JPH034072Y2 - - Google Patents
Info
- Publication number
- JPH034072Y2 JPH034072Y2 JP1985085242U JP8524285U JPH034072Y2 JP H034072 Y2 JPH034072 Y2 JP H034072Y2 JP 1985085242 U JP1985085242 U JP 1985085242U JP 8524285 U JP8524285 U JP 8524285U JP H034072 Y2 JPH034072 Y2 JP H034072Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- printed circuit
- circuit board
- side walls
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
[産業上の利用分野]
本考案は、電気部品を配設したプリント基板を
入れるキヤビネツトの改良に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to an improvement of a cabinet in which a printed circuit board on which electrical components are arranged is housed.
[従来の技術]
従来、プリント基板に設ける部品には発熱する
部品もあり、部品の発熱により温度が上昇すると
性能の低下を招くため、発熱部品を集中して配置
しないように考慮しなければならず、部品の配置
に制約を受けるなどの不都合を生じた。[Prior art] Conventionally, some of the components installed on printed circuit boards generate heat, and if the temperature increases due to the heat generated by the components, performance will deteriorate, so consideration must be given to avoid placing heat-generating components in a concentrated manner. However, this resulted in inconveniences such as restrictions on the arrangement of parts.
このため、アルミニウム板上にプリント配線基
板を貼りあわせて熱の伝導を速め、熱放散を高め
ようとするものが、特開昭58−77300号公報に開
示され、また、キヤビネツトの側壁にフインを設
け、放熱面積を多くして熱の放散を促進して温度
を下げようとするものが実開昭60−49691号公報
に開示されている。 For this reason, Japanese Patent Laid-Open No. 77300/1983 discloses a method in which a printed wiring board is bonded onto an aluminum plate to speed up heat conduction and improve heat dissipation. Japanese Utility Model Application Laid-open No. 60-49691 discloses a system in which the temperature is lowered by increasing the heat dissipation area and promoting heat dissipation.
[考案が解決しようとする課題]
上記の冷却機構を備えた基板や電子装置は、キ
ヤビネツト内に空気流をおこすフアンを設けてい
るため、フアン自体の発生する熱量が問題とな
り、さらに、部品の発熱密度が高くなると熱放散
が間にあわず温度上昇が著しく、電気的特性を変
化させてしまう不都合が生じた。[Problems to be solved by the invention] Boards and electronic devices equipped with the above-mentioned cooling mechanism are equipped with a fan that generates airflow inside the cabinet, so the amount of heat generated by the fan itself becomes a problem. When the heat generation density becomes high, heat dissipation cannot be done in time, resulting in a significant temperature rise, resulting in a disadvantage that the electrical characteristics change.
そこで、本考案は上記諸点に鑑み、部品の性能
を変化させることなく効率よく冷却を行い、部品
の性能を劣化させることなく、かつ発電部品の配
置に制約を受けることがない電気装置用の冷却キ
ヤビネツトを提供するものである。 Therefore, in view of the above points, the present invention was developed to provide cooling for electrical equipment that efficiently cools the parts without changing their performance, does not deteriorate the performance of the parts, and is not subject to restrictions on the placement of power generation parts. It provides cabinets.
[問題を解決するための手段]
上記課題を解決するために本考案の電気装置用
冷却キヤビネツトは、キヤビネツト外壁に送風機
を配設し、2枚の金属板間を連結保持する波状の
金属製フインを備えた放熱板の2枚の金属板の間
隔を送風機側の間隔を狭く、他端を広く構成した
テーパ状放熱板により形成した両側壁と、両側壁
に平行して両側壁の中間に2枚の金属板の間隔を
両側壁とは反対に送風機配設側を広く他側を狭く
したテーパ状放熱板により形成した中央ダクトを
配設し、両側壁と中央ダクト間にプリント基板に
放熱板を重合貼着した放熱板付き多層プリント基
板を配設する。そして、送風機は中央ダクトの2
枚の金属板間に送風するようにキヤビネツト外壁
に配設し、放熱板付き多層プリント基板の放熱板
と両側壁との接続部分および放熱板付き多層プリ
ント基板の放熱板と中央ダクトとの接続部分を空
気が流通するように接続した構成を具備する。[Means for Solving the Problems] In order to solve the above problems, the cooling cabinet for electrical equipment of the present invention has a blower installed on the outer wall of the cabinet, and a corrugated metal fin that connects and holds two metal plates. Both side walls are formed by tapered heat sinks with the gap between the two metal plates of the heat sink having a narrower gap on the blower side and a wider gap on the other end, and two metal plates parallel to the both side walls in the middle of the both side walls. A central duct is formed by a tapered heat sink with the gap between two metal plates widened on the side where the blower is installed and narrowed on the other side opposite to the side walls, and a heat sink is attached to the printed circuit board between the side walls and the center duct. A multilayer printed circuit board with a heat dissipation plate that is polymerized and bonded is installed. And the blower is located in the central duct.
It is arranged on the outer wall of the cabinet so that air is blown between two metal plates, and the connection part between the heat sink of a multilayer printed circuit board with a heat sink and both side walls, and the connection part between the heat sink of the multilayer printed circuit board with a heat sink and the central duct. are connected so that air can flow through them.
[作用]
送風機で中央ダクト内に送り込まれた冷却風
は、送風方向先端が狭くなつているので、中央ダ
クトと両側壁間の放熱板付き多層プリント基板の
放熱板間にスムーズに流入する。冷却風は放熱板
付き多層プリント基板の放熱板を通過する途上、
取付けらている部品から発生する熱により温めら
れた金属板およびフインから熱を奪い、両側壁の
テーパ状放熱板を通つて排気される。この時、両
側壁のテーパ状放熱板は排気側の間隔が広くなつ
ているので、空気がスムーズに流下する。[Function] The cooling air sent into the central duct by the blower is narrowed at the tip in the air blowing direction, so it flows smoothly between the heat sinks of the multilayer printed circuit board with heat sinks between the center duct and both side walls. As the cooling air passes through the heat sink of the multilayer printed circuit board with heat sink,
The heat generated from the attached parts is removed from the heated metal plate and fins, and is exhausted through the tapered heat sinks on both side walls. At this time, since the gap between the tapered heat sinks on both side walls is wide on the exhaust side, air flows down smoothly.
[実施例]
以下、本考案の実施例を図面に基いて説明す
る。[Example] Hereinafter, an example of the present invention will be described based on the drawings.
第1図は本考案の電気装置用空冷キヤビネツト
の斜視図であつて、キヤビネツトは放熱板1で形
成する両側壁(サイドダクト)19および前壁板
20、後壁板21を有する全体で矩形の箱型をな
している。両側壁のサイドダクト19間の中央部
分には両サイドダクト19に平行した中央ダクト
18を設け、両サイドダクト19、中央ダクト1
8と前壁板20、後壁板21とをろう付によつて
接続する。前壁板20のほぼ中央部外壁には送風
機16を取付ける。 FIG. 1 is a perspective view of an air-cooled cabinet for electrical equipment according to the present invention. It is box-shaped. A central duct 18 parallel to both side ducts 19 is provided in the center between the side ducts 19 on both side walls, and both side ducts 19 and the central duct 1
8, the front wall plate 20, and the rear wall plate 21 are connected by brazing. A blower 16 is attached to the outer wall of the front wall plate 20 at approximately the center thereof.
側壁を構成するサイドダクト19および中央ダ
クト18を形成する放熱板は、金属板3と金属板
4とを並設し、金属板3,4間に、この空間を保
持する波状の金属製フイン5を介装した板状体で
ある。金属板3と金属板4との間隔は長手方向の
一端の間隔を狭く、長手方向他端の間隔を広くテ
ーパ状に構成する。このテーパ状放熱板1Bはサ
イドダクト19においては前壁板20側の金属板
3,4の間隔を狭く断面積を小さくした側を配設
し、中央ダクト18は前壁板20側の金属板3,
4の間隔を広くして断面積を大きくした側を配設
する。さらに、後壁板21のサイドダクト19と
の接続部には排出口(図示せず)を設ける。 The heat dissipation plate forming the side duct 19 and the central duct 18 that constitute the side wall has a metal plate 3 and a metal plate 4 arranged side by side, and a wavy metal fin 5 that maintains this space between the metal plates 3 and 4. It is a plate-shaped body with a The distance between the metal plates 3 and 4 is tapered such that the distance at one end in the longitudinal direction is narrow and the distance at the other end in the longitudinal direction is wide. In the side duct 19, this tapered heat dissipation plate 1B is arranged on the side where the interval between the metal plates 3 and 4 on the front wall plate 20 side is narrowed and the cross-sectional area is reduced, and in the central duct 18, the metal plate on the front wall plate 20 side 3,
4, and the side with a larger cross-sectional area is arranged. Further, a discharge port (not shown) is provided at the connection portion of the rear wall plate 21 with the side duct 19.
サイドダクト19と中央ダクト18との間には
放熱板1A付の多層プリント基板8を前壁板20
に平行して配設する。放熱板付き多層プリント基
板8は絶縁性の多層プリント基板9に放熱板1A
が粘着、重合され、一体化されている。放熱板1
Aは2枚の金属板3,4を平行に並設し、2枚の
金属板3,4間にフイン5を介装したものであ
る。 A multilayer printed circuit board 8 with a heat sink 1A is mounted between the side duct 19 and the center duct 18 on the front wall plate 20.
be placed parallel to the The multilayer printed circuit board 8 with a heat sink has a heat sink 1A on an insulating multilayer printed circuit board 9.
are adhered, polymerized, and integrated. Heat sink 1
In A, two metal plates 3 and 4 are arranged in parallel, and a fin 5 is interposed between the two metal plates 3 and 4.
放熱板付き多層プリント基板8の放熱板1A上
面には部品11が第2図に示すように配設され
る。放熱板付き多層プリント基板8に小孔を穿孔
し、放熱板1Aの小孔にエポキシ絶縁材13を介
装すると共に、部品11の脚12はスルーホール
メツキ15を介して小孔中に挿入し、プリント配
線と接続させてはんだ付けなどの手段で固着す
る。 Components 11 are arranged on the upper surface of the heat sink 1A of the multilayer printed circuit board 8 with a heat sink as shown in FIG. A small hole is drilled in the multilayer printed circuit board 8 with a heat sink, and an epoxy insulating material 13 is inserted into the small hole of the heat sink 1A, and the legs 12 of the component 11 are inserted into the small hole through the through-hole plating 15. , connect it to the printed wiring and fix it by means such as soldering.
両側壁19面と放熱板付き多層プリント基板8
との接続部および、中央ダクト18面と放熱板付
き多層プリント基板8との接続部分はテーパ状放
熱板から放熱板付き多層プリント基板8の放熱板
1Aに空気が流通できるように連通孔を介して接
続する。また、送風機16の送風口は中央ダクト
18のテーパ状放熱板の金属板間に連結する。 Multilayer printed circuit board 8 with 19 side walls and heat sink
The connecting portion between the center duct 18 and the multilayer printed circuit board 8 with a heat sink is provided with a communication hole so that air can flow from the tapered heat sink to the heat sink 1A of the multilayer printed circuit board 8 with a heat sink. Connect. Further, the air outlet of the air blower 16 is connected between the metal plates of the tapered heat sink of the central duct 18.
このように構成する電気装置用冷却キヤビネツ
トの作用を説明する。 The operation of the cooling cabinet for electrical equipment constructed in this way will be explained.
送風機16を作動させて、中央ダクト18の金
属板間に冷却空気を送り込む。この時、送風機1
6はキヤビネツトの外側に装着しているので送風
機16の作動による発熱によつて、キヤビネツト
内が温度上昇等の影響を受けることがない。冷却
空気は中央ダクト18から各放熱板付き多層プリ
ント基板8の放熱板1Aに入り、サイドダクト1
9を通つて排気される。中央ダクト18の前壁板
20側は断面積が大きく、後壁板側は狭く閉鎖さ
れているで、冷却空気の放熱板付き多層プリント
基板8の放熱板1Aへの流入はスムーズに行われ
る。さらに、両側壁であるサイドダクト19は前
側壁20に近い側が狭く、流出側がその幅を広く
しているのでサイドダクト19内の空気は迅速に
スムーズに流下する。 The blower 16 is operated to send cooling air between the metal plates of the central duct 18. At this time, blower 1
Since the blower 6 is mounted on the outside of the cabinet, the inside of the cabinet will not be affected by temperature rise due to heat generated by the operation of the blower 16. Cooling air enters the heat sink 1A of the multilayer printed circuit board 8 with each heat sink from the central duct 18, and then passes through the side duct 1.
It is exhausted through 9. The front wall plate 20 side of the central duct 18 has a large cross-sectional area, and the rear wall plate side is narrowly closed, so that cooling air can smoothly flow into the heat sink 1A of the multilayer printed circuit board 8 with a heat sink. Further, since the side duct 19, which is the side wall, is narrow on the side closer to the front side wall 20 and widened on the outflow side, the air in the side duct 19 flows down quickly and smoothly.
放熱板付き多層プリント基板8に配設した部品
11が発熱するとその熱は熱伝導性の優れている
放熱板1Aの金属板3,4に伝導され、さらに、
金属製のフイン5に伝導される。放熱板1Aの内
部の波状のフイン5の広い接触面が放熱板1A中
を流れている冷却空気に当り、熱を奪われる。さ
らに、側壁であるサイドダクト19の金属板3,
4およびフイン5に伝達された熱も空気流で積極
的に放熱する。この冷却空気の流れは迅速であつ
て、スムーズに排出されるので、放熱板1A中に
蓄熱することがなく、発熱部品を集中して配設し
たとしても熱放散が速く、温度上昇によつておこ
る部品機能の低下がおこらない。 When the component 11 disposed on the multilayer printed circuit board 8 with a heat sink generates heat, the heat is conducted to the metal plates 3 and 4 of the heat sink 1A, which have excellent thermal conductivity, and further,
It is conducted to the metal fins 5. The wide contact surface of the wavy fins 5 inside the heat sink 1A hits the cooling air flowing through the heat sink 1A, and heat is removed therefrom. Furthermore, the metal plate 3 of the side duct 19 which is the side wall,
The heat transferred to the fins 4 and fins 5 is also actively radiated by the air flow. This cooling air flow is rapid and is discharged smoothly, so there is no heat accumulation in the heat sink 1A, and even if heat-generating parts are arranged in a concentrated manner, heat dissipates quickly and is prevented from rising due to temperature rise. The deterioration of component functions that occurs does not occur.
[考案の効果]
本考案の電気装置用冷却キヤビネツトは多層プ
リント基板上に配設する電気部品が発熱した熱
を、熱伝導性の優れた放熱板の金属板およびフイ
ンに熱伝達され、この熱は放熱板中を送風機から
送られる冷却空気で直ちに冷却されるので、冷却
効率が高い。また、中央ダクトを形成する放熱板
はテーパを持たせて放熱板付き多層プリント基板
の放熱板への冷却空気の流入をスムーズにおこな
つていると共に、両側壁を形成する放熱板は流下
側を広く構成して空気の流通の迅速化を計つてい
るので冷却効果が大きく、部品からの発熱量が多
くともキヤビネツト内の温度上昇を招くことが無
い。[Effects of the invention] The cooling cabinet for electrical equipment of the invention transfers the heat generated by the electrical components arranged on the multilayer printed circuit board to the metal plate and fins of the heat dissipation plate, which have excellent thermal conductivity. The cooling efficiency is high because the cooling air sent from the blower immediately cools the inside of the heat sink. In addition, the heat sink that forms the central duct is tapered to allow cooling air to smoothly flow into the heat sink of the multilayer printed circuit board with a heat sink, and the heat sink that forms both side walls is designed to have a tapered surface. The wide structure allows for rapid air circulation, so the cooling effect is large, and even if there is a large amount of heat generated from the parts, the temperature inside the cabinet will not rise.
さらに、キヤビネツトの外側に配設した送風機
の送風作動による発熱は、キヤビネツト内にはそ
の影響を及ぼさない。 Furthermore, the heat generated by the blower operation of the blower disposed outside the cabinet does not affect the inside of the cabinet.
このように、効率良くキヤビネツト内の冷却を
行うことにより、部品の性能劣化や性能の変化が
防止出来ると共に、多層プリント基板に放熱板を
重合してこの放熱板中を冷却空気が通過するの
で、部品の発熱密度が高くとも熱放散が確実に行
われ、従来のプリント基板のように部品配置の制
約を受けることがない。 In this way, by efficiently cooling the inside of the cabinet, it is possible to prevent performance deterioration or change in the performance of parts, and since the heat sink is superimposed on the multilayer printed circuit board and the cooling air passes through the heat sink, Even if the heat generation density of the components is high, heat dissipation is ensured, and unlike conventional printed circuit boards, there are no restrictions on component placement.
第1図は本考案の実施例の斜視図、第2図は部
品取り付けを示す断面図である。
1A……放熱板、1B……テーパ状放熱板、
3,4……金属板、5……金属製フイン、8……
放熱板付き多層プリント基板、9……多層プリン
ト基板、11……部品、16……送風機、18…
…中央ダクト、19……サイドダクト。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view showing how parts are attached. 1A... Heat sink, 1B... Tapered heat sink,
3, 4...metal plate, 5...metal fin, 8...
Multilayer printed circuit board with heat sink, 9... Multilayer printed circuit board, 11... Parts, 16... Air blower, 18...
...Central duct, 19...Side duct.
Claims (1)
の金属製フインとを備えた放熱板により形成した
両側壁と、前記両側壁間に配設するプリント基板
と、前記放熱板の金属板間に送風する送風機とを
備えた電気装置用空冷キヤビネツトにおいて、 前記両側壁に平行して両側壁の中間に前記放熱
板よりなる中央ダクトを配設し、キヤビネツト外
壁に前記中央ダクトの2枚の金属板間に送風する
送風機を配設すると共に、前記中央ダクトの2枚
の金属板の間隔は前記送風機配設壁側の間隔を広
く、該壁に対応する壁側を狭く構成したテーパ状
放熱板とし、前記両側壁を形成する放熱板の2枚
の金属板の間隔は送風機配設壁側の間隔を狭く、
該壁に対応する壁側を広く構成したテーパ状放熱
板とすると共に、前記両側壁と中央ダクト間には
前記プリント基板に前記放熱板を重合貼着した放
熱板付き多層プリント基板を、前記放熱板付き多
層プリント基板の放熱板と前記両側壁との接続部
分および前記放熱板付き多層プリント基板の放熱
板と中央ダクトとの接続部分を空気が流通するよ
う接続し配設したことを特徴とする電気装置用空
冷キヤビネツト。[Claims for Utility Model Registration] Both side walls formed of heat sinks each having two metal plates and a wavy metal fin that connects and holds the metal plates together, and a printed circuit board disposed between the two side walls. and a blower for blowing air between the metal plates of the heat sink, wherein a central duct made of the heat sink is disposed parallel to the both side walls and between the side walls, and the outer wall of the cabinet is A blower for blowing air is arranged between two metal plates of the central duct, and the gap between the two metal plates of the central duct is widened on the side of the wall where the blower is installed, and the wall corresponding to the wall is widened. A tapered heat dissipation plate with narrow sides is used, and the interval between the two metal plates of the heat dissipation plate forming the both side walls is narrow on the side of the wall where the blower is installed.
The wall side corresponding to the wall is a tapered heat sink with a wide structure, and between the both side walls and the central duct is a multilayer printed circuit board with a heat sink in which the heat sink is polymerized and adhered to the printed circuit board. A connecting portion between a heat sink of the multilayer printed circuit board with a board and the both side walls and a connecting portion between the heat sink of the multilayer printed circuit board with a heat sink and the central duct are connected so that air can circulate. Air-cooled cabinet for electrical equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985085242U JPH034072Y2 (en) | 1985-06-07 | 1985-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985085242U JPH034072Y2 (en) | 1985-06-07 | 1985-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61201396U JPS61201396U (en) | 1986-12-17 |
| JPH034072Y2 true JPH034072Y2 (en) | 1991-02-01 |
Family
ID=30635459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985085242U Expired JPH034072Y2 (en) | 1985-06-07 | 1985-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034072Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877300A (en) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | Heat sink substrate for mounting electronic parts on both sides |
| JPS6049691U (en) * | 1983-09-13 | 1985-04-08 | 三菱重工業株式会社 | Electronic equipment cooling system |
-
1985
- 1985-06-07 JP JP1985085242U patent/JPH034072Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61201396U (en) | 1986-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7339075B2 (en) | Electrical equipment, electronic controller | |
| US6262891B1 (en) | Component holder with circulating air cooling of electrical components | |
| JPH04233300A (en) | Fluid cooling type circuit package assembled structure | |
| CN100586263C (en) | Power supply with improved cooling | |
| KR100939992B1 (en) | Cooling device for electric and electronic equipment and electric and electronic equipment equipped with it | |
| KR0136070B1 (en) | Electronics | |
| JP7709902B2 (en) | Electronic Control Unit | |
| JP2002280779A (en) | Cooler for electronic apparatus | |
| JP2006210516A (en) | Electronic equipment cooling structure | |
| JPH09326579A (en) | Cooling unit and heat sink used for the unit | |
| JP3994235B2 (en) | Cooling structure of control device | |
| JPH098484A (en) | Cooling structure of electronic device | |
| JP2002271073A (en) | Cooling device for electronic equipment housing | |
| CN115133395A (en) | Laser heat abstractor and laser direct imaging equipment | |
| JPH0837387A (en) | Heat radiating and mounting structure for power amplifier | |
| US6452799B1 (en) | Integrated circuit cooling system | |
| US20060256523A1 (en) | Fan and heat sink combination | |
| JP7681444B2 (en) | electronic equipment | |
| CN223899387U (en) | Circuit board heat radiation structure of smoke exhaust ventilator | |
| CN223207305U (en) | A heat dissipation printed circuit board | |
| JPH08130385A (en) | Electronic circuit board and cooling method thereof | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| CN221531979U (en) | Heat insulation component and electronic product | |
| JP3026383B2 (en) | Semiconductor device | |
| JPS6271300A (en) | Heat sink structure for electronic device |