JPH0339856U - - Google Patents
Info
- Publication number
- JPH0339856U JPH0339856U JP10052689U JP10052689U JPH0339856U JP H0339856 U JPH0339856 U JP H0339856U JP 10052689 U JP10052689 U JP 10052689U JP 10052689 U JP10052689 U JP 10052689U JP H0339856 U JPH0339856 U JP H0339856U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- directions
- protruding
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す説明図、第２
図は第１図に示す実施例の組立てに用いるリード
フレームのパターンの一例を示す平面図、第３図
はａ，ｂは従来のフラツトパツケージタイプの半
導体装置の一例を示す平面図である。
１……ダイアイランド、２……リード、３……
ペレツト、４……金線、５……樹脂モールドフラ
ツトパツケージ。なお図中同一符号は同一または
相当する部分を示す。
Fig. 1 is an explanatory diagram showing one embodiment of the present invention;
This figure is a plan view showing an example of a pattern of a lead frame used in assembling the embodiment shown in FIG. 1, and FIG. 3 is a plan view showing an example of a conventional flat package type semiconductor device. 1...Dai Island, 2...Lead, 3...
Pellet, 4...Gold wire, 5...Resin mold flat package. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
て、それぞれがダイアイランドの周りから放射線
状に延びパツケージ周辺の側面から四方に突き出
た複数のリードを備え、パツケージ周辺の側面か
ら四方に突き出た上記複数のリードの先端が連な
ると正方形か長方形かあるいはその他の多角形を
形成するように揃えられたことを特徴とする半導
体装置。 A flat package type semiconductor device includes a plurality of leads each extending radially from around the die island and protruding in all directions from the side surface around the package, and the tips of the plurality of leads protruding in all directions from the side surface around the package. A semiconductor device characterized in that these are arranged so as to form a square, rectangle, or other polygon when connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10052689U JPH0339856U (en) | 1989-08-30 | 1989-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10052689U JPH0339856U (en) | 1989-08-30 | 1989-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339856U true JPH0339856U (en) | 1991-04-17 |
Family
ID=31649532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10052689U Pending JPH0339856U (en) | 1989-08-30 | 1989-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339856U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008017637A (en) * | 2006-07-06 | 2008-01-24 | Yazaki Corp | Grommet and grommet band tightening structure |
-
1989
- 1989-08-30 JP JP10052689U patent/JPH0339856U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008017637A (en) * | 2006-07-06 | 2008-01-24 | Yazaki Corp | Grommet and grommet band tightening structure |