JPH0337880B2 - - Google Patents
Info
- Publication number
- JPH0337880B2 JPH0337880B2 JP59186966A JP18696684A JPH0337880B2 JP H0337880 B2 JPH0337880 B2 JP H0337880B2 JP 59186966 A JP59186966 A JP 59186966A JP 18696684 A JP18696684 A JP 18696684A JP H0337880 B2 JPH0337880 B2 JP H0337880B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- sintered body
- shielding material
- electromagnetic wave
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主としてコンピユーター機器から発生
する低周波ノイズの吸収特性を有する炭化珪素焼
結体から構成される筐体形態の電磁波シールド材
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electromagnetic shielding material in the form of a casing made of a silicon carbide sintered body having characteristics of absorbing low frequency noise mainly generated from computer equipment.
C−MOSなどのIC半導体を搭載したコンピユ
ーター機器から発生するノイズは、1〜500MHz
程度といわれており、なかでもパーソナルコンピ
ユーターは30〜200MHzの低周波領域のノイズを
多く発生することが知られているが、本発明はこ
れらの電子部品等のシールド効果を有する炭化珪
素質焼結体から構成される筐体の電磁波シールド
材を提供するものである。 Noise generated from computer equipment equipped with IC semiconductors such as C-MOS is 1 to 500MHz.
Personal computers are known to generate a lot of noise in the low frequency range of 30 to 200 MHz, but the present invention uses sintered silicon carbide that has the effect of shielding these electronic components. The present invention provides an electromagnetic wave shielding material for a casing made of a body.
従来、電磁波シールド材としては、例えば(イ)特
開昭58−66399号公報、(ロ)特開昭58−66400号公報
及び(ハ)特開昭58−49665及び(ニ)特開昭59−27596号
公報に開示されている。
Conventionally, as electromagnetic shielding materials, for example, (a) JP-A-58-66399, (b) JP-A-58-66400, (c) JP-A-58-49665, and (d) JP-A-59. -Disclosed in Publication No. 27596.
前記(イ)は、炭素珪素を主成分とする中間層又は
炭化珪素と炭素とを主成分とする中間層を有し、
表層及び裏層が合成樹脂層であることを特徴とす
るシールド用シート材に関するものである。 The above (a) has an intermediate layer mainly composed of carbon silicon or an intermediate layer mainly composed of silicon carbide and carbon,
The present invention relates to a shielding sheet material characterized in that the front layer and the back layer are synthetic resin layers.
前記(ロ)は、炭化珪素粉末を主成分とするシール
ド層又は炭化珪素粉末と炭素粉末とが主として混
在するシールド層を有する筐体に関するものであ
る。 The above (b) relates to a casing having a shield layer mainly composed of silicon carbide powder or a shield layer mainly composed of a mixture of silicon carbide powder and carbon powder.
また前記(ハ)は、70重量%以上の炭化珪素を含有
してなる誘電加熱用セラミツク体に関するもので
ある。 Moreover, the above (c) relates to a dielectric heating ceramic body containing 70% by weight or more of silicon carbide.
そして前記(ニ)は、比抵抗1オーム・cm以上を有
する緻密質炭化珪素よりなることを特徴とするマ
イクロ波吸収体に関するものである。 The above item (d) relates to a microwave absorber characterized by being made of dense silicon carbide having a resistivity of 1 ohm·cm or more.
前記(イ)及び(ロ)の従来技術は、炭化珪素の半導体
としての性質、また機械的には高強度でかつ硬質
であり、電気的には電磁波吸収特性のある特徴を
利用しているが、前記シート材又は筐体には合成
樹脂が多量に使用されているため熱伝導性が低く
半導体等の電子部品に蓄熱する熱を容易に放散す
ることができず半導体などの故障の原因となり、
また耐摩耗性や機械的強度もセラミツクや金属に
比べて劣るため耐久性に乏しい欠点がある。
The conventional technologies (a) and (b) above utilize silicon carbide's properties as a semiconductor, mechanically having high strength and hardness, and electrically having electromagnetic wave absorption properties. Since the sheet material or the housing uses a large amount of synthetic resin, it has low thermal conductivity and cannot easily dissipate the heat accumulated in electronic components such as semiconductors, which may cause failure of semiconductors, etc.
Furthermore, it has the disadvantage of poor durability because its wear resistance and mechanical strength are inferior to ceramics and metals.
一方前記(ハ)及び(ニ)の従来技術は、炭化珪素焼結
体から成る誘電加熱用セラミツク体であるため熱
伝導率、曲げ強度が大きく、さらには熱膨張係数
が小さいので、耐熱衝撃性がきわめて大きく急加
熱、急冷却に対してもクラツクが発生するおそれ
がない特徴を利用しているが、使用目的が誘電加
熱用又は高周波の吸収体に関するものであり、例
えば家庭等で使用される調理用電子レンジで発振
周波数が2450MHz以上の高周波領域で主として使
用される炭化珪素質焼結体、すなわち炭化珪素を
主成分とするセラミツク焼結体であつて、炭化珪
素の含有率を種々異にして誘導加熱される場合の
発熱効率(熱変換効率)を変化させることを特徴
とするものである。 On the other hand, in the prior art (c) and (d) above, since the dielectric heating ceramic body is made of a silicon carbide sintered body, it has high thermal conductivity and bending strength, and also has a small coefficient of thermal expansion, so it has good thermal shock resistance. It takes advantage of the fact that it has a very large resistance to cracks even when rapidly heated or cooled, but it is used for dielectric heating or as a high-frequency absorber, and is used, for example, in homes. Silicon carbide sintered bodies are mainly used in high-frequency ranges with oscillation frequencies of 2450 MHz or higher in cooking microwave ovens, that is, ceramic sintered bodies whose main component is silicon carbide, with various silicon carbide contents. It is characterized by changing the heat generation efficiency (heat conversion efficiency) when induction heating is performed.
本発明は前記従来技術(イ)及び(ロ)の欠点を解消
し、さらに従来技術(ハ)及び(ニ)では解決されていな
い低周波領域における電磁波吸収特性を高め、特
に1〜500MHzのコンピユーターICから発生する
ノイズのシールド効果を向上させることを主目的
とし、前記特許請求の範囲記載の電磁波シールド
材を提供することによつて、前記目的を達成する
ものである。 The present invention eliminates the drawbacks of the prior art (a) and (b), and further improves the electromagnetic wave absorption characteristics in the low frequency region that have not been solved by the prior art (c) and (d), and particularly improves the electromagnetic wave absorption characteristics in the low frequency range, The main purpose of the present invention is to improve the shielding effect of noise generated from an IC, and this purpose is achieved by providing the electromagnetic wave shielding material described in the claims.
以下、本発明の電磁波シールド材を炭化珪素質
焼結体の特性並びにその特性を表示するグラフ図
面に基づいて具体的に説明する。
Hereinafter, the electromagnetic shielding material of the present invention will be specifically explained based on the characteristics of the silicon carbide sintered body and graphs showing the characteristics.
第1図は、炭化珪素質焼結体からなる本発明の
電磁波シールド材イの周波特性と比較例である導
電性塗料ロ又はプラスチツク成形品ハから成る電
磁波シールド材の周波特性を示すグラフである。
第1図から明らかなように本発明の電磁波シール
ド材イは特に低周波領域である1〜500MHzにお
いて吸収特性がよく、特に10〜100MHzでは40dB
以上の電磁波吸収特性を示していることが判る。
その理由としては、本発明のシールド材はSi−C
結合のボンドで吸収される電磁波が1〜500MHz
であると考えられ、特に10〜100MHzの領域であ
り、さらにβ型結晶を主体として構成されてお
り、特にβ型結晶が65重量%以上含有されている
ことから、従来技術(ハ)及び(ニ)の炭化珪素焼結体と
は異なり、例えば結晶の短軸と長軸との比である
アスペクト比が嵩密度との関連で任意に変更し得
るからであると考えられる。このことは、第2図
に示す本発明の炭化珪素質焼結体のシールドにお
いて、比較的高密度である理論密度95%TDの焼
結体Aと比較的低密度である理論密度86%TDの
焼結体Bとの周波特性が相違することとも関連す
る。それは、β型結晶が65重量%以上含有される
炭化珪素質焼結体にあつては、嵩密度が小さくな
ればアスペクト比は大きくなる性質を有するから
であると考えられる。 FIG. 1 is a graph showing the frequency characteristics of the electromagnetic shielding material A of the present invention made of a silicon carbide sintered body and the frequency characteristics of the electromagnetic shielding material made of a conductive paint A or a plastic molded product C as a comparative example. .
As is clear from Figure 1, the electromagnetic shielding material A of the present invention has particularly good absorption characteristics in the low frequency range of 1 to 500 MHz, and in particular, in the 10 to 100 MHz range, the absorption characteristics are 40 dB.
It can be seen that the above electromagnetic wave absorption characteristics are exhibited.
The reason for this is that the shielding material of the present invention is Si-C
The electromagnetic waves absorbed by the bond are 1 to 500 MHz.
It is thought that the frequency range is from 10 to 100 MHz, and it is mainly composed of β-type crystals, especially since it contains 65% by weight or more of β-type crystals. This is thought to be because, unlike the silicon carbide sintered body (d), the aspect ratio, which is the ratio of the short axis to the long axis of the crystal, can be changed arbitrarily in relation to the bulk density. This means that in the shield of the silicon carbide sintered body of the present invention shown in FIG. This is also related to the fact that the frequency characteristics of the sintered body B are different from those of the sintered body B. This is thought to be because a silicon carbide sintered body containing 65% by weight or more of β-type crystals has a property that the aspect ratio increases as the bulk density decreases.
したがつて、本発明によれば炭化珪素質焼結体
は少くともβ型結晶を少なくとも65重量%以上、
特に好ましくは80重量%以上含有していることが
好適である。そして、本発明のシールド材は、理
論密度が20〜95%TDであつて多孔質のものから
高密度の緻密質のものまで広範囲の嵩比度の炭化
珪素質焼結体であつて、熱伝導率が高いものであ
る。その理由は、本発明のシールド材は第1図で
示したような低周波領域において特に優れた電磁
波吸収特性を有する炭化珪素を主成分とするセラ
ミツクス焼結体により構成された筐体であるた
め、ノイズの発生源であるC−MOSなどのIC半
導体を筐体で被覆しておくことにより、半導体か
ら発生する熱を効率よく放散することができると
共に電磁波吸収特性によつて電磁波のシールド効
果をより完全なものとすることができるからであ
る。 Therefore, according to the present invention, the silicon carbide sintered body contains at least 65% by weight of β-type crystals.
Particularly preferably, the content is 80% by weight or more. The shielding material of the present invention is a silicon carbide sintered body with a theoretical density of 20 to 95% TD and a wide range of bulk ratios from porous to dense dense. It has high conductivity. This is because the shielding material of the present invention has a housing made of a ceramic sintered body mainly composed of silicon carbide, which has particularly excellent electromagnetic wave absorption characteristics in the low frequency range as shown in FIG. By covering an IC semiconductor such as C-MOS, which is a source of noise, with a housing, the heat generated from the semiconductor can be efficiently dissipated, and the electromagnetic wave shielding effect can be improved by the electromagnetic wave absorption property. This is because it can be made more complete.
なお、本発明のシールド材は特に10〜100MHz
の如き低周波領域において優れた電磁波吸収特性
を有するものであるが、第1図に示した比較例と
しての導電性塗料ロ又は導電性プラスチツク成形
品ハの如き200MHz以上の比較的高い周波数の領
域においても電磁波吸収特性を有するシールド材
との組み合せによる筐体を形成することにより比
較的高周波領域における電磁波シールド材として
もその応用範囲を拡大することができる。また、
前記導電塗料ロ又は導電性プラスチツク形成品ハ
の中に電磁波吸収特性の優れた炭化珪素微粉末を
充填材として混入した電磁波シールド材と本発明
の炭化珪素質焼結体のシールド材との組み合せか
らなる筐体を形成することもできる。 In addition, the shielding material of the present invention is particularly suitable for 10 to 100 MHz.
It has excellent electromagnetic wave absorption characteristics in the low frequency range such as, but it has excellent electromagnetic wave absorption characteristics in the low frequency range such as the comparative example shown in Fig. By forming a casing in combination with a shielding material having electromagnetic wave absorption characteristics, the range of application can be expanded as an electromagnetic wave shielding material in a relatively high frequency range. Also,
A combination of an electromagnetic wave shielding material in which silicon carbide fine powder with excellent electromagnetic wave absorption characteristics is mixed as a filler into the conductive paint (B) or conductive plastic molded article (C) and the shielding material of the silicon carbide sintered body of the present invention. It is also possible to form a casing.
次に本発明の最も代表的な実施例について説明
する。 Next, the most typical embodiment of the present invention will be described.
実施例 1
出発原料として特開昭52−142697号に開示され
た主としてβ型結晶よりなる炭化珪素微粉を94重
量%含有する生成形体を焼成し、理論密度97%
TDの炭化珪素質焼結体を得た。この焼結体の平
均アスペクト比は短軸1に対し長軸が11のもの
であつた。そしてこの焼結体を板厚4mmの板状物
に加工し、150mm×45mmと45mm×60mmの板状物を
それぞれ使用して筐体を形成し、C−MOSのIC
のシールド材に供した。その周波特性の結果は、
第2図のAに示す通りのものであつた。Example 1 A formed body containing 94% by weight of silicon carbide fine powder mainly consisting of β-type crystals disclosed in JP-A No. 52-142697 as a starting material was fired to achieve a theoretical density of 97%.
A TD silicon carbide sintered body was obtained. The average aspect ratio of this sintered body was 1 for the minor axis to 11 for the major axis. Then, this sintered body was processed into a plate with a thickness of 4 mm, and a casing was formed using the plates of 150 mm x 45 mm and 45 mm x 60 mm, respectively, and the C-MOS IC
It was used as a shielding material. The result of its frequency characteristics is
It was as shown in A of FIG.
実施例 2
出発原料は実施例1と同様のβ型結晶よりなる
炭化珪素微粉末を85重量%含有する生成形体を焼
成し、理論密度86%TDの炭化珪素質焼結体を得
た。この焼結体の平均アスペクト比は短軸1に対
し長軸が29のものであつた。Example 2 A green body containing 85% by weight of silicon carbide fine powder consisting of the same β-type crystal as in Example 1 as a starting material was fired to obtain a silicon carbide sintered body having a theoretical density of 86% TD. The average aspect ratio of this sintered body was 1 for the minor axis and 29 for the major axis.
そしてこの焼結体を実施例1と同様に加工して
筐体を形成し、C−MOSのICのシールド材に供
した。その周波特性の結果は、第2図のBに示す
通りのものであつた。 This sintered body was then processed in the same manner as in Example 1 to form a housing, which was used as a shielding material for a C-MOS IC. The results of the frequency characteristics were as shown in B of FIG.
以上のように、本発明によれば特に1〜500M
Hzの如き低周波領域において優れた電磁波吸収特
性と熱放散性を有するシールド材を提供すること
ができ、さらには一定の密度範囲の炭化珪素質焼
結体とすることにより電磁波の反射特性も付与
し、さらにまた比較的高周波領域においても優れ
た電磁波吸収特性を有する導電性プラスチツク又
は金属などを多孔質の炭化珪素質焼結体に含浸さ
せることなどにより、低周波に限定されることな
く広範囲のノイズのシールド効果を向上させるこ
とができる。
As described above, according to the present invention, especially 1 to 500M
We can provide a shielding material that has excellent electromagnetic wave absorption characteristics and heat dissipation properties in the low frequency range such as Hz, and also has electromagnetic wave reflection characteristics by making it a silicon carbide sintered body with a certain density range. Furthermore, by impregnating a porous silicon carbide sintered body with conductive plastics or metals that have excellent electromagnetic wave absorption characteristics even in relatively high frequency ranges, it can be applied to a wide range of frequencies without being limited to low frequencies. The noise shielding effect can be improved.
第1図は本発明のシールド材イと比較例の導電
性塗料ロ又はプラスチツク成形品ハのシールド材
の周波特性を示すグラフ、第2図は本発明の高密
度炭化珪素焼結体Aと低密度炭化珪素焼結体Bと
の周波特性を示すグラフである。
Fig. 1 is a graph showing the frequency characteristics of the shielding material A of the present invention and the shielding material of the conductive paint B or plastic molded product C of the comparative example. It is a graph showing frequency characteristics with density silicon carbide sintered compact B.
Claims (1)
のアスペクト比が2〜50であり、理論密度が20〜
95%TDである炭化珪素質焼結体により構成され
てなることを特徴とする主として1〜500MHzの
低周波領域における電磁波吸収特性に優れた電磁
波シールド材。1 Contains at least 65% by weight of β-type crystals, has an aspect ratio of 2 to 50, and has a theoretical density of 20 to 50.
An electromagnetic shielding material having excellent electromagnetic wave absorption properties mainly in the low frequency range of 1 to 500 MHz, characterized by being composed of a silicon carbide sintered body having a TD of 95%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59186966A JPS6165499A (en) | 1984-09-06 | 1984-09-06 | Electromagnetic wave shielding material of silicon carbide sintered material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59186966A JPS6165499A (en) | 1984-09-06 | 1984-09-06 | Electromagnetic wave shielding material of silicon carbide sintered material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6165499A JPS6165499A (en) | 1986-04-04 |
| JPH0337880B2 true JPH0337880B2 (en) | 1991-06-06 |
Family
ID=16197841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59186966A Granted JPS6165499A (en) | 1984-09-06 | 1984-09-06 | Electromagnetic wave shielding material of silicon carbide sintered material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165499A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01163994A (en) * | 1987-12-21 | 1989-06-28 | Yoshiyuki Naito | Interference wave absorber for line |
| JPH0797612B2 (en) * | 1989-12-26 | 1995-10-18 | 三菱マテリアル株式会社 | Ceramics package |
| FR2668145B1 (en) * | 1990-10-17 | 1993-01-22 | Ceramiques Composites | SINTERED BODY IN SILICON CARBIDE, PARTICULARLY FOR MECHANICAL SEALING AND SEALING COMPRISING SUCH A SINTERED BODY. |
| WO1993025495A1 (en) * | 1992-06-12 | 1993-12-23 | The Carborundum Company | Porous silicon carbide |
| CN112266252A (en) * | 2020-11-04 | 2021-01-26 | 黑龙江冠瓷科技有限公司 | Preparation method of pressureless sintering micro-nano mixed silicon carbide granulation powder |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5864706A (en) * | 1981-10-15 | 1983-04-18 | パイオニア株式会社 | Wire coating material |
| JPS60260197A (en) * | 1984-06-07 | 1985-12-23 | 島田理化工業株式会社 | Microwave absorber |
-
1984
- 1984-09-06 JP JP59186966A patent/JPS6165499A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6165499A (en) | 1986-04-04 |
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