JPH0428441U - - Google Patents
Info
- Publication number
- JPH0428441U JPH0428441U JP6907590U JP6907590U JPH0428441U JP H0428441 U JPH0428441 U JP H0428441U JP 6907590 U JP6907590 U JP 6907590U JP 6907590 U JP6907590 U JP 6907590U JP H0428441 U JPH0428441 U JP H0428441U
- Authority
- JP
- Japan
- Prior art keywords
- bump
- bonding
- protrusion
- semiconductor element
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係るバンプ接合装置の一実施
例を示す図、第２図は中空状構造のバンプを形成
する方法を説明する図、第３図は従来のバンプ接
合装置を示す図である。
１……インナーリード、２……フイルム、３…
…バンプ、３ａ……凸部、３ｂ……凹部、４……
ダイス、５……穴、６……ポンチ、７……半導体
素子、８……絶縁酸化膜、９……電極部、１１…
…ボンデイングツール、１１ａ……押圧面、１１
ｂ……突起。
FIG. 1 is a diagram showing an embodiment of the bump bonding device according to the present invention, FIG. 2 is a diagram illustrating a method for forming a bump having a hollow structure, and FIG. 3 is a diagram showing a conventional bump bonding device. be. 1...Inner lead, 2...Film, 3...
...Bump, 3a...Protrusion, 3b...Concave, 4...
Dice, 5... Hole, 6... Punch, 7... Semiconductor element, 8... Insulating oxide film, 9... Electrode portion, 11...
...Bonding tool, 11a...Press surface, 11
b... Protrusion.
Claims (1)
ヤリアのインナーリード先端部近傍に形成された
ドーム状構造のバンプを半導体素子の電極部に熱
圧着法により接合するバンプ接合装置であつて、 ボンデイングツールは、バンプの背面を押圧し
てバンプに形成された凸部を半導体素子の電極部
に熱圧着させるものであり、その押圧面に突起を
有し、 突起は、バンプの背面に形成された凹部内に嵌
入して、バンプ押圧時に生ずる凹部内へのバンプ
の変形を阻止するものであることを特徴とするバ
ンプ接合装置。[Scope of Claim for Utility Model Registration] A bump bonding device that has a bonding tool and bonds a dome-shaped bump formed near the tip of an inner lead of a TAB tape carrier to an electrode portion of a semiconductor element by thermocompression bonding. The bonding tool presses the back surface of the bump to thermocompress the convex portion formed on the bump to the electrode portion of the semiconductor element, and has a protrusion on its pressing surface, and the protrusion is attached to the back surface of the bump. 1. A bump bonding device that fits into a recess formed in the bump to prevent deformation of the bump into the recess that occurs when the bump is pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6907590U JPH0428441U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6907590U JPH0428441U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428441U true JPH0428441U (en) | 1992-03-06 |
Family
ID=31604067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6907590U Pending JPH0428441U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428441U (en) |
-
1990
- 1990-06-29 JP JP6907590U patent/JPH0428441U/ja active Pending