JPH0341711A - Laminated type electronic component - Google Patents

Abstract

PURPOSE:To facilitate circuit constitution in the inside by the amount of outer wirings by electrically connecting outer electrodes at the outer surface of a laminated boards, and constituting a circuit network. CONSTITUTION:Functional circuits of electronic components 14, 15 and 16 are formed on one main surface or both main surfaces of each of circuit boards 11-13. Connecting conductor parts 17a-17f, 18a-18f and 19a-19g are led out of mechanical circuits 14-16 including electronic-component functional elements to the edges of the circuit boards 11-13. A plurality of outer electrodes 22a-22g are formed so that the electrodes are electrically connected to the connecting conductor parts 17a-19g which are exposed to the outer surface of a laminated board 21. Of the outer electrodes 22a-22g, arbitrary parts are electrically connected one another. Thus a circuit network is formed even on the outer surface of the laminated board 21.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the improvement of a laminated electronic component made by laminating and fixing a plurality of substrates on which electronic component functional elements such as resonators are formed. In particular, it relates to an improved wiring structure.

[Conventional technology]

2. Description of the Related Art Conventionally, various types of laminated electronic components are known, which are formed by laminating a plurality of substrates on which electronic component functional elements such as resonators and filters are formed.

FIG. 2 is an external perspective view showing an example of the above-described laminated electronic component. In the laminated electronic component 1, a circuit board 2.3 is laminated and fixed via an adhesive (not shown), and protective boards 4.5 are laminated and fixed on top and bottom of the circuit board 2.3.
0 circuit boards 2 and 3 that are fixed together to form a laminated board
is made of a dielectric or piezoelectric ceramic material, and an electronic component functional element such as a piezoelectric resonator or a filter is constructed by forming an electrode on one or both main surfaces of the substrate.

The electronic component functional elements configured on each circuit board 2.3 are drawn out to the edges of each circuit board 23, ie, to the side surfaces 6 and 7 of the laminated board, by connecting conductive parts (not shown). Safe! !
The substrates 4 and 5 are made of insulating ceramics or the like, and are provided to protect and seal the electronic component functional element portions and the connecting conductive portions formed on the circuit boards 2 and 3.

External electrodes 8a to 8j are formed on side surfaces 6.7 of the laminated substrate. Each of the external electrodes 8a to 8j is provided for electrical connection with the outside, and is electrically connected to each of the connection conductive parts drawn out at the green ends of the circuit boards 2 and 3 mentioned above. ing.

[Technical problem to be solved by the invention] In the conventional ALI type electronic component l, a plurality of external The poles 8a to 8j were formed. Therefore, when the number of electronic component functional elements configured on one circuit board 2, 3 increases, or the number of laminated circuit boards increases, the number of external electrodes formed on the side surfaces 6, 7 increases dramatically. To increase. As a result, it is extremely difficult to accurately form a large number of external electrodes on the side surfaces of the laminated substrate so as to prevent short circuits between them.

Note that if the external electrodes are formed by printing and baking a conductive paste or the like, it is considered that it is relatively easy to form a large number of external electrodes in a limited area. However, the electronic components 1 will be exposed to high temperatures. Therefore,
If the functional element is, for example, a resonator or a filter, it cannot be used because its characteristics will deteriorate. That is, the range of application is extremely limited depending on the heat resistance of the electronic component functional element configured on the circuit board, the thermal expansion coefficient of the circuit board, etc.

Also, external electrodes 8a are provided corresponding to each of the connection conductive parts.
.about.8j are formed, wiring work with the outside during mounting is complicated and a large mounting space is required. Therefore, it becomes difficult to support high-density packaging.

An object of the present invention is to provide a laminated electronic component in which external electrodes can be easily formed, which is suitable for high-density packaging, and which can also be used to configure electronic component functional elements that have problems such as heat resistance. It's about doing.

[Means for solving the technical vR problem] The laminated electronic component of the present invention includes a circuit including at least I electronic component functional elements, and a connecting conductor drawn out to the green edge of the substrate in order to lead out the circuit to the outside. A laminated substrate is constructed by laminating and fixing a plurality of substrates having a plurality of parts. A plurality of external poles are formed on the outer surface of the multilayer substrate so as to be electrically connected to the connection conductive portion. And the product N
By connecting at least some of the plurality of external electrodes on the outer surface of the substrate to each other, a circuit network is configured using the outer surface of the laminated substrate.

[Effect]

On the outer surface of the laminated substrate, external electrodes are electrically connected to form a circuit network. That is, wiring is performed not only in the internal circuit portion of the multilayer substrate, but also on the outer surface. Therefore, the internal circuit fJI is made easier by the amount of external wiring, and the electrical connection work with the outside becomes easier during mounting, and the mounting space can also be reduced.

[Explanation of Examples]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 3 is an exploded perspective view of a multilayer substrate used in a multilayer electronic component according to an embodiment of the present invention.

In this embodiment, three circuit boards 11 to 13 are 4jI11 and 4jI11 with an adhesive (not shown) interposed therebetween in the illustrated orientation.
They are fixed to form a product N substrate.

The circuit boards ville to 13 are each made of fired dielectric ceramics or piezoelectric ceramics. Then, the electronic component functional circuits 14, 15, 16 are provided on one or both main surfaces of each circuit board Fiti~13.
is configured. In Figure 3, each electronic component function circuit B1
Regarding Nos. 4 to 16, only the configured regions are schematically shown with dashed lines. Specifically, an excitation electrode, etc. is configured in the area surrounded by the dashed line, at least one of various electronic component functional elements such as a resonator, a filter, or a capacitor is configured, and a circuit network is configured. Connecting conductive parts 17a-17', 18a-18f and 19a-19 are electrically connected to each other so as to connect conductive parts 17a-17', 18a-18f and 19a-19, respectively.
g is drawn out to the green end of each circuit board 11-13.

A laminated board can be obtained by stacking and fixing the circuit boards 11-13.

In this embodiment, as shown in FIG.
Protective substrates 20a and 20b made of insulating ceramics are further bonded to the upper and lower surfaces of the laminate of No. 3, and the functional circuits and connection conductive parts formed on the circuit boards 11-13 are hermetically sealed.

Then, a plurality of external electrodes are formed so as to be electrically connected to each of the connecting conductive parts 17a to 19g exposed on the outer surface of the laminated substrate 21.

The laminated electronic component of this example on which external electrodes were formed was
As is clear from FIG. 1, which is shown in a perspective view, arbitrary portions of the external electrodes 22a to 22g are electrically connected to each other to form a circuit network on the outer surface of the laminated substrate 21. . That is, in the multilayer electronic component of this embodiment, since the circuit network is constructed using the outer surface of the multilayer board 21, the wiring within each circuit board 11-13 can be simplified accordingly. It is considered possible. As well,
Since a plurality of external electrodes among the external electrodes to which each of the connecting conductive parts 17a to 19g are connected are electrically connected in advance as a component, the work of mounting the electronic component of this example on a printed circuit board, etc. Since it is possible to simplify the wiring on the printed circuit board as well as to simplify the wiring on the printed circuit board, it is also possible to reduce the mounting space.

Furthermore, the external electrodes 22a to 22h are formed by sputtering,
Electrodes can be formed on the entire outer surface by vapor deposition, electroless plating, etc., and then etched, scraped, or burned off to form the respective external electrode patterns shown in the drawings. Alternatively, each external electrode may be formed by a known electrode forming method after covering the outer surface of the electronic component with a masking member, leaving the portion where the external electrode is formed, or with a pattern mask in contact with the outer surface of the electronic component. .

Note that the formation of the external molds Fii 22a to 22h may be performed separately on each surface of the laminated substrate, or the external electrodes may be formed on all the outer surfaces at one time.

In addition, the external electrode 22a is formed by the above-described method of forming the external electrode.
After forming 22h, a composite coating of another conductive material may be applied to the outside by plating or the like to form a more reliable external electrode.

In the above embodiment, the protective substrates 20a and 20b are laminated on the top and bottom of the laminated substrate. l! base +ff20゜21
is not necessarily essential in the present invention, and
Functional circuits may also be placed on the protective substrate side.Furthermore, the number of circuit boards to be stacked is not limited to the illustrated example, but is arbitrary.

Furthermore, when forming a laminated substrate in the electronic component of the present invention, mass productivity can be improved by constructing the laminated body in the form of a large mother substrate and then cutting it to obtain individual electronic components.

〔Effect of the invention〕

According to the present invention, a plurality of external electrodes are formed on the outer surface of a laminated substrate formed by laminating a functional circuit including at least - electronic component functional elements and a connecting conductive part, Since the electrical parts and external electrodes are electrically connected to form a circuit network on the outer surface, the number of electrical connections with the outside of the electronic component can be reduced, simplifying the mounting work and mounting. It becomes possible to achieve a reduction in space. Therefore, it is possible to provide electronic components suitable for high-density packaging, which can greatly contribute to cost reduction and miniaturization of sets.

[Brief explanation of drawings]

FIG. 1 is an external perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is an external perspective view of a conventional multilayer electronic component, and FIG.
The figure is an exploded perspective view for explaining a substrate used in an embodiment of the invention, and FIG. 4 is a perspective view showing a laminated substrate in an embodiment of the invention. In the figure, 11 to 13 are circuit boards, 14 to 16 are functional circuits, 17a to 19g are connection conductive parts, and 21 is an lfi layer substrate 2a to 22h are external electrodes.

Claims (1)

[Scope of Claims] A laminate formed by laminating and fixing a plurality of substrates each having a circuit including at least one electronic component functional element and a connecting conductive portion drawn out to the edge green for connecting the circuit to the outside. A substrate, and a plurality of external electrodes formed on the outer surface of the multilayer substrate so as to be electrically connected to the connection conductive portion exposed on the outer surface of the multilayer substrate, A multilayer electronic component characterized in that at least some of the plurality of external electrodes formed on the surface are connected to each other to form a circuit network using the outer surface of the multilayer substrate.