JPH0339842U - - Google Patents

Info

Publication number
JPH0339842U
JPH0339842U JP1989099888U JP9988889U JPH0339842U JP H0339842 U JPH0339842 U JP H0339842U JP 1989099888 U JP1989099888 U JP 1989099888U JP 9988889 U JP9988889 U JP 9988889U JP H0339842 U JPH0339842 U JP H0339842U
Authority
JP
Japan
Prior art keywords
insulating substrate
wiring board
printed wiring
push
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989099888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989099888U priority Critical patent/JPH0339842U/ja
Publication of JPH0339842U publication Critical patent/JPH0339842U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989099888U 1989-08-29 1989-08-29 Pending JPH0339842U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989099888U JPH0339842U (cs) 1989-08-29 1989-08-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989099888U JPH0339842U (cs) 1989-08-29 1989-08-29

Publications (1)

Publication Number Publication Date
JPH0339842U true JPH0339842U (cs) 1991-04-17

Family

ID=31648920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989099888U Pending JPH0339842U (cs) 1989-08-29 1989-08-29

Country Status (1)

Country Link
JP (1) JPH0339842U (cs)

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