JPH0342197B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to a composite support that can firmly hold a relief image obtained using a photosensitive resin. Conventionally, in order to firmly hold the relief of photosensitive resin on the support, an adhesive layer is interposed on the support, and then the photosensitive resin is laminated on the adhesive layer, and then exposed to light. A method is used in which the relief image and the support are firmly bonded by curing the relief image. The adhesive layer in such a composite support is required to hold the support and relief with sufficient adhesive strength during normal plate making, printing processes and handling. Specifically, it is desirable that the adhesive strength does not decrease due to the influence of temperature, humidity, solvent, etc. in each step. In addition, in order to expand the market for printing plates, various photosensitive resin compositions with different chemical and physical properties have been commercialized to meet the required characteristics for each printing application. There is a need for a composite support that is also applicable to these photosensitive resin compositions. However, an adhesive layer that completely satisfies all of the above conditions has not been known to date. The present inventors have conducted various studies on adhesive compositions in order to solve the above-mentioned drawbacks of the conventional technology, and as a result, it has been found that an adhesive composition made of a special diene-based polymer and resin can serve as an adhesive layer without the above-mentioned drawbacks. They discovered this and completed the present invention. That is, the present invention provides a composite support for a photosensitive resin printing plate in which an adhesive layer is provided on a flexible support, in which the adhesive layer is made of a diene having a molecular weight of 500 to 6000, which has or does not have a functional group at the end. This composite support for photosensitive resin printing plates is an adhesive composition comprising 2 to 50 parts by weight of a polymer and a resin that forms a three-dimensional network structure and hardens through repeated ionic addition reactions. The composite support for photosensitive resin printing plates of the present invention (hereinafter referred to as composite support) contains a diene polymer that has a strong affinity with the photosensitive resin composition as an adhesive layer. The adhesive force with the photosensitive resin is improved, the range of application is widened, and the conventional inconvenience of using different composite supports for each photosensitive resin is eliminated. In addition, disadvantages observed in composite supports other than those of the present invention, such as poor resistance to developing chemicals used during plate making, printing ink during printing, washing oil, etc., deterioration of adhesive performance over time, and under high temperature conditions. Poor workability caused by increased adhesive strength on the surface of the adhesive layer is greatly improved. The diene polymer used in the present invention has a molecular weight of 500 to 500, with or without a terminal functional group.
6000 diene or monoene copolymer. If the molecular weight is less than 500, the adhesive layer will not have sufficient physical properties;
Above this amount, the compatibility with other components becomes poor. Terminal functional groups include hydroxyl group, carboxyl group,
Those having an amino group, an epoxy group, an isocyanate group, a thioisocyanate group, etc. are used.
In addition, as dienes, butadiene, isoprene,
Piperine, chloroprene, etc., and monoene copolymers include isobutylene, styrene-butadiene rubber, acrylonitrile-butadiene rubber, etc. Particularly effective ones include polybutadiene glycol which has hydroxyl groups at both ends of the polybutadiene chain of 1,2 polybutadiene, polybutadiene dicarboxylic acid which has carboxyl groups, and dicarboxylic acid obtained by reacting polybutadiene glycol with polyisocyanate. Examples include polydienes having isocyanate groups at the ends, methacrylic or acrylic-terminated polybutadienes, maleated polybutadienes, and epoxidized polybutadienes. Furthermore, those having a hydroxyl group or carboxyl group introduced into the main chain can also be used. The amount used is 2 to 50% by weight based on the entire adhesive composition. When the amount is less than this, it is difficult to obtain adhesive strength to the photosensitive resin composition. Moreover, if the amount is more than this, the compatibility with other components becomes poor, the adhesive force with the support is reduced, and the resistance to organic solvents, ink, washing oil, etc. is reduced, which is not preferable. In addition, the surface of the adhesive becomes highly sticky, causing problems such as blocking between films, handling work, and film runnability in plate-making equipment. The ionic addition reaction referred to in the present invention is a reaction in which functional groups bond to each other nucleophilically or electrophilically without elimination of low molecular weight compounds, and such reactions include:
Examples of reactions between a functional group having an active hydrogen group and a functional group that can be ionically added thereto include a urethanization reaction and an epoxy ring-opening reaction. The resin used in the present invention, which is cured by forming a three-dimensional network structure through repeated ionic addition reactions, has, for example, a plurality of active hydrogen groups such as a hydroxyl group, an amino group, a carboxyl group, or an active hydrogen group. It can be added ionically depending on the functional group it has. Solvent-soluble polyurethanes, polyureas, polyamides, polyester and epoxy resins, unsaturated polyester resins, acrylic resins, phenolic resins, melamine resins, alkyd resins having multiple functional groups such as isocyanate groups, thioisocyanate groups, epoxy groups, etc. etc. In order to improve the coating performance of the adhesive, it is preferable to use a low molecular weight compound having a plurality of functional groups having active hydrogen or functional groups that can be ionically added by active hydrogen. For example, examples of these compounds include:
trimethylolpropane, petaerythritol,
Examples include hexanediol, polyisocyanate compounds to which tolylene diisocyanate is added, and polycarboxy compounds to which succinic anhydride is added. The adhesive composition used in the present invention is prepared by dissolving 2 to 50 parts by weight of the diene polymer and 98 to 50 parts by weight of the resin using a solvent. The diene polymer may have a three-dimensional structure or may simply be impregnated. At this time, 0.1 to 10% by weight of a known photopolymerization initiator may be added to the adhesive composition for the purpose of promoting adhesion with the photosensitive resin, and dyes, pigments, and ultraviolet rays may be added for the purpose of preventing halation caused by ultraviolet rays. For the purpose of adding an absorbent and adjusting the surface tack of the adhesive layer, fine powder of hydrophobic silica is also added. The method for producing the support of the present invention includes coating the support using a conventional coating method such as a gravure coater, roll coater, bar coater, kiss coater, reverse coater, or spray, and then removing the solvent by drying. A method is taken to do so. Further, in order to increase the reactivity of the applied and dried adhesive composition, ripening at 40 to 50°C, a so-called aging treatment, is generally performed. On the other hand, in order to prevent blocking due to stickiness on the surface of the adhesive, interleaf paper may be added during coating. Flexible supports used in the present invention include flexible supports with a thickness of 50 μm to 3 mm, such as polyester, polyvinyl chloride, polyethylene, polypropylene, polyacetate, aluminum, steel, natural paper, and synthetic paper. etc. A representative example of the photosensitive resin composition used in the present invention is a composition comprising a prepolymer having an ethylenically polymerizable unsaturated group and, if necessary, an ethylenically unsaturated monomer, a photopolymerization sensitizer, and a thermal polymerization inhibitor. There is.
Examples of the above prepolymers include unsaturated polyesters, unsaturated polyurethanes, oligoester acrylates, unsaturated polyamides, unsaturated polyimides, unsaturated polyethers, unsaturated poly(meth)acrylates, and various modified products thereof, and carbon-carbon dioxide. Examples include various rubber compounds having multiple bonds. These prepolymers having a number average molecular weight of substantially 500 or more are generally used. To give more specific examples, examples of unsaturated polyesters and alkyds include unsaturated dibasic acids such as maleic acid, fumaric acid, and itaconic acid, or their acid anhydrides, and ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, and glycerin. , trimethylolpropane, pentaerythritol, 1,4-polybutadiene with terminal hydroxyl groups, hydrogenated or non-hydrogenated 1,2
- Polyesters with polyhydric alcohols such as polybutadiene, butadiene-styrene copolymers, butadiene-acrylonitrile copolymers, etc., in which some of the acid components are added to succinic acid, adipic acid, phthalic acid, isophthalic acid, phthalic anhydride, trimellitic acid Examples of unsaturated polyurethanes include polyesters substituted with saturated polybasic acids, such as polyesters, and polyesters modified with drying oil fatty acids or semi-drying oil fatty acids.
That is, compounds in which addition-polymerizable unsaturated groups are introduced using the terminal isocyanate groups or hydroxyl groups of compounds that are linked via urethane groups derived from polyols and polyisocyanates having two or more terminal hydroxyl groups, such as the polyols mentioned above. Polyols such as alcohols, polyester polyols, and polyether polyols have terminal hydroxyl groups,
1,4-polybutadiene, hydrogenated or non-hydrogenated 1,2
-Polybutadiene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer and toluylene diisocyanate, diphenylmethane-
4,4'-diisocyanate, hexamethylene diisocyanate, and other polyisocyanates into which unsaturated groups are introduced using the terminal isocyanate or hydroxyl group reactivity of polyurethane, i.e., among the above-mentioned unsaturated carboxylic acids or their esters. Compounds into which an unsaturated group is introduced by reacting a compound having active hydrogen such as a hydroxyl group, carboxyl group, or amino group with an isocyanate, or a compound into which an unsaturated group is introduced by reacting a compound having a carboxyl group with a hydroxyl group, or the unsaturated group mentioned above. Compounds such as saturated polyester linked with polyisocyanate, etc.
Oligoester acrylates are produced by co-condensing acrylic acid or methacrylic acid in the ester reaction system of polybasic acid and polyhydric alcohol, adjusting the molar ratio of each, and producing a molecular weight of 200.
~5000, such as adipic acid, phthalic acid, isophthalic acid, or acid anhydride, and polyhydric alcohols such as ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, glycerin, trimethylolpropane, and pentaerythritol. Epoxy groups obtained by condensation of acrylic acid or methacrylic acid in the coexistence of an ester reaction system, epoxy acrylates, such as polyhydric alcohols, polyhydric phenols, or polycondensation reactions of polyphenols with epichloro and dorine or alkylene oxides. and esters of acrylic acid or methacrylic acid, polymer compounds with addition-polymerizable carbon-carbon double bonds in their side chains, such as polyvinyl alcohol, polymer compounds with hydroxyl groups such as cellulose, and unsaturated carboxylic acids. or a compound obtained by reacting with the acid anhydride thereof, or a polymer compound having a carboxyl group such as a polymer or copolymer of acrylic acid or methacrylic acid, and an unsaturated alcohol, glycidyl acrylate or methacrylate is ester bonded to the compound. Copolymers containing glycidyl acrylate or methacrylate as a copolymerization component and acrylic acid or methacrylic acid, such as copolymers containing maleic anhydride and allyl alcohol, hydroxyalkyl acrylate or methacrylate, etc. Examples include reactants. In addition, various rubber compounds include ()1,4-polybutadiene, 1,
2-polybutadiene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer,
EPDM, () Hydrogenated products of () above, isobutylene-isoprene copolymers, ethylene propylene copolymers, and unsaturated compounds in which ethylenically unsaturated groups are introduced by known techniques into various rubbers or higher compounds shown in (). Examples include modified rubber. ()
Although the compound can be used as it is, in order to introduce the unsaturated group, it is convenient to use various rubber compounds having a terminal functional group. Also, 1,2-
In the case of a rubber compound having a polybutadiene segment, the unsaturated group can be easily introduced by adding maleic anhydride to the compound. As prepolymers other than those mentioned above, there is no problem in using compounds that do not contain double bonds and are photopolymerized by a mechanism other than the addition of ethylenic double bonds, such as water-soluble nylon, polyvinyl alcohol, and derivatives thereof. Various known compounds can be used as the ethylenically unsaturated monomer, and examples of such compounds include unsaturated carboxylic acids such as acrylic acid and methacrylic acid, or esters thereof, such as alkyl-, cyclo-, Mono- or Acrylamide, methacrylamide or derivatives thereof, such as diacrylates and methacrylates, trimethylolpropane triacrylates and methacrylates, pentaerythritate tetraacrylates and methacrylates, e.g. Allyl compounds such as allyl alcohol, allyl isocyanate, diallyl phthalate, triallyl cyanurate, etc., maleic acid, maleic anhydride, fumaric acid or esters thereof, such as mono- or dimaleates and fumarates of alkyl, alkyl halides, alkoxyalkyl, other unsaturated compounds such as styrene, vinyltoluene, divinylbenzene, N-vinylcarbazole, N-vinylpyrrolidone, etc. . In addition, a part of these monomers may be added to an azide compound such as 4,4'-diazidostilbene, p-phenylene-
Bisazide, 4,4-diazidebenzophenone,
4,4-diazidophenylmethane, 4,4'-diazidochalcone, 2,6-di(4'-azidobenzal)-cyclohexanone, 4,4'-diazidostilbene-α-carboxylic acid, 4,4 '-Diazido diphenyl, 4,4'-diazidostilbene-2,2'-
It can be replaced with sodium disulfonate, etc. These monomers may be added in an amount of 0 to 200 parts by weight per 100 parts by weight of the prepolymer. As the photopolymerization sensitizer, various known photosensitizers can be used. Examples of such substances include benzoin, benzoin alkyl ethers such as benzoin ethyl ether, benzoin-n-propyl ether, benzoin-isopropyl ether, benzoin isobutyl-ether, 2,2-
Compositions include dimethoxy-2-phenylacetophenone, benzophenone, benzyl, diacetyl, diphenyl sulfide, eosin, thionine 9,10-anthraquinone, 2-ethyl-9,10-anthraquinone, Michler's ketone, etc. It can be used in a range of 0.001 to 10% by weight. As a thermal polymerization inhibitor, hydroquinone, mono-tert-butylhydroquinone, benzoquinone, 2,5
-diphenyl-p-benzoquinone, picric acid,
Examples include di-p-fluorophenylamine, p-methoxyphenol, and 2,6-di-tert-butyl-p-cresol. It is desirable that these thermal polymerization inhibitors prevent thermal polymerization reactions (dark reactions). Therefore, it is desirable that the amount of the thermal polymerization inhibitor added is in the range of 0.005 to 5.0% by weight based on the total amount of the prepolymer and the crosslinking agent. In addition, a composition comprising polyele, polythiol, and photosensitizer disclosed in Japanese Patent Publication No. 46-29525 is also useful. As shown in FIG. 1, the composite support of the present invention has a structure in which the adhesive composition is applied onto the flexible support 1 to form an adhesive layer 2. is firmly adhered to the support 1. In this case, the thickness of the adhesive layer 2 is 0.5 to 400 microns, preferably 3 to 100 microns. especially,
If the thickness of the adhesive layer 2 exceeds the thickness of the support 1, "wrinkles" may occur due to the difference in mutual expansion coefficients, so the thickness of the adhesive layer 2 must be equal to or less than the thickness of the support 1. . A photosensitive resin printing plate using the composite support of the present invention is produced by the following method. That is, the second
As shown in the figure, after providing an uncured photosensitive resin composition layer 3 on the adhesive layer 2 of the composite support of the present invention,
As shown in FIG. 3, a transparent image carrier 4 having a photograph of characters, patterns, halftone dots, etc. is placed on the uncured photosensitive resin composition layer 3 of FIG. Light source A, for example, irradiates light ray a from an ultraviolet fluorescent lamp, a mercury lamp, a carbon affix lamp, etc., and applies the image of the transparent image carrier 4 to the uncured photosensitive resin composition layer 3, thereby exposing the composition layer 3 to light ( The irradiated portion is substantially polymerized and cured. Next, a photosensitive resin printing plate is manufactured by performing usual operations such as removing the transparent image carrier 4, removing uncured areas, washing, drying, and re-irradiation. In this operation, the thickness of the photosensitive resin layer 3, the irradiation time and intensity of the light beam a, etc. are selected depending on the intended use of the printing plate to be produced and the type of the photosensitive resin composition 3 used. In this manufacturing method, when a transparent support is used as the support 1, as shown in FIG.
Alternatively, a method may be used in which the photosensitive resin composition 3 in contact with the adhesive layer 2 is polymerized and cured to a thickness of, for example, about 0.1 micron to 0.3 mm by irradiating the photosensitive resin composition 3 with the light beam b from the adhesive layer 2. In addition, in order to reduce the amount of photosensitive resin used in the plate making of photosensitive resin printing plates, a method is used in which the thickness of the relief is reduced, but in this case, the ink during printing is applied to the non-image areas. For the purpose of preventing it from adhering to
As shown in the figure, a net-like screen image carrier 5 is placed on the opposite side of the adhesive layer 2 of the transparent support 1, and a light beam b from an active light source B is irradiated through the screen image carrier 5, so that it is in contact with the adhesive layer 2 and A method of forming a relief 6 may also be used. Hereinafter, the present invention will be explained in detail with reference to Examples.
In addition, in Examples and Comparative Examples, parts mean parts by weight. Furthermore, the adhesive strength was measured as follows. [Method for Measuring Adhesion] A photosensitive resin printing plate was prepared using the composite support to be evaluated and various photosensitive resin compositions by the method shown in Figs. Make a strip-shaped peel test sample, and as shown in Figure 6, attach the above sample to the Instron measuring machine by fixing the relief side to the upper chuck and fixing the base film to be measured to the lower chuck. It is pulled at a speed of 50 mm/min, and the peel resistance value at this time is taken as the adhesive strength. At this time, an auxiliary plate (iron plate) is provided on the measurement sample so that the peeling angle is 180 degrees. Example 1 and Comparative Example 1 Polyester film with a thickness of 0.1 mm (product name:
Diafoil (manufactured by Diafoil Co., Ltd.), 60 parts of urethane adhesive (product name: Olivine AD-335A, manufactured by Toyo Morton Co., Ltd.), and urethane curing agent (product name:
An adhesive composition obtained by dissolving and mixing 5 parts of CAT-10 (manufactured by Toyo Morton Co., Ltd.), 20 parts of 1,2 polybutadiene glycol (molecular weight: 1000), and 5 parts of benzoin isopropyl ether in ethyl acetate was coated with a bar coater. The composite support was coated to a thickness of about 10 μm and dried and cured at 80° C. for 4 hours to obtain a composite support. On the other hand, place a negative film on a 7 mm thick transparent glass plate, and then place a 9 μm thick film on the negative film.
After placing a transparent polyester film to cover the negative film, a photosensitive resin composition having the composition shown below was coated onto the transparent polyester film to a thickness of 1 mm using a doctor knife. Propylene glycol, ethylene glycol, fumaric acid, and adipic acid in molar ratios.
Condensation was carried out in the ratio of 0.30/0.20/0.25/0.25 to obtain an unsaturated polyester with an acid value of 25, and to 100 parts of this unsaturated polyester, 40 parts of tetraethylene glycol dimethacrylate, 5 parts of acrylamide,
15 parts of N-3-oxo-1,1-dimethylbutylacrylamide, 2 parts of benzoin ethyl ether
A photosensitive resin composition containing parts. Polypropylene adipate (number average molecular weight
1000) Toluylene diisocyanate to 1.0Kg
Add 0.348Kg, then add 0.01% dibutyltin dilaurate to the total of 0.75Kg of polypropylene adipate and polyethylene glycol (number average molecular weight 1500) to be reacted.
After reacting at 50°C for 3 minutes, the temperature was raised to 70°C and the reaction was continued for an additional 30 minutes. Then cool to 60℃
Add 0.02% dibutyltin laurate, then add polyethylene glycol and react for 30 minutes, then raise the temperature to 85°C and react for 2 hours.
After the completion of the reaction, hydroxypolyethylene glycol monoacrylate-7 was heated at the same temperature of 85 to 90°C.
(Number average molecular weight 390) 0.39Kg and the above total amount
Add 0.025% hydroquinone and react for 4 hours. To 100 g of the vinyl-terminated prepolymer thus obtained, 10 g of 2-hydroxyethyl methacrylate, 30 g of hydroxypolyethylene glycol monomethacrylate and 10 g of 2EHA were added.
A photosensitive resin composition containing a crosslinking agent consisting of g and 3 g of benzoin (photosensitizer). 220 g of hydrogenated 1,2-polybutadiene (average molecular weight n = 2200, hydrogenation rate 95%) with terminal hydroxyl groups having an average of 1.7 hydroxyl groups per minute and TDI
(2,4 bodies/2,6 bodies = 3/2) 22.2g mixed,
After reacting at 60℃ for 3 hours while stirring,
A mixture of 12 g of 2-hydroxyethyl methacrylate, 0.3 g of hydroquinone, and 0.6 g of dibutyltin dilaurate was added and reacted for 2 hours at 80°C to prepare a prepolymer with n=7300. A photosensitive resin composition containing 20 g of dimethacrylate (trade name NK Ester p-9G), 3 g of benzoin isoamyl ether, and 0.15 g of hydroquinone. 1,6-hexanediol 615g (5.22mol), neopentyglycol 233g (2.25mol)
Then, 867 g (5.94 mol) of adipic acid and 8 g of p-toluenesulfonic acid as an esterification catalyst were added, and a dehydration condensation reaction was carried out under normal pressure at 120 to 180°C in a nitrogen atmosphere for 2 hours, followed by a degree of vacuum of 300 to 30 mmHg,
The reaction was carried out at 220°C for 5 hours to synthesize polyester diol A ₁ , and then 404 g (0.40 mol) of this A ₁
87g of tolylene diisocyanate (0.50
mol) was added at once and reacted at 50 to 85°C for 4 hours to obtain a transparent sticky substance A ₂ (estimated molecular weight: 5000). Next, switch the reaction system to air atmosphere 3,5
- Add 0.1g of di-tert-butyl-4-hydroxytoluene (hereinafter abbreviated as BHT) and leave at 80℃.
After stirring for 10 minutes, epoxy ester D ₁ (hydroxyl value 550 mgKOH/g, acid value 5.3 mgKOH/g, glycerin monomethacrylate/glycolic acid
CMA adduct = 7/3 molar ratio) 46g (0.22mol)
and dibutyltin laurate (hereinafter abbreviated as BTL)
0.05g was added, and a reaction for introducing a vinyl group into _A2 was carried out at 80°C for 2 hours. Subsequently, the temperature of the oil bath was raised to 90°C, and 22 g (0.22 mol) of succinic anhydride ground in a mortar was added and reacted for 3 hours. The degree of progress of the half-esterification reaction with succinic anhydride was monitored by acid value every hour, and became almost constant after 3 hours, yielding a colorless and transparent highly sticky substance (1). The molecular weight of (1) is
5900, the unsaturation equivalent is estimated to be 2900, and its acid value is
It was 24mgKOH/g. Diethylene glycol methacrylate 30g
and 2-hydroxypropyl methacrylate 30
g, 3.2 g of benzoin isobutyl ether,
A photosensitive resin composition prepared by adding 100 g of substance (1) to a mixed solution of 0.1 g of BHT and stirring well. Then, the composite support was laminated onto the photosensitive resin composition so that the adhesive composition came into contact with the adhesive composition and no air bubbles were formed. This was placed 5 cm below a light source consisting of 10 20W ultraviolet fluorescent lamps, exposed through the composite support for 30 seconds, and then moved to a position 15 cm above the above light source to form a gas plate and negative film. Exposure was carried out for 10 minutes. After exposure, remove the uncured area.
When washed off with a 0.3% caustic soda aqueous solution and detergent (product name "Lipon-F" manufactured by Lion Corporation),
No peeling or blistering was observed in the thin hardened metal (5 μm) deposited on the adhesive layer side, and the halftone dots were also adhered and retained on the adhesive layer. Next, after drying at 50° C. for 15 minutes, it was placed at a position 15 cm from the light source and post-exposed for 10 minutes to obtain a printing plate. Surprisingly, the support of this printing plate adhered firmly to the various photosensitive resin compositions described above, and no abnormality was observed on the plate surface even after 500,000 copies were rotary printed using this printing plate. Table 1 shows the results of measuring the adhesive strength of the relief of the printing plate. Note that the composite support was heated to a high temperature (50°C),
The results of re-evaluation after aging for 30 days under high humidity (80% RH) conditions showed that the same adhesive strength was obtained and no change over time was observed, which was good. On the other hand, for comparison, 1,2 polybutadiene glycol was removed from the adhesive composition of Example 1.
The amount of AD-335A was adjusted so that the ratio of hydroxyl groups to isocyanate groups was the same balance as in Example 1, and it was applied onto a polyester film in the same manner as in Example 1, and dried and cured to obtain a composite support. . When this was laminated with a photosensitive resin composition in the same manner as in Example 1 and the adhesive strength was evaluated, it was found that when washing out after dispersion exposure, the cured film that had hardened and precipitated thinly peeled off and curled toward the relief side. Small halftone dots were also washed away. Adhesion strength after post-exposure is also shown.
As shown in Figure 1, the value was very low.

【table】 Example 2 and comparative example 2

[Table] The above components were dissolved and mixed in the same manner as in Example 1, coated on a support and dried to obtain a composite support. For comparison, a composite support was also prepared in which the 1,2 polybutadiene epoxy modified product of Example 2 was excluded. (Comparative Example 2) In order to evaluate the chemical resistance of this composite support, a 24-hour immersion test was conducted at 20°C in ethyl acetate, isopropyl alcohol, acetone, water, and 3% alkaline water. As a result, the results of Example 2 were good, with no swelling or peeling of the adhesive layer observed in any of them. On the other hand, in Comparative Example 2, swelling was observed in the presence of acetic acid and acetone. Next, the composite support of Example 2 was combined with the photosensitive resin composition of Example 1 and evaluated. the result,
Good adhesion results almost equivalent to those of Example 1 were obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the composite support for photosensitive resin printing plates of the present invention, and FIG. 2 is a layer of uncured photosensitive resin composition on the adhesive layer of the composite support for photosensitive resin printing plates of the present invention. The cross-sectional view shown in FIG. 3 shows a negative film placed on the uncured photosensitive resin composition layer shown in FIG.
FIG. 4 is a cross-sectional view of the printing plate after irradiation with light from the negative film side. A negative film is placed on the uncured photosensitive resin composition layer of FIG. 2, and light irradiation is performed from the negative film side and the support side. FIG. 5 is a cross-sectional view of the printing plate after carrying out this process. A negative film is placed on the uncured photosensitive resin composition shown in FIG. 2, and a screen negative film is placed on the support. FIG. 6 is a cross-sectional view of the printing plate after further light irradiation, and is a cross-sectional view of the procedure for measuring the peeling test of the printing plate made of the composite support of the present invention and the photosensitive resin composition. In the figure, 1 is a support, 2 is an adhesive layer, 3 is an uncured photosensitive resin composition layer, 4 is a transparent image carrier, 5 is a screen image carrier, 6 is a cured portion of the uncured photosensitive resin composition 3, 7 is an uncured portion of the uncured photosensitive resin composition 3, A and B are light sources, a,
10 is an upper chuck, 11 is a lower chuck, 12 is an auxiliary plate (iron plate), and 13 is an auxiliary film.

Claims (1)

[Claims] 1. In a composite support for photosensitive resin printing plates in which an adhesive layer is provided on a flexible support, the adhesive layer has a functional group at the end or has a molecular weight of 500 to 6000.
An adhesive composition for photosensitive resin printing plates comprising 2 to 50 parts by weight of a diene polymer and a resin that hardens by forming a three-dimensional network structure through repeated ionic addition reactions. Composite support.