JPH0338894A - Attaching structure for lead pin - Google Patents

Attaching structure for lead pin

Info

Publication number
JPH0338894A
JPH0338894A JP17520389A JP17520389A JPH0338894A JP H0338894 A JPH0338894 A JP H0338894A JP 17520389 A JP17520389 A JP 17520389A JP 17520389 A JP17520389 A JP 17520389A JP H0338894 A JPH0338894 A JP H0338894A
Authority
JP
Japan
Prior art keywords
pga
board
lead pin
lead
attacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17520389A
Other languages
Japanese (ja)
Inventor
Masaru Kubota
勝 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Platforms Ltd
Original Assignee
NEC AccessTechnica Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC AccessTechnica Ltd filed Critical NEC AccessTechnica Ltd
Priority to JP17520389A priority Critical patent/JPH0338894A/en
Publication of JPH0338894A publication Critical patent/JPH0338894A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent occurrence of a tilt in fitting of PGA and thereby to attain shortening of the time for a process and reduction of the cost by forming a bent part for attacking a lead pin, in a state of pressure contact, in a fitting hole of a board. CONSTITUTION:When each lead pin of PGA(pin grid array) 1 is inserted into a attacking hole of a board, a lead pin 2a inserted into a attacking hole 3a of a board 3 is fitted therein in such a state that a bent part thereof is in pressure contact with the inner wall of the fitting hole 3a. Since lead pins 2a to 2d are fitted in attacking holes in the state of pressure contact in this way and moreover the directions of pressure contact thereof are opposite to each other, the PGA 1 is already held vertically to the board 3 and reliably in the stage of insertion of the lead pins. Accordingly, no tilt occurs in the PGA 1 even if a jet stream wave strikes the lead pins on the occasion of soldering by means of a jet-type solder bath. Thus, shortening of the time for a manufacture process and reduction of the manufacturing cost can be attained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、リードピンの取付構造に関し、特に基板の取
付用孔に挿入し、両者を電気的に接続するり一ドピンの
取付構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead pin mounting structure, and more particularly to a lead pin mounting structure that is inserted into a mounting hole of a substrate and electrically connects the two.

〔従来の技術〕[Conventional technology]

従来、この種のｌ”ＧＡＩ（ピングリッドアレイ）のり
−トビンは、第３図に示すような直線のり−トピン２１
〜２４であった。Conventionally, this type of l''GAI (pin grid array) glue bin has a straight glue pin 21 as shown in FIG.
It was ~24.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のＰＧＡのリードピンを基板の取付用孔に
挿入する場合、リードビンと取イ１用孔との間に隙間が
生じ接触不良によってＰＧＡの動作が不安定な状態とな
る。また、この状態で基板を傾斜させた場合ＰＧＡが基
板からはずれてしまう恐れがあるという欠点がある。When the lead pins of the conventional PGA described above are inserted into the mounting holes of the board, a gap is created between the lead pin and the hole for takeout 1, resulting in poor contact and unstable operation of the PGA. Furthermore, if the substrate is tilted in this state, there is a drawback that the PGA may come off from the substrate.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のリードピンの取付構造は、電子部品のリードビ
ンを基板の取付用孔に挿入し電気的に接続する取付構造
において、前記取付用孔に圧接状態で嵌合する屈曲部を
前記リードビンに形成する。The lead pin mounting structure of the present invention is a mounting structure in which a lead pin of an electronic component is inserted into a mounting hole of a board and electrically connected, and the lead pin is formed with a bent portion that fits into the mounting hole in a press-contact state. .

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。第１−
図は本発明の一実施例の斜視図である。Next, the present invention will be explained with reference to the drawings. 1st-
The figure is a perspective view of one embodiment of the present invention.

第１において１はＰ　Ｇ　Ａ　（ビングリッドアレイ）
で針形の４本のリードピン２ａ、２ｂ、２ｃ。In the first, 1 is PGA (bin grid array)
and four needle-shaped lead pins 2a, 2b, and 2c.

２ｄが各コーナーに導出している。これらのり一ドビン
のうち、互いに向き合う２ａ、２ｂ及び２ｃ、２ｄにつ
いては、中途部をくの字形に屈曲しており、その屈曲方
向は互いに反対となるようにしている。ＰＧＡ　（ピン
グリッドアレイ）１の各リードピンを基板の取付用孔に
挿入すると第２図のようになる。すなわち、基板３の取
付用孔３ａな挿入されたリードピン２ａは、その屈曲部
が取付用孔３ａの内壁に圧接状態で嵌合する。このよう
に、リードピン２ａ、２ｂ及び２ｃ、２ｄが取付用孔に
圧接状態で嵌合し、しかもその圧接方向は、互いに反対
なのでＰＧＡ（ビングリッドアレイ）１は、リードピン
の挿入段階で既に基板３に垂直かつ確実に保持される。2d is derived at each corner. Of these glue dowels, 2a, 2b, 2c, and 2d facing each other are bent in the middle in a dogleg shape, and the bending directions are opposite to each other. When each lead pin of the PGA (pin grid array) 1 is inserted into the mounting hole of the board, the result will be as shown in Fig. 2. That is, the lead pin 2a inserted into the mounting hole 3a of the board 3 fits into the inner wall of the mounting hole 3a with its bent portion in pressure contact. In this way, the lead pins 2a, 2b, 2c, and 2d are fitted into the mounting holes in a press-contact state, and the press-contact directions are opposite to each other. is held vertically and securely.

このようにすると、噴流式半田槽による半田付けに際し
、噴流波がリードピンに当たっても、ＰＧＡ　（ピング
リッドアレイ）１に傾きが生じることはない。したがっ
て、実装後の検査工程に際し、半田吸収器や半田ゴテに
よる手直し作業が不要となり、作業員にかかる負担を軽
減することができる。それに伴い、製造工程にかかる時
間の短縮及び製造コストの低減が図れる。In this way, even if the jet waves hit the lead pins during soldering using the jet solder bath, the PGA (pin grid array) 1 will not be tilted. Therefore, during the inspection process after mounting, there is no need for rework using a solder absorber or a soldering iron, and the burden on workers can be reduced. Accordingly, the time required for the manufacturing process and the manufacturing cost can be reduced.

〔発明の効果〕 以上説明したように本発明は、リードピンを基板の取付
用孔に圧接状態で嵌合する屈曲部を形成したので、ＰＧ
Ａの取付けに傾きを生じることがなく、これによりＰＧ
Ａの動作不良を未然に防ぐことができ、しかも手直し作
業を不要として、製造工程にかかる時間の短縮及び製造
コストの低減などを図ることができるという効果がある
。[Effects of the Invention] As explained above, the present invention has a bent portion that fits the lead pin into the mounting hole of the board in a press-contact state, so that the PG
There is no inclination when installing A, and this allows the PG
This has the effect of being able to prevent malfunctions of A, and also eliminating the need for rework, thereby shortening the time required for the manufacturing process and reducing manufacturing costs.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の斜視図、第２図は本実施例
のリードピンと取付用孔との関係を示す断面図、第３図
は従来のリードピンの取付構造の一例を示す斜視図であ
る。 １・・・ＰＧＡ　（ビングリッドアレイ）、２ａ。 ２ｂ、２ｃ、２ｄ−・−リードピン、３・・・基板、３
ａ・・・取付用孔。FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view showing the relationship between the lead pin and the mounting hole of this embodiment, and FIG. 3 is a perspective view showing an example of a conventional lead pin mounting structure. It is a diagram. 1...PGA (bin grid array), 2a. 2b, 2c, 2d--Lead pin, 3... Board, 3
a...Mounting hole.

Claims (1)

【特許請求の範囲】[Claims] 　電子部品のリードピンを基板の取付用孔に挿入し電気
的に接続する取付構造において、前記取付用孔に圧接状
態で嵌合する屈曲部を前記リードピンに形成することを
特徴とするリードピンの取付構造。A lead pin mounting structure in which a lead pin of an electronic component is inserted into a mounting hole of a board and electrically connected, characterized in that the lead pin is formed with a bent portion that fits into the mounting hole in a press-contact state. .
JP17520389A 1989-07-05 1989-07-05 Attaching structure for lead pin Pending JPH0338894A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17520389A JPH0338894A (en) 1989-07-05 1989-07-05 Attaching structure for lead pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17520389A JPH0338894A (en) 1989-07-05 1989-07-05 Attaching structure for lead pin

Publications (1)

Publication Number Publication Date
JPH0338894A true JPH0338894A (en) 1991-02-19

Family

ID=15992098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17520389A Pending JPH0338894A (en) 1989-07-05 1989-07-05 Attaching structure for lead pin

Country Status (1)

Country Link
JP (1) JPH0338894A (en)

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