Fig. 1 is a side cross-sectional view of a main part of an embodiment showing a bonding state using the thermocompression bonding tool of the present invention, Fig. 2 is a plan view of the thermocompression bonding tool of Fig. 1 seen from the tip, and Fig. 3 is a conventional technique. FIG. 4 is a plan view of the thermocompression bonding tool of FIG. 3 viewed from the tip, and FIG. 5 is a perspective view of a semiconductor element. In the figure, 1...Thermocompression bonding tool, 1a...Thermocompression bonding part, 1b...Press elastic member, 2...Tape carrier, 2a...Outer lead, 2b...Inner lead, 3...Semiconductor element, 3a... ...Die, 4...
...Indicates a circuit board.
Claims (1)
、テープキヤリアから切り取つたアウターリード
２ａと前記半導体素子３を回路基板４に接合する
際に用いる熱圧着具であつて、 良熱伝導体の先端部に枠形に突出し前記アウタ
ーリード２ａを加熱、加圧する平坦面を有する熱
圧着部１ａと、該熱圧着部１ａの内側に前記半導
体素子３のダイ３ａ周縁部を押圧する平坦面を有
する不良熱伝導体からなる押圧弾性部材１ｂを突
設することを特徴とするテープキヤリア素子の熱
圧着具。[Claims for Utility Model Registration] A thermocompression bonding tool used for inner lead bonding of a semiconductor element 3 and bonding of an outer lead 2a cut from a tape carrier and the semiconductor element 3 to a circuit board 4, which has good thermal conductivity. a thermocompression bonding part 1a having a frame-shaped flat surface protruding from the tip of the body and heating and pressurizing the outer lead 2a; and a flat surface that presses the peripheral edge of the die 3a of the semiconductor element 3 on the inside of the thermocompression bonding part 1a. 1. A thermocompression bonding tool for a tape carrier element, characterized in that a pressing elastic member 1b made of a poor thermal conductor having a protrusion is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6452689U JPH033742U (en) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6452689U JPH033742U (en) | 1989-06-01 | 1989-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033742U true JPH033742U (en) | 1991-01-16 |
Family
ID=31595553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6452689U Pending JPH033742U (en) | 1989-06-01 | 1989-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033742U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54137411U (en) * | 1978-03-15 | 1979-09-22 |
-
1989
- 1989-06-01 JP JP6452689U patent/JPH033742U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54137411U (en) * | 1978-03-15 | 1979-09-22 |
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