JPH0342111B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a pad material made of molded chip material, and more specifically, the present invention relates to a method for manufacturing a pad material made of molded chip material. The present invention relates to a method for producing a pad material made of a molded chip material formed integrally into a plurality of hard molded chip layers when viewed from above.

Conventional padding materials are formed into the desired shape by placing molding chips such as urethane chips, coarse hair, scraps, and binder between the lower and upper molds, and then aligning the lower and upper molds. It is designed to obtain a padded material that has been polished. Therefore, the hardness of conventional pad materials is relatively uniform and constant. In addition, for pad materials used for vehicle seats, etc., it is desirable to have a pad material formed of a molded chip layer that is relatively hard at the outer periphery and soft at the center when viewed from the top. The central part and the central part must be formed separately and then joined together using an adhesive, which is a complicated process and lacks practicality.
In particular, when separately formed molded chip layers are bonded using an adhesive, the bonded portion becomes extremely hard due to hardening of the adhesive, giving the seated person a feeling of partial contact and deteriorating the cushioning properties and feel. It had some drawbacks.

The object of the present invention is to form a plurality of molded chip layers having different hardnesses when viewed from the top, so that each layer exhibits an optimal amount of deflection depending on the load, and to simplify and speed up manufacturing operations. The present invention provides a method for manufacturing a pad material made of a molded chip material with excellent cushioning properties, and will be described in detail below with reference to the drawings.

1 and 2 schematically show a first embodiment of a pad material manufactured by the method for manufacturing a pad material made of molded chip material according to the present invention, and the pad material shown in FIG. Material 1 is a pad material for a seat bag to which the method of the present invention is applied.The upper layer 1a indicated by the diagonal line downward to the left is a relatively soft molded chip layer as a whole, and the lower layer 1b indicated by the downward diagonal line to the right is the entire molded chip layer. The upper layer 1a and the lower layer 1b are formed by integral molding. Further, in the pad material 1 shown in FIG. 2, both side layers 1b are formed of a relatively hard molded chip material, a center layer 1a is formed of a relatively soft molded chip material, and both side layer 1b and the center layer 1a are formed of a relatively soft molded chip material. are integrally formed.

The pad material 1 is molded using a mold 11 shown in FIG. This mold 11 consists of a lower mold 12 and an upper mold 21 fitted to this lower mold 12.
When molding the pad material 1 shown in FIG.
A slit 14 is formed at a position corresponding to the boundary line with the partition wall 15 from the bottom of this slit 14.
is inserted. This partition wall 15 is supported by a receiving member 16 provided on the bottom 13 of the lower die 12 so as to be movable up and down. A flange 15a is formed in the middle of the partition wall 15 in the vertical direction, and a spring material 17 inserted between the bottom 16a of the receiving member 16 and the flange 15a normally biases the partition wall 15 upward, The flange 15a of the wall 15 is in close contact with the bottom 13 of the lower mold 12.

By this pair of partition walls 15, a plurality of lower molds 12,
In this embodiment, there are three small chambers 12a, 12b, 12c.
It has become a state of partition. Furthermore, partition wall 15
It is preferable to attach an appropriate waterproof packing material between the slit 14 and the slit 14.

A pressing member 22 of the partition wall 15 is formed at a position of the upper die 21 facing the upper end edge of the partition wall 15, respectively. The tip of the pressing member 22 is formed into a pin shape, and when the upper mold 21 is fitted to the lower mold 12, it engages with the partition wall 15 of the lower mold 12, and the partition wall 15 is connected to the bottom of the lower mold 12. The receiving member 16 provided in 13
It is designed to be pressed to the side.

With the upper mold 21 of the mold 11 opened, a first chip material 1'a is placed in the central small chamber 12b of the lower mold 12 to form the center layer 1a of the pad material 1 made of relatively soft chip urethane or the like. A predetermined amount of the second chip material 1'b, which forms the both side layers 1b of the pad material 1 made of relatively hard chip urethane, etc., is put into the small chambers 12a and 12c on both sides, respectively.
Incidentally, an adhesive binder is mixed in the first and second chip materials 1'a and 1'b. As an example of this binder, a prepolymer produced from polyether glycol and tolylene diisocyanate and containing 1 to 10% of free isocyanate is used. When the upper mold 21 is lowered in this state and the molds are aligned, the pressing member 22 of the upper mold 21 engages with the upper edge of the partition wall 15 protruding into the lower mold 12, and as the upper mold 21 is lowered, The partition wall 15 was pushed downward, and the first chamber, which was partitioned into a plurality of small rooms 12a, 12b, and 12c by the partition wall 15,
The second chip materials 1'a and 1'b are gradually integrated from the upper part of the lower mold 12. The first and second chip materials 1'a and 1'b do not have high fluidity, and therefore have a central layer 1a made of a relatively soft molded chip layer and a side layer 1b made of a relatively hard molded chip layer.
A pad material 1 as shown in FIG. 2 in which these are integrated is obtained.

FIG. 4 shows an outline of a second embodiment of the method for manufacturing a pad material made of molded chip material according to the present invention. In this second embodiment, the present invention is applied to the pad material of a seat cushion. It was applied. This pad material 31 has multiple molded chip layers formed from the front end to the rear end when viewed from above, and in this embodiment, as an example, the 10 layers from layer A to layer J are formed using the above-mentioned mold. Molding mold 1 similar to 11
1, and the partition wall 15 is formed using nine lower molds 12.

As shown in FIG. 5A, this pad material 31 has the hardness of each layer from layer A to layer J set so that the seated person can maintain the body in an optimal state while seated. As shown in B, when the seated person is seated, the amount of deflection Y corresponding to the load X in the front-rear direction of the body is set so as to be shown by a deflection curve P. This deflection curve P corresponds to the seat cushion abutment surface of the seated person, which is shown by imaginary lines in FIG. 5A.

6A and 6B schematically show an embodiment in which the pad material 31 in the second embodiment is produced in a larger quantity than the block-shaped pad material 31',
First, as shown in FIG. 6A, a plurality of pad materials 3
A block-shaped pad material 31' with a height H corresponding to the thickness of 1 is formed, and this block-shaped pad material 31' is
1' as shown in FIG. 6B, each pad material 31
A plurality of pad materials 31 are formed by cutting to a thickness h. The block-shaped pad material 3
1' can be formed by a mold 11 in which a lower mold 12 is formed to be elongated in the vertical direction, and similarly to the above, it is possible to form multiple molded chip layers having different hardnesses when viewed from above.

In the second embodiment described above, the molded chip layer is formed in multiple layers from the front end to the rear end when viewed from the top, but it is also possible to form the molded chip layer into multiple layers between both sides when viewed from the top. Alternatively, both outer portions may be formed of molded chip layers that are relatively harder than the central portion to provide a feeling of side support.

FIGS. 7A, B, and C each schematically show a third embodiment of the present invention. In this embodiment, the method of the present invention is applied to a pad material used for the lining of a vehicle door. It is. This pad material 41 has a pair of central portions 42 formed in a substantially rectangular shape.
, an intermediate part 43 formed to surround the outer periphery of the central part 42 , and an outer part 44 formed to surround the outer periphery of the intermediate part 43 .
2 is formed from a molded chip layer suitable for parts requiring strength, the middle part 43 is formed from a molded chip layer suitable for forming a flat surface, and the outer part 44 is formed from a molded chip layer suitable for forming a flat surface.
is formed from a molding chip layer suitable for portions requiring moldability, and the central portion 42, intermediate portion 43, and outer portion 44 are integrally molded using the mold 11 described above.

As shown in FIG. 7A, the central portion 42 and the intermediate portion 43
Then, a semi-cured block-shaped pad material 41' is formed, and the outer portion 44 has a height H corresponding to the thickness of a plurality of pad materials 41 as shown in FIG. 6A. 7th pad material 41'
A plurality of individual pad materials 41 in a flat semi-cured state are formed by cutting as shown in FIG.
1 is a mold 51 for a door casing of a vehicle door.
The door casing 40 is heated and formed to have a concavo-convex portion corresponding to the shape of the door.

Note that the pad material 31 for the seat cushion in the second embodiment is also the same as the pad material 41 in the third embodiment.
Similarly, a pad material 31' of a semi-cured block material is formed, and a pad material 31' of this block material is formed.
1' is cut to form a flat, semi-cured pad material 31, which is then heated and molded using a mold for sheet cushions (not shown) to form a pad having similar unevenness as shown in FIG. It may also be one that forms the material 31. Furthermore, although not shown, the pad material 31 for the seat cushion is formed from a ring-shaped molded chip layer when viewed from above, and the molded chip layer on the outer side has better shape retention and moldability than the molded chip layer in the center part. It can also be formed from a molded chip material having properties.

The above is an embodiment of the method for producing a pad material made of molded chips according to the present invention. According to this method, the hardness of each part of the formed chip layer can be adjusted depending on the purpose of use of the pad material. It is extremely easy to set up, and since the molded chip layers with different hardness are molded together, there is no need to perform work such as joining each part of the molded chip layers, which can significantly improve work efficiency. It is possible to obtain a method of manufacturing a pad material made of a molded chip material, which can significantly improve cushioning properties compared to a method in which individual chip layers are bonded together using an adhesive.

[Brief explanation of drawings]

1 and 2 are front explanatory views showing the outline of a first embodiment in which the method of manufacturing a pad material made of chip material according to the present invention is applied to a pad material for a seat bag, and FIG. FIG. 4 is a cross-sectional explanatory view showing an embodiment of a mold for carrying out the method for manufacturing a pad material; FIG. 4 is a perspective view schematically showing a second embodiment in which the method of the present invention is applied to a pad material for a seat cushion; Figures 5A and B are side views and deflection curve diagrams of the pad material in Figure 4, and Figures 6A and B are perspective views of an embodiment in which the pad material of the second embodiment is produced in large quantities. 6A is a perspective view of a block-shaped pad material having a height corresponding to a plurality of pad materials, and FIG. 6B is a perspective view of the block-shaped pad material of FIG. 6A being cut into individual pad materials. FIGS. 7A, B, and C are perspective views showing the state in which the material is formed, and each shows an outline of a third embodiment in which the method of the present invention is applied to a door casing. FIG. 7A is a semi-cured block shape. Fig. 7B is a perspective view showing the state in which the block-shaped pad material of Fig. 7A is cut to form individual pad materials, and Fig. 7C is a perspective view of the door casing heated and formed. It is a perspective view of a state. In the figure, 1, 31... pad material, 40... door casing, 41... pad material for door casing, 1'a, 1'b... first and second chip materials,
31', 41'...Block-shaped pad materials corresponding to the size of a plurality of pad materials.

Claims (1)

[Claims] 1 The lower mold is divided into a plurality of small chambers by a vertically movable partition wall, chip materials with different hardnesses are inserted into each of the small chambers of the lower mold, and the molds of the upper mold are matched with the lower mold to form each small chamber. At the same time, the partition wall is lowered from the bottom of the lower mold according to the mold matching of the upper mold, and the plurality of molded chip layers formed in each chamber are integrated, and the upper and lower molded chip layers are formed. 1. A method for manufacturing a pad material made of a molded chip material, which comprises forming a pad material made of a molded chip layer having continuous hardness in a direction and having a plurality of hardnesses when viewed from a plane.