JPS6035531A - Manufacture of semiconductor chip - Google Patents

Abstract

PURPOSE:To improve the handling property of semiconductor chips as well as to contrive to reduce the working manhour and to upgrade the manufacturing efficiency by a method wherein the supply to B stage curing type resin to the semiconductor chips is performed at the semiconductor wafer level. CONSTITUTION:B stage curing type resin 32 is applied by printing on the back surface of a semiconductor wafer 31. The resin 32 is temporarily cured by performing a heating treatment and bonded to a base substrate 34, for example, to a silcon wafer, through water-soluble bonding agent 33. Notches 36 are cut in the resin 32 by a dicing saw for dividing into semiconductor chips 35. Then, the whole assembled unit consisting of the semiconductor wafer 31 and the base substrate 34 is dipped in water 38 in a container 37 in this state and the semiconductor chips 35 are separated from the base substrate 34, thereby enabling to obtain individual semiconductor chips 35 with the B stage cured resin.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a semiconductor chip manufacturing method for efficiently obtaining semiconductor chips from a semiconductor wafer.

(Description of Prior Art) First, a conventional method for completely cutting a semiconductor chip and a method for supplying a B-stage hardening type resin for die bonding will be explained using FIGS. 1 and 2 (a) and (b). do.

This first IΔ is a cross-sectional view. First, in order to fix the semiconductor wafer to the support plate, the support plate 13 (for example, a silicon wafer) is heated, the adhesive 12 (for example, wax) is melted, and the semiconductor wafer is fixed to the support plate 13. let

Next, use a cutting tool to make a complete cut by making a cut until the depth reaches the support plate 13. Then, the support plate 13 is heated again to melt the adhesive 12 and the divided chips 11 are placed on the support plate. Separate from 13. Next, in order to clean the adhesive 12 stuck to the semiconductor chip 11, the semiconductor chip II is subjected to boiling cleaning with an organic solvent (for example, trichlene). Next, Figure 2 (a) (plan view)
And as shown in FIG. 2(b) (side view of FIG. 2), the completely divided semiconductor chips 21 are arranged in a tray 22, and B-stage type resin is supplied to the back side of the semiconductor chips 21 by screen printing means. Then, a heat treatment of 100'0 x 30 minutes is performed to complete the temporary curing of the die bonding resin, so that the semiconductor chip 21 can proceed to the die bonding process.

In this way, in the conventional method, the semiconductor chips are completely cut from the wafer and then resin is printed and supplied to the semiconductor chips individually.
During each of cleaning and (3) resin printing, it is necessary to handle the semiconductor chips in pieces, which has disadvantages in that handling is poor, man-hours are required, and production efficiency is poor.

In addition, at the wafer stage, a B-stage type resin is printed and supplied, heat-treated at 100°C for 30 minutes to form a B-stage, and then bonded to a support plate via wax, and then heated with a guising tool to the conductor wafer. After cutting the wafer, the wafer is heated and removed from the support plate, and then boiled with an organic solvent to clean the adhesive.
The disadvantage was that the stage was damaged by being dissolved by the heated solvent, making die bonding impossible.

(Objective of the Invention) The present invention has been made to eliminate the drawbacks of such conventional methods, and therefore, an object of the present invention is to provide a method that can manufacture semiconductor chips efficiently and with high precision.

(Structure of the Invention) In order to achieve the objective 1), according to the semiconductor chip manufacturing method of the present invention, after coating the back surface of a semiconductor wafer with a B-stage curing type resin and curing it by heating, This semiconductor wafer is fixed to a base substrate via a water-soluble adhesive, and then at least the semiconductor wafer and the resin are cut to be divided into semiconductor chips. The method is characterized in that the entire semiconductor wafer is placed in water, and the semiconductor chips are separated from the base substrate and divided into predetermined individual semiconductor chips.

(Description of Examples) Hereinafter, examples of the present invention will be described based on FIGS. 3(a) to (e). FIGS. 3(a) to 3(e) are manufacturing process diagrams for explaining the present invention in detail, and each shows the state at each manufacturing stage as a cross-sectional view, but it is sufficient to understand the present invention. This is only a schematic representation.

First, as shown in FIG. 1(a),
B-stage hardening type resin 32 is printed on the back side of 1'4
113, this is heat-treated for about 30 minutes at a temperature of, for example, about 100° C. for temporary hardening. Next, Figure 2 (b
), this resin-coated semiconductor wafer 31 is bonded with the resin 32 side to a base substrate 34, for example, a silicon wafer, via a water-soluble adhesive 33.

It is fixed by heat treatment at a temperature of about 80°C for about 30 minutes.

Next, as shown in FIG. 3(c), the semiconductor wafer 31. Cuts 36 are made in the B-stage cured resin 32 and water-soluble adhesive 33 to divide them into cliff conductor chips 35, and these are completely cut. At this stage, each semiconductor chip 35 is still fixed to the base substrate 34.

Next, the semiconductor wafer 31 and base substrate 34 in this state are
The entire assembly is shown in FIG. 3(d).

It is immersed in water 38, for example pure water, in a container 37 and left for about 12 to 24 hours, for example.

In this way, as shown in FIG. 3(e), individual semiconductor chips 35 made of B-stage cured resin can be obtained.

(Effects of the Invention) As is clear from the above, according to the semiconductor chip manufacturing method of the present invention, B is added to the surface of the semiconductor wafer.
A stage curing type resin is applied and cured by heating, and then this is fixed to a base substrate via a water-soluble adhesive. After that, at least the semiconductor wafer and the cured resin are cut in order to be divided into semiconductor chips. By placing the chips in water and dividing them into individual semiconductor chips, the supply of B-stage hardening type resin to the chimps can be done at the wafer level, which eliminates the need for conventional chip-by-chip operations. This method has the advantage that the handling properties are extremely improved compared to the conventional method, and the number of man-hours required for each operation can be significantly reduced, resulting in a marked improvement in semiconductor chip manufacturing efficiency.

In addition, since the chip and the paste substrate are fixed using a water-soluble adhesive, the chip can be separated underwater without boiling using an organic solvent as in the past. This has the advantage that there is no risk of damage to the chip due to melting of the stage curing resin.

Further, according to the present invention, highly accurate guising becomes possible, and the chip handling operation for the die-sponging process after semiconductor chip formation becomes simple and easy.

Since the present invention has such advantages, it can be widely used in assembling high-precision multi-chip modules.

[Brief explanation of drawings]

Figures 1 and 2 (a) and (b) are diagrams for explaining the conventional semiconductor chip manufacturing method, and Figures 3 (a) to (
e) is a manufacturing process diagram for explaining one embodiment of the method for manufacturing a semiconductor chip of the present invention. 31... Semiconductor wafer 32... B stage curing type resin 33... Water-soluble adhesive 34... Base substrate 35.
...Semiconductor chip 36...Notch 37...Container 38...Water. Patent applicant Oki Electric Industry Co., Ltd. Figure 1 L! Figure 2 Figure 3 (e) 5

Claims (1)

[Claims] A B-stage curing type resin is applied to the back surface of a semiconductor wafer, and after the resin is heated and cured, the semiconductor wafer is fixed to a base substrate via a water-soluble adhesive, and then at least the semiconductor wafer and the resin are bonded. A semiconductor characterized in that a cut is made to divide the semiconductor chips, and then the entire base substrate and the semiconductor wafer fixed thereto are placed in water to separate the semiconductor chips from the base substrate. How to make chips.