JPH034032Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] This invention forms a common wiring pattern that connects the terminals of multiple components on the surface of a carrier tape on which electrical components are arranged and transferred. This allows voltage to be applied on the carrier tape to electrical components connected and fixed to the wiring pattern, thereby increasing the efficiency of manufacturing processes such as burn-in.

[Industrial Application Field] The present invention relates to a carrier tape (or mounting film) for electrical components.

In recent years, burn-in processes have become extremely important in the manufacturing process of electrical components in order to improve the reliability of mass-produced electrical components.

On the other hand, as a way to store these electrical components,
Conventionally, there is a method of winding and storing electrical components on carrier tape using automated equipment, etc., and this method covers a wide variety of electrical components and is used in resistors, capacitors, semiconductor devices, and other mass-produced components.

This method of storing electrical components in a carrier tape is carried out by automated equipment, and the sequential mounting of electrical components onto a printed circuit board or the like is also carried out by an automated machine, resulting in a large labor-saving effect.

In this invention, a common wiring pattern is formed on the surface of the carrier tape that connects the terminals of multiple components, and voltage is applied to multiple electrical components simultaneously to perform burn-in of the electrical components on the surface of the carrier tape. This is what I did.

[Prior Art] Conventionally, when performing burn-in of electrical components such as semiconductor devices, dedicated sockets corresponding to the number of semiconductor devices to be burn-in are prepared, and
A semiconductor device is inserted into the socket and burn-in is performed under predetermined environmental and electrical conditions.

Additionally, there is a conventional method for automatically winding up and storing electrical components using carrier tape, which generally involves attaching the electrical components to the surface of the carrier tape and winding it up in a spiral. Conventional carrier tape patterns are separated for each individual electrical component, and there is no carrier tape that has a common pattern that connects multiple components.

[Problems to be solved by the invention] Conventionally, it is inefficient to provide a contact for each terminal of each electrical component, and electrical signals (voltage, etc.)
The problem is that the fixture for applying is also more complex.

[Means for Solving the Problems] The present invention provides a carrier tape for parts that solves the above problems. A predetermined common wiring pattern is formed on the surface, and the wiring pattern is provided with connection patterns between predetermined lead terminals of electrical components, external signal application pads, etc., and during operation, the carrier tape surface The burn-in of a plurality of electrical components is performed by applying a voltage to a common wiring pattern.

[Function] The present invention improves the carrier tape by forming a common wiring pattern on the carrier tape of electrical components.
Burn-in is performed after electrical components are housed with connected terminals on the board, and as a result, multiple electrical components can be burn-in with fewer signal application contacts.
It is designed to improve the efficiency of the manufacturing process.

[Example] FIG. 1 is a schematic perspective view of a carrier tape for an electrical component of the present invention.

The embodiment shows a case in which several to several dozen semiconductor devices are connected and arranged with terminals on the surface of a carrier tape.

The carrier tape 11 on which the semiconductor device 1 is mounted is in the form of a film, and its material is generally paper or synthetic resin, and the thickness is about 0.1 mm to 0.2 mm, the width is about 35 mm to 70 mm, and the material is about 0.1 mm to 0.2 mm, and the width is about 35 mm to 70 mm. - Considering heat resistance depending on the in-line conditions, the minimum heat-resistant temperature is
Heat resistance of 150°C is required, and polyimide or the like can be used as an optimal material for such a material. In the length direction of the carrier tape surface, the size is 7 mm x 7 mm to 12 mm x 12 depending on the type of semiconductor device.
A storage tape 12 corresponding to an approximation of about mm is provided, and tape feeding holes 13 are provided on both sides.

According to the present invention, copper is deposited or sputtered on the surface of the carrier tape as a wiring pattern.
A common wiring pattern 14 with a width of 1 mm is formed, and the wiring pattern includes a lead of a semiconductor device.
Connection pattern 15 with pad terminal, signal application pad 1
6 and 17 are provided.

FIG. 2 is a perspective view showing a state in which a semiconductor device is burn-in on the surface of a carrier tape according to an embodiment of the present invention. The power supply voltage is applied to the signal application pad 16 from the power supply connection terminal 18, and the signal application pad 17 is connected to the ground terminal 19.

The lead terminals of the semiconductor device and the patterns on the carrier tape may be connected by silver paste, soldering, or the like, or by pressing the joints.

In this manner, the manufacturing process is significantly streamlined by storing the semiconductor device as it is after being burned in on the carrier tape.

There is no particular limit to the length of the carrier tape, and the length can be determined as appropriate depending on the number of semiconductor devices and burn-in conditions.

[Effects of the invention] As explained in detail above, the carrier tape for electrical components of the present invention requires fewer external contacts because the electrical components have a common wiring pattern for dedicated burn-in. A great advantage is that a plurality of semiconductor devices can be burned in at the same time.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the main part of the carrier tape of the present invention, and FIG. 2 is a perspective view of the main part showing a state in which a semiconductor device is burn-in using the carrier tape of the present invention. 1 is a semiconductor device, 2 is a lead wire,
11 is carrier tape, 12 is storage tape, 13
is the tape feed hole, 14 is the common wiring pattern, 15
is a connection pattern, 16 and 17 are signal application pads,
Reference numeral 18 indicates a power supply connection terminal, and reference numeral 19 indicates a ground terminal.

Claims (1)

[Claims for Utility Model Registration] A group of common predetermined wiring patterns connecting the terminals of the plurality of parts on the surface of the carrier tape 11 on which the plurality of electrical parts 1 are successively pasted at predetermined intervals. 14, 16, and 17 are formed, and a predetermined lead terminal 2 of the electrical component is bonded to the wiring pattern on the surface of the carrier tape so that voltage can be applied to the plurality of components simultaneously. Carrier tape for electrical parts.