JPH0341932U - - Google Patents

Info

Publication number
JPH0341932U
JPH0341932U JP1989102972U JP10297289U JPH0341932U JP H0341932 U JPH0341932 U JP H0341932U JP 1989102972 U JP1989102972 U JP 1989102972U JP 10297289 U JP10297289 U JP 10297289U JP H0341932 U JPH0341932 U JP H0341932U
Authority
JP
Japan
Prior art keywords
comb
conductivity type
emitter
base
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989102972U
Other languages
English (en)
Other versions
JPH083005Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989102972U priority Critical patent/JPH083005Y2/ja
Publication of JPH0341932U publication Critical patent/JPH0341932U/ja
Application granted granted Critical
Publication of JPH083005Y2 publication Critical patent/JPH083005Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)

Description

【図面の簡単な説明】
第１図と第２図は本考案に係る半導体装置の一
実施例を示す要部平面図とそのＹ−Ｙ線要部拡大
側断面図である。第３図と第４図は従来の半導体
装置の一具体例を示す要部平面図とそのＸ−Ｘ線
要部拡大側断面図、第５図は従来の半導体装置の
他の具体例を示す要部平面図である。 １０……半導体基板、１１，１１ａ……ベース
領域、１２……エミツタ領域、１３……絶縁膜、
１３ａ，１３ｂ……窓開け部、１４，１５……導
電被膜、１４ａ……金属細線ボンデイング部分、
１６，１７……金属細線。

Claims (1)

  1. 【実用新案登録請求の範囲】 コレクタ領域となる一導電型半導体基板に他導
    電型及び一導電型各不純物を順次、選択拡散して
    ベース、エミツタ各領域を形成すると共に、上記
    エミツタ領域を粗いメツシユ又は櫛歯状に分割形
    成し、かつ、電極引き出し位置を窓開けした絶縁
    膜を介して基板表面に上記ベース、エミツタ各電
    極引出し用の櫛歯状導電被膜を設け、その一部に
    金属細線をボンデイングした半導体装置において
    、 上記ベース電極引出し用導電被膜における金属
    細線ボンデイング部分の直下にエミツタ領域を形
    成したことを特徴とする半導体装置。
JP1989102972U 1989-08-31 1989-08-31 半導体装置 Expired - Lifetime JPH083005Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989102972U JPH083005Y2 (ja) 1989-08-31 1989-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989102972U JPH083005Y2 (ja) 1989-08-31 1989-08-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH0341932U true JPH0341932U (ja) 1991-04-22
JPH083005Y2 JPH083005Y2 (ja) 1996-01-29

Family

ID=31651837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989102972U Expired - Lifetime JPH083005Y2 (ja) 1989-08-31 1989-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JPH083005Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210786A (ja) * 2005-01-31 2006-08-10 Matsushita Electric Ind Co Ltd トランジスタ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111362U (ja) * 1979-01-30 1980-08-05
JPS55139558U (ja) * 1979-03-27 1980-10-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111362U (ja) * 1979-01-30 1980-08-05
JPS55139558U (ja) * 1979-03-27 1980-10-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210786A (ja) * 2005-01-31 2006-08-10 Matsushita Electric Ind Co Ltd トランジスタ

Also Published As

Publication number Publication date
JPH083005Y2 (ja) 1996-01-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term