JPH0342506B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a semiconductor chip manufacturing method for efficiently obtaining semiconductor chips from a semiconductor wafer.

(Description of prior art) First, a conventional method for completely cutting a semiconductor chip,
Figures 1 and 2a show how to supply B-stage curing type conductive resin for die bonding.
and b.

This FIG. 1 is a cross-sectional view. First, in order to fix the semiconductor wafer to the support plate, the support plate 13 (for example, a silicon wafer) is heated, the adhesive 12 (for example, wax) is melted, and the semiconductor wafer is fixed to the support plate 13. Make it stick.

Next, using a dicing saw, make a complete cut by making a cut until the depth reaches the support plate 13, and then heat the support plate 13 again and use the adhesive 12.
The divided chips 11 are separated from the support plate 13 by melting. Next, in order to clean the adhesive 12 adhering to the semiconductor chip 11, the semiconductor chip 11 is subjected to boiling cleaning using an organic solvent (for example, trichlene). Next, as shown in FIG. 2a (top view) and FIG. 2b (side view in FIG. 2), the completely divided semiconductor chips 21 are arranged in a tray 22 and printed on a B-stage by screen printing means. The resin is supplied to the back side of the semiconductor chip 21 and heated to 100°C.
Heat treatment is performed for 30 minutes to complete temporary curing of the die bonding resin, and the semiconductor chip 21 can then proceed to the die bonding process.

In this way, in the conventional method, the semiconductor chips are completely cut from the wafer and then the resin is printed and supplied to the semiconductor chips individually. Occasionally,
This had the disadvantage of having to handle broken semiconductor chips, which resulted in poor handling, increased man-hours, and poor manufacturing efficiency.

In addition, at the wafer stage, B-stage type resin is printed and supplied, heat-treated at 100°C for 30 minutes to form a B-stage, and then bonded to a support plate via wax, and then cut into the semiconductor wafer with a dicing saw. After that, the wafer is heated to remove it from the support plate, and then boiled with an organic solvent to clean the adhesive, which causes the B stage to be damaged by being dissolved in the heating agent, resulting in the die being damaged. There was a drawback that bonding was impossible.

(Objective of the Invention) The present invention has been made to eliminate the drawbacks of such conventional methods, and therefore, the purpose of the present invention is to provide a method that can efficiently and precisely manufacture semiconductor chips with B-stage cured resin. is to provide.

(Structure of the Invention) In order to achieve this object, according to the method of manufacturing a semiconductor chip of the present invention, a B-stage curing type resin is applied to the back surface of a semiconductor wafer, and after the resin is heated and cured, the cured resin is A water-soluble adhesive is applied on top to form two layers, the semiconductor wafer is fixed to the base substrate via this water-soluble adhesive, and then at least the semiconductor wafer and the cured resin are used to divide into semiconductor chips. A cut is made, and then the entire base substrate and the semiconductor wafer fixed thereto are placed in water to separate the B-stage cured resin-coated semiconductor chip from the base substrate and divide it into predetermined individual semiconductor chips. It is characterized by

(Description of Embodiments) Hereinafter, embodiments of the present invention will be described based on FIGS. 3a to 3e. Figures 3a to 3e are manufacturing process diagrams for explaining the method of the present invention, and each shows the state at each manufacturing stage in cross-sectional view, but is schematically shown to the extent that the present invention can be understood. It's just that.

First, as shown in FIG. 1a, a semiconductor wafer 3 is
After a B-stage curing type resin 32 is printed and coated on the back surface of 1, it is temporarily cured by heat treatment at a temperature of about 100° C. for about 30 minutes, for example. Next, the second
As shown in Figure b, a water-soluble adhesive 33 is applied onto this cured resin to form two layers of the cured resin and adhesive 33, and the resin 32 side of the semiconductor wafer is attached to the base via this water-soluble adhesive 33. Adhere to a substrate 34, e.g., a silicon wafer, e.g., at a temperature of about 80°C.
Fix by heating for 30 minutes.

Next, as shown in FIG. 3c, cuts 36 are made in the semiconductor wafer 31, B-stage cured resin 32, and water-soluble adhesive 33 to separate them into semiconductor chips 35 using a dicing saw, and these are completely cut. (Cut completely). At this stage, each semiconductor chip 35 is still fixed to the base substrate 34.

Next, the entire assembly of the semiconductor wafer 31 and the base substrate 34 in this state is as shown in FIG. 3d.
It is immersed in water 38, for example pure water, in a container 37 and left for about 12 to 24 hours, for example.

In this way, as shown in Figure 3e, B
Individual semiconductor chips 35 with stage cured resin
is obtained.

(Effects of the Invention) As is clear from the above, according to the method of manufacturing a semiconductor chip according to the present invention, a B-stage curing type resin is applied to the back surface of a semiconductor wafer and cured by heating. It is fixed to a base substrate via a water-soluble adhesive, and then, in order to divide into semiconductor chips, at least the semiconductor wafer and the cured resin are cut and placed in water, and then divided into individual semiconductor chips. As a result, the B-stage hardening type conductive resin can be supplied to the chips at the wafer level, which greatly improves handling compared to conventional chip-by-chip work, and significantly reduces the number of man-hours required for each work. This has the advantage that the manufacturing efficiency of semiconductor chips can be significantly improved.

In addition, in this description, there is an advantage that applying and dissolving the adhesive only need to be done in one operation.

In addition, since the chips and the base substrate are fixed using a water-soluble adhesive, the chips can be separated in water without boiling using conventional organic solvents. There is an advantage that there is no electrical influence on the stage-cured resin, and there is no risk of the resin melting or damaging the chip.

Further, according to the present invention, highly accurate dicing becomes possible, and the chip handling operation for the die bonding process after semiconductor chip formation becomes simple and easy.

Since the present invention has such advantages, it can be widely used for assembling highly accurate multi-module rules.

[Brief explanation of drawings]

FIGS. 1 and 2 a and b are diagrams for explaining a conventional semiconductor chip manufacturing method, and FIGS. 3 a to 3
FIG. 3e is a manufacturing process diagram for explaining one embodiment of the semiconductor chip manufacturing method of the present invention. 31... Semiconductor wafer, 32... B stage curing type resin, 33... Water-soluble adhesive, 34...
Base substrate, 35...semiconductor chip, 36...notch, 37...container, 38...water.

Claims (1)

[Claims] 1. Apply a B-stage curing type resin to the back side of the semiconductor wafer, heat and cure the resin, then apply a water-soluble adhesive on the cured resin to form two layers, and bond the semiconductor wafer through the water-soluble adhesive. is fixed to a base substrate, then cuts are made to divide at least the semiconductor wafer and the cured resin into semiconductor chips, and then the entire base substrate and the semiconductor wafer fixed thereto are soaked in water. 1. A method for manufacturing a semiconductor chip, characterized in that the semiconductor chip with a B-stage cured resin is disassembled from the base substrate.