JPH0340972A - Metallizing paste composition - Google Patents

Metallizing paste composition

Info

Publication number
JPH0340972A
JPH0340972A JP17312389A JP17312389A JPH0340972A JP H0340972 A JPH0340972 A JP H0340972A JP 17312389 A JP17312389 A JP 17312389A JP 17312389 A JP17312389 A JP 17312389A JP H0340972 A JPH0340972 A JP H0340972A
Authority
JP
Japan
Prior art keywords
aluminosilicate
cao
metallizing paste
paste
paste composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17312389A
Other languages
Japanese (ja)
Other versions
JP2754046B2 (en
Inventor
Takahiro Yamakawa
孝宏 山川
Nobuyuki Minami
信之 南
Senjo Yamagishi
山岸 千丈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiheiyo Cement Corp
Original Assignee
Nihon Cement Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Cement Co Ltd filed Critical Nihon Cement Co Ltd
Priority to JP1173123A priority Critical patent/JP2754046B2/en
Publication of JPH0340972A publication Critical patent/JPH0340972A/en
Application granted granted Critical
Publication of JP2754046B2 publication Critical patent/JP2754046B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Ceramic Products (AREA)

Abstract

PURPOSE:To produce high bonding strength even to high purity alumina ceramics by adding a specified percentage of aluminosilicate, CaO and TiO2 to conventional known Mn-Mo metallizing paste. CONSTITUTION:Aluminosilicate, CaO and TiO2 are added to Mn and Mo as principal inorg. components by 5-20wt.%, in total, of the total amt. of the Nn and Mo. Powder of an ordinary clay mineral such as kaolin may be utilized as the aluminosilicate. Since the clay mineral contains water of crystallization in general, it is preferably dehydrated by heating to >=400 deg.C before use. The Mn and Mo are used in a ratio close to the ratio between Mn and Mo in conventional Mn-Mo metallizing paste.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、セラミックス特に高純度アルミナセラミック
スにも有用なメタライズペースト組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to metallizing paste compositions which are also useful in ceramics, particularly high purity alumina ceramics.

〔従来の技術〕[Conventional technology]

セラミックスを他の物体と接着するために、セラミック
スの表面をメタ・ライズすることは、広く行なわれてい
る。このメタライズに使用するメタライズペーストは、
通常、無機成分として肋が95〜75重量%、Mnが5
〜25重量%からなるMo−Mnメタライズペーストで
ある。このメタライズペーストを用いて、例えばアルミ
ナ純度が80〜96%程度のアルミナセラミックスを接
着した場合、実用上十分な接着強度が得られていた。
Meta-lising the surface of ceramics is widely used to bond ceramics to other objects. The metallization paste used for this metallization is
Usually, the inorganic components are 95 to 75% by weight of ribs and 5% by weight of Mn.
It is a Mo-Mn metallization paste consisting of ~25% by weight. For example, when alumina ceramics having an alumina purity of about 80 to 96% were bonded using this metallizing paste, a practically sufficient adhesive strength was obtained.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このアルミナセラミックスに比べて、体積抵抗率、誘電
損失などの電気特性や熱伝導率の優れたアルミナ純度9
9%以上の高純度アルミナセラ果7クスが、電気・電子
工業界で注目されている。
Compared to this alumina ceramic, alumina purity 9 has superior electrical properties such as volume resistivity and dielectric loss, and thermal conductivity.
High-purity alumina 7x with a purity of 9% or more is attracting attention in the electrical and electronic industries.

しかしながら、この高純度アルミナセラミックスの場合
、従来のMo−Mnメタライズペーストを用いて接着す
ると、その接着強度は引張強度が3〜5kg/u+”程
度であり、実用に供するには低いという問題点があった
However, in the case of this high-purity alumina ceramic, when bonded using conventional Mo-Mn metallization paste, the tensile strength is about 3 to 5 kg/u+'', which is low for practical use. there were.

〔問題を解決するための手段〕[Means to solve the problem]

本発明者らは、通常のセラミックスはもちろんのこと、
アルξす純度99%以上のアルミナセラミックスに用い
ても、高い接着強度を発現するメタライズペーストにつ
いて研究した結果、従来公知のMo−Mnメタライズペ
ーストにアルミノ珪酸塩、CaOおよびTi0zを添加
することにより、アルミナ−メタライズ界面の接合が強
くなるとの知見を得て、本発明を完成させるに至った。
The present inventors have discovered that not only ordinary ceramics but also
As a result of research into a metallization paste that exhibits high adhesive strength even when used on alumina ceramics with a purity of 99% or higher, it was found that by adding aluminosilicate, CaO, and TiOz to the conventionally known Mo-Mn metallization paste, The present invention was completed based on the knowledge that the bond between the alumina and metallized interface becomes stronger.

すなわち、本発明の要旨は、MnとMoを主無機戊分と
し、さらにアルミノ珪酸塩、CaOおよびTi0zを、
その合量でMnと旧の音量に対し、5〜20重量%含存
してなるメタライズペーストMi戒物にある。
That is, the gist of the present invention is that Mn and Mo are the main inorganic components, and aluminosilicate, CaO and TiOz are
The metallized paste Mi Kaimono contains 5 to 20% by weight of Mn and the old volume in total.

アルミノ珪酸塩は、一般にいわれる粘土鉱物粉末でよく
、カオリン等がその代表的なものである。
The aluminosilicate may be a commonly known clay mineral powder, and kaolin is a typical example thereof.

これらは一般に結晶水を含んでいるため、400℃以上
に加熱して脱水して使用した方がよい。
Since these generally contain water of crystallization, it is better to heat them to 400° C. or higher to dehydrate them before use.

CaOは、市販のCaO粉末やi 、 ooo℃以上で
CaOになるもの例えば入手し易いCaC0,粉末を用
いてもよい。
As the CaO, a commercially available CaO powder or a substance that becomes CaO at temperatures above i, ooo°C, such as easily available CaC0 powder, may be used.

Ti0zは、市販のTiO□粉末でよい。TiOz may be commercially available TiO□ powder.

MnとMoの割合は、通常のMn −Moメタライズペ
ーストと同程度である。
The ratio of Mn and Mo is comparable to that of normal Mn-Mo metallization paste.

メタライズペースト中にアルミノ珪酸塩、CaOおよび
TiO□のいずれかが欠けても、接着強度が向上しない
。また、それらの合量は、肝とMoの合量に対し5〜2
5重量%であり、この範囲を外れると接着強度の向上は
少ない。
Even if any of aluminosilicate, CaO, and TiO□ is missing in the metallization paste, the adhesive strength will not improve. In addition, their total amount is 5 to 2% of the total amount of liver and Mo.
The amount is 5% by weight, and if it is outside this range, there is little improvement in adhesive strength.

これらの無機成分と、バインダー、溶剤などの有機成分
とを混練することによりメタライズペーストが得られる
。バインダーとしては、エチルセルロース、ニトロセル
ロース、アクリルポリマーなどである。溶剤は、必要と
する乾燥速度に合ったものを用い、例えばスクリーン印
刷用であれば沸点200℃前後のα−テルピネオールや
ブチルカルピトールなどが好ましい。混練は、乳鉢やボ
ールミルなどを用いてもよいが、三本ロールミルを用い
るのが好ましい。
A metallized paste is obtained by kneading these inorganic components and organic components such as a binder and a solvent. Examples of the binder include ethyl cellulose, nitrocellulose, and acrylic polymer. A solvent suitable for the required drying rate is used, and for example, for screen printing, α-terpineol, butyl calpitol, and the like having a boiling point of around 200° C. are preferable. For kneading, a mortar, a ball mill, or the like may be used, but it is preferable to use a three-roll mill.

〔実施例〕〔Example〕

ニュージランド産カオリンの500℃X1hr脱水品(
A e zoz 41.3%、Sing 58゜2%、
その他不純物) 、CaCO5(試薬−級) 、Ti(
h (チタン工業側製にA−10)、 Mo(東京タン
グステン特製TMo−10) 。
Kaolin from New Zealand dehydrated at 500°C for 1 hour (
A e zoz 41.3%, Sing 58°2%,
Other impurities), CaCO5 (reagent grade), Ti (
h (A-10 manufactured by Titanium Kogyo), Mo (TMo-10 specially manufactured by Tokyo Tungsten).

Mn (福田金属箔粉■製Mn−5)を表1に示す比で
合計200gになるように秤取し、乳鉢で混合して無機
成分とした。一方、ブチルカルピトール40gにアクリ
ル系バインダー(三菱レイヨン1BR−101)を10
g溶解させ、有機成分とした。
Mn (Mn-5 manufactured by Fukuda Metal Foil Powder ■) was weighed out to a total of 200 g according to the ratio shown in Table 1, and mixed in a mortar to obtain an inorganic component. On the other hand, add 10 g of acrylic binder (Mitsubishi Rayon 1BR-101) to 40 g of butyl calpitol.
g was dissolved to obtain an organic component.

無機成分と有機成分を乳鉢中で軽く混合後、三本ロール
ミルにかけて混練し、ペーストとした。
After lightly mixing the inorganic component and the organic component in a mortar, the mixture was kneaded using a three-roll mill to form a paste.

粘度計を用いてブチルカルピトールでこのペーストをう
すめて、粘度を1000psに調整した後、#200メ
ツシュのスクリーンを用いて99.5%純度のアルミナ
セラミソジス上に塗布した。乾燥後、加湿11□雰囲気
中で1400℃X1hr焼威した。さらにワンド浴を用
いNiメソキを施した。銀銅の共晶ろう(BAg−8)
を用いてコバール金属とろう付したのち、引張り強度を
測定した。その結果を表1に示す。
This paste was diluted with butyl calpitol using a viscometer to adjust the viscosity to 1000 ps, and then applied onto 99.5% pure alumina ceramics using a #200 mesh screen. After drying, it was burned at 1400° C. for 1 hour in a humidified 11□ atmosphere. Furthermore, Ni metal coating was applied using a wand bath. Silver-copper eutectic wax (BAg-8)
The tensile strength was measured after brazing with Kovar metal. The results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

本発明にかかるメタライズペーストを用いれば、電気的
特性に優れた99%以上の高純度アルミナセラミックス
でも接着強度が向上し、実用に供することができるよう
になり、電子材料用セラミックスの市場が更に拡大され
た。
If the metallization paste of the present invention is used, the adhesive strength of even high-purity alumina ceramics of 99% or more with excellent electrical properties will be improved, making it possible to put them into practical use, and further expanding the market for ceramics for electronic materials. It was done.

Claims (1)

【特許請求の範囲】[Claims] MnとMoを主無機成分とし、さらにアルミノ珪酸塩、
CaOおよびTiO_2を、その合量でMnとMoの合
量に対し、5〜20重量%含有してなるメタライズペー
スト組成物。
Mn and Mo are the main inorganic components, and aluminosilicate,
A metallizing paste composition containing CaO and TiO_2 in a total amount of 5 to 20% by weight based on the total amount of Mn and Mo.
JP1173123A 1989-07-06 1989-07-06 Metallized paste composition Expired - Lifetime JP2754046B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1173123A JP2754046B2 (en) 1989-07-06 1989-07-06 Metallized paste composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1173123A JP2754046B2 (en) 1989-07-06 1989-07-06 Metallized paste composition

Publications (2)

Publication Number Publication Date
JPH0340972A true JPH0340972A (en) 1991-02-21
JP2754046B2 JP2754046B2 (en) 1998-05-20

Family

ID=15954562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1173123A Expired - Lifetime JP2754046B2 (en) 1989-07-06 1989-07-06 Metallized paste composition

Country Status (1)

Country Link
JP (1) JP2754046B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62146004A (en) * 1985-12-18 1987-06-30 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Phase-locking loop coefficient generator for filter device whose frequency ratio between input and output sampling frequencies is irrational number

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62146004A (en) * 1985-12-18 1987-06-30 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Phase-locking loop coefficient generator for filter device whose frequency ratio between input and output sampling frequencies is irrational number

Also Published As

Publication number Publication date
JP2754046B2 (en) 1998-05-20

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