JPH0342848A - Semiconductor device - Google Patents

Abstract

PURPOSE:To conduct stable positioning among projecting electrode pads by connecting the electrode pad, one part of a nose of which is inserted into the through-hole of a wiring board, and the conductive layer of the electrode pad while forming a wiring shaped into an element forming layer. CONSTITUTION:In the semiconductor device, a projecting electrode pad 1 having a conductive layer 2 connected to wirings 7 in an element forming layer 8 formed onto a semiconductor chip 9 is shaped, and conductive layers 6 are formed onto the inwalls and surfaces of the through-holes 5 of a wiring board 4. According to such structure, even when the semiconductor chip 9 is loaded on the wiring board 4, the projecting electrode pad 1 of the semiconductor chip 9 is inserted to the edge sections of the through-holes 5 of the wiring board 4, and connected by the conductive layers 6 and the conductive layer 2. As a result, the semiconductor chip 9 is positioned automatically by the electrode pad 1 and the through-holes 5 on loading. Consequently, the connecting pad sections of the wiring board on which the semiconductor chip is loaded is inserted into the through-holes, thus performing stable positioning.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a bat structure for external connection of a semiconductor device.

[Conventional technology]

Conventionally, when this type of semiconductor device is mounted on a wiring board, the bump-structured electrode pads of the semiconductor device and the pad portions of the wiring board are butted against each other and connected by soldering.

[Problem to be solved by the invention]

However, in the conventional semiconductor device described above, when the external connection pad section formed on the semiconductor chip and the semiconductor chip are mounted on the pad section on the wiring board and connected, the external connection pad section formed on the semiconductor chip and the semiconductor chip are mutually convex shapes. , it becomes unstable when mounted, and has the drawback that it is difficult to ensure stable alignment accuracy between these pads.

An object of the present invention is to provide a semiconductor device that solves this problem.

[Means to solve the problem]

The semiconductor device of the present invention includes a convex electrode pad whose tip is partially inserted into a through hole of a wiring board, and a wiring connected to a conductive layer of the electrode pad and formed in an element formation layer. have.

〔Example〕

Next, the present invention will be explained with reference to the drawings. 1 is a perspective view of a semiconductor device and a wiring board showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of section A in FIG. 1. As shown in FIG.
This is because a convex electrode pad 1 having a convex shape is provided.

On the other hand, a conductive layer 6 is formed on the inner wall and surface of the through hole 5 of the wiring board 4.

By adopting such a structure, for example, even when the semiconductor chip 9 is mounted on the wiring board 4 as shown in FIG. 1, the convex electrode pads 1 of the semiconductor chip 9 can be It is fitted into the etched portion of the through hole 5 of the wiring board 4 and connected to the conductive layer 6 and the conductive layer 2. Therefore, when the semiconductor chip 9 is mounted, it is automatically positioned between the electrode pads 1 and the through holes 5.

〔Effect of the invention〕

As explained above, in the present invention, by making the electrode pad of a semiconductor device into a convex shape, it can be fitted into the through hole of the connection pad part of the wiring board on which the semiconductor chip is mounted, so that stable alignment is expected. This has the effect of making it possible to obtain a semiconductor device that can be manufactured.

[Brief explanation of drawings]

1 is a perspective view of a semiconductor device and a wiring board showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of section A in FIG. 1. 1... Convex electrode pad, 2, 6... Conductive layer, 3, 7
... Wiring, 4... Wiring board, 5... Through hole, 8... Element formation layer, 9... Semiconductor chip.

Claims (1)

[Claims] A semiconductor device having a convex electrode pad whose tip is partially inserted into a through hole of a wiring board, and a wiring connected to a conductive layer of the electrode pad and formed in an element formation layer.