JPH0343683B2 - - Google Patents
Info
- Publication number
- JPH0343683B2 JPH0343683B2 JP59109820A JP10982084A JPH0343683B2 JP H0343683 B2 JPH0343683 B2 JP H0343683B2 JP 59109820 A JP59109820 A JP 59109820A JP 10982084 A JP10982084 A JP 10982084A JP H0343683 B2 JPH0343683 B2 JP H0343683B2
- Authority
- JP
- Japan
- Prior art keywords
- wear
- layer
- resistant layer
- recess
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/255—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features comprising means for protection against wear
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/1871—Shaping or contouring of the transducing or guiding surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、情報処理装置におけるフアイル手段
として使用される磁気テープ装置等の磁気ヘツド
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing a magnetic head of a magnetic tape device or the like used as a file means in an information processing device.
〔技術の背景〕
第１図は磁気ヘツドのギヤツプ周辺を拡大して
示す断面図である。磁気テープ装置等の磁気ヘツ
ドは、磁気テープ等の記録媒体が摺動するため、
ギヤツプG1，G2の周辺のテープ摺動面は、外来
ノイズシールド用の銅メツキ層１の上に硬質クロ
ムやセラミツク等の被覆（耐摩耗層）２を施し、
耐摩耗性を高める工夫がなされている。[Technical Background] FIG. 1 is an enlarged sectional view showing the vicinity of the gap of a magnetic head. In magnetic heads such as magnetic tape devices, recording media such as magnetic tapes slide, so
The tape sliding surfaces around the gaps G 1 and G 2 are covered with a coating (wear-resistant layer) 2 of hard chrome, ceramic, etc. on a copper plating layer 1 for external noise shielding.
Efforts have been made to increase wear resistance.
このように銅メツキ層や耐摩耗層を形成するに
は、次のような工程で行なわれる。 In order to form the copper plating layer and the wear-resistant layer in this way, the following steps are performed.
(1) ヘツド面を研削して、図示のような凹凸曲面
３を形成する。(1) Grind the head surface to form an uneven curved surface 3 as shown.
(2) 銅メツキを処理すべき個所以外をマスクす
る。(2) Mask areas other than those where copper plating should be applied.
(3) メツキ槽に磁気ヘツドを浸漬して、銅メツキ
１を施す。(3) Immerse the magnetic head in the plating bath and apply copper plating 1.
(4) マスクを除去する。(4) Remove the mask.
(5) 該銅メツキ層の表面を研磨して、所定の形状
に成形する。(5) Polishing the surface of the copper plating layer and shaping it into a predetermined shape.
(6) 研磨後の銅メツキ層１の上に再度マスクを行
ない、硬質クロムメツキやセラミツク溶射を行
うべき個所のみを露出させる。(6) Mask the polished copper plating layer 1 again to expose only the areas where hard chrome plating or ceramic spraying should be performed.
(7) 銅メツキ層の上に硬質クロムをメツキするか
セラミツク溶射を行なう。(7) Plate hard chromium or spray ceramic on top of the copper plating layer.
(8) マスクを除去する。(8) Remove the mask.
(9) 硬質クロムまたはセラミツクから成る耐摩耗
層２の表面を研削して最終仕上げする。(9) The surface of the wear-resistant layer 2 made of hard chrome or ceramic is ground to give a final finish.
このように導体メツキ層や耐摩耗層を形成する
たびに、研削が行なわれ、図示のようにリード・
ライトギヤツプG1，G2の付近が４G1，４G2のよ
うに突出し、該ギヤツプ部凸部４G1，４G2の両
側に更に別の凸部５１，５２が形成されるように
加工される。このような形状にすることが、磁気
テープ等を走行させて情報の読書きを行う場合、
最も優れた条件が得られる。 Grinding is performed each time a conductor plating layer or a wear-resistant layer is formed in this way, and as shown in the figure, the lead
The vicinity of the light gaps G 1 and G 2 protrude as 4G 1 and 4G 2 , and further protrusions 51 and 52 are formed on both sides of the gap portion protrusions 4G 1 and 4G 2 . This shape is useful when reading and writing information by running a magnetic tape, etc.
The best conditions can be obtained.
ところでギヤツプG1，G2の付近は、パーマロ
イなどの磁性材からなるコア材６が、ギヤツプ
G1，G2とほぼ平行になるように切り立つている
ので、導体メツキ層１の上に耐摩耗層２を被せる
だけで、軟質の導体メツキ層１は、テープ摺動面
に露出しなくなる。この点は、特開昭56−34127
号公報にも記載されている。
By the way, in the vicinity of the gaps G 1 and G 2 , the core material 6 made of a magnetic material such as permalloy is
Since the conductor plating layer 1 is steeply erected so as to be almost parallel to G 1 and G 2 , simply by covering the conductor plating layer 1 with the abrasion resistant layer 2, the soft conductor plating layer 1 is not exposed to the tape sliding surface. This point is explained in Japanese Unexamined Patent Publication No. 56-34127.
It is also stated in the publication.
これに対し、ハウジング部ないしコア材６に
は、導体メツキ層１および耐摩耗層２の外側即ち
磁気ヘツド端部７１，７２側の位置に、８１，８
２で示すような窪みが形成され、磁気テープＴと
接触しないよに逃げている。そのために、コア材
６ないしハウジング部を、ギヤツプ部のように切
り立つた形状にできず、導体メツキ層１の端部が
露出する。このように軟質の導体メツキ層１が露
出すると、耐摩耗層形成後の最終研削加工時に、
導体メツキ層材で研削工具が目詰まりを起こす。 On the other hand, the housing part or the core material 6 has 81, 8 on the outside of the conductor plating layer 1 and the wear-resistant layer 2, that is, on the side of the magnetic head ends 71, 72.
A depression as shown in 2 is formed and escapes from contact with the magnetic tape T. Therefore, the core material 6 or the housing part cannot be formed into a steep shape like a gap part, and the ends of the conductor plating layer 1 are exposed. When the soft conductive plating layer 1 is exposed in this way, during the final grinding process after forming the wear-resistant layer,
The grinding tool gets clogged with the conductive plating layer material.
耐摩耗層を硬質クロムで形成する場合はさほど
問題とならないが、硬質クロムはメツキ膜厚を得
るのに時間がかかる。セラミツク溶射は短時間で
行えるが、セラミツクは材質が硬く脆いため、そ
れに対応してセラミツク層形成後の研削には、ダ
イヤモンドなどのような硬質の砥石が使用され
る。ところが硬質クロムで耐摩耗層を形成する場
合と同じ手法で導体メツキ層１を形成しているた
めに、軟質の導体メツキ層の端部が露出し、硬質
砥石による研削加工時に、導体メツキ層によつて
砥石が目詰まりを起こし易い。目詰まりを起こす
と、砥石の研削能力が低下して摩擦熱を発生し、
ますます研削条件が悪化する。そのために耐摩耗
層２の窪み８１，８２側の端縁のみ研削不良とな
り、特に目詰まりした砥石で無理に研削を続ける
ために、導体メツキ層１の端縁に発生したバリが
肥大したり砥石に引つ掛かつたりすることによ
り、脆いセラミツク層２の端縁が欠けたり、剥離
したりし易い。また砥石の寿命も短くなる。 This is not so much of a problem when the wear-resistant layer is formed of hard chromium, but it takes time to obtain a plating thickness with hard chromium. Ceramic spraying can be carried out in a short time, but since ceramic is a hard and brittle material, a hard grindstone such as diamond is used for grinding after the ceramic layer is formed. However, because the conductor plating layer 1 is formed using the same method used to form a wear-resistant layer with hard chromium, the ends of the soft conductor plating layer are exposed, and during grinding with a hard whetstone, the conductor plating layer 1 is As a result, the grindstone tends to become clogged. When clogged, the grinding ability of the whetstone decreases and frictional heat is generated.
Grinding conditions become increasingly worse. As a result, only the edges of the wear-resistant layer 2 on the side of the recesses 81 and 82 suffer from poor grinding, and in particular, since grinding is continued forcibly with a clogged grindstone, the burrs generated on the edges of the conductive plating layer 1 become enlarged and the grinding wheel The edge of the brittle ceramic layer 2 is likely to chip or peel off due to being caught on the surface. Also, the life of the grinding wheel will be shortened.
リードギヤツプとライトギヤツプを有する磁気
ヘツドでは、両ギヤツプG1とG2間にシールド板
９が挟まれているが、シールド板９側において
も、ほぼ同様なことが発生する。 In a magnetic head having a lead gap and a write gap, a shield plate 9 is sandwiched between both gaps G1 and G2 , and almost the same thing occurs on the shield plate 9 side.
本発明の目的は、従来の磁気ヘツドの製造方法
におけるこのような問題を解消し、耐摩耗層をセ
ラミツクで形成する場合であつても、セラミツク
層の欠けや剥離を確実に防止できる製造方法を実
現することにある。
The purpose of the present invention is to solve these problems in conventional magnetic head manufacturing methods, and to provide a manufacturing method that can reliably prevent chipping and peeling of the ceramic layer even when the wear-resistant layer is formed of ceramic. It is about realization.
この目的を達成するために講じた本発明による
技術的手段は、磁気ヘツドの記録媒体摺動面に導
体メツキ処理と、耐摩耗層の形成と、研削とを行
うことで、耐摩耗層２より外側に、該耐摩耗層２
より低いハウジング部表面１６が露出してなる記
録媒体摺動面を形成する方法であつて、
磁気ヘツドのコア材ないしハウジング部の表面
における導体メツキ層１の外端１ｅより外側に、
耐摩耗層２の厚さ分だけ深い窪み１１を予め形成
した状態で、導体のメツキを施し、
かつ該導体メツキ層表面の成形終了状態におい
て、該導体メツキ層１の外端１ｅが、前記窪み１
１よりギヤツプ側に引つ込むように短く形成し、
前記窪み１１中に耐摩耗層２の端部２ｅが埋め
込まれるように耐摩耗層を積層し、
しかも、該端部の表面がハウジング部表面１６
と揃うように加工することを特徴とする方法を採
つている。
The technical means according to the present invention taken to achieve this object is to perform conductor plating treatment, formation of a wear-resistant layer, and grinding on the recording medium sliding surface of the magnetic head, so that the wear-resistant layer 2 is On the outside, the wear-resistant layer 2
A method for forming a recording medium sliding surface in which a lower housing surface 16 is exposed, and the method includes: forming a recording medium sliding surface in which a lower housing surface 16 is exposed, and the method includes:
Conductor plating is performed with a recess 11 as deep as the thickness of the wear-resistant layer 2 formed in advance, and when the surface of the conductor plating layer has been formed, the outer end 1e of the conductor plating layer 1 is formed in the recess. 1
The wear-resistant layer 2 is formed to be shorter than the groove 1 so as to be recessed toward the gap side, and the wear-resistant layer 2 is laminated so that the end 2e of the wear-resistant layer 2 is embedded in the recess 11, and the surface of the end portion is the surface of the housing part. 16
The method is characterized by processing the parts so that they are aligned with each other.
次に本発明による磁気ヘツドの製造方法が実際
上どのように具体化されるかを実施例で説明す
る。第２図は本発明の方法で製造されたセラミツ
ク磁気ヘツドの要部断面図であり、片側半分のみ
が示されている。本発明の方法で製造された磁気
ヘツドでは、導体メツキ層１の磁気ヘツド端部寄
りの部分は、セラミツク層２よりも短くギヤツプ
G1側に引つ込んでおり、同様にシールド板９寄
りの端部も、セラミツク層２よりも短く、導体メ
ツキ層１が引つ込んでいる。そのため、コア材６
にギヤツプ部のような立ち上がり部を形成できな
い部分においても、内側の軟質の導体メツキ層１
が外部に露出するのを確実に防止することがで
き、セラミツク層２の最終研削時に、内側の軟質
の導体メツキ層が露出して砥石の目詰まりを招く
ようなことがなくなる。
Next, examples will be used to explain how the method of manufacturing a magnetic head according to the present invention is actually implemented. FIG. 2 is a sectional view of a main part of a ceramic magnetic head manufactured by the method of the present invention, with only one half shown. In the magnetic head manufactured by the method of the present invention, the portion of the conductive plating layer 1 near the end of the magnetic head is shorter than the ceramic layer 2 and has a gap.
Similarly , the end near the shield plate 9 is shorter than the ceramic layer 2, and the conductor plating layer 1 is recessed. Therefore, core material 6
Even in areas where a rising part cannot be formed, such as a gap part, the inner soft conductive plating layer 1
can be reliably prevented from being exposed to the outside, and during the final grinding of the ceramic layer 2, the inner soft conductive plating layer will not be exposed and cause clogging of the grindstone.
第３図はこのような構成のセラミツク磁気ヘツ
ドの製造方法の実施例を、工程順に示す断面図で
ある。イはコア材６ないしハウジング部の研削後
の状態、ロは導体メツキ層１を設け、かつその表
面の研削を終了した状態、ハはセラミツク層２も
形成し、かつ表面の最終研削も終了した状態であ
る。 FIG. 3 is a cross-sectional view showing, in order of steps, an embodiment of a method for manufacturing a ceramic magnetic head having such a structure. A is the state after the core material 6 or the housing part has been ground, B is the state where the conductor plating layer 1 has been provided and the surface has been ground, and C is the state where the ceramic layer 2 has also been formed and the final grinding of the surface has been completed. state.
まずイに示すように、凸部５１とギヤツプG1
との間に予め湾曲した凹部１０を形成しておくこ
とは、従来と同じであるが、凸部５１の外側の窪
み８１となる部分にも、湾曲した凹部１１が予め
形成されている。またシールド板９側は、セラミ
ツク層２と同じ深さの凹部１２と、該凹部１２よ
り更に導体メツキ層１と同じ深さの凹部１３とが
形成されることで、コア材６に２段の凹部が形成
される。ギヤツプG1の付近のみは、従来と同様
にギヤツプG1とほぼ平行になるように切り立つ
ている。以上のような形状となるように、研削で
形成される。なおＩコアやＵコアなどのコア材６
は、ハウジング部の溝中に保持され、テープ摺動
面にはコア材６とハウジング部材が交互に露出す
る部分が発生する。 First, as shown in A, the convex portion 51 and the gap G 1
Although it is the same as the conventional method to form a curved recess 10 in advance between the convex portion 51 and the convex portion 51, a curved recess 11 is also formed in advance in the portion that will become the recess 81 on the outside of the convex portion 51. Further, on the shield plate 9 side, a recess 12 having the same depth as the ceramic layer 2 and a recess 13 having the same depth as the conductor plating layer 1 further from the recess 12 are formed, so that the core material 6 has two stages. A recess is formed. Only the area near the gap G1 stands out so as to be almost parallel to the gap G1 , as in the conventional case. It is formed by grinding so that it has the shape described above. In addition, core materials such as I core and U core6
is held in the groove of the housing portion, and there are portions on the tape sliding surface where the core material 6 and the housing member are alternately exposed.
次にロのように、前記の窪み８１部分の凹部１
１とシールド板９寄りの１段目の凹部１２，ギヤ
ツプG1の付近のみを残して、導体メツキ層１，
１を形成する。この導体メツキ層１，１は、予め
このような形状となるように、マスクを被せるこ
とで形成してもよいが、通常はマスキングで導体
メツキ層１の形状を大雑把に形成した後、研削で
図示のような形状に成形するのが有効である。 Next, as shown in FIG.
1, the first stage recess 12 near the shield plate 9, and the conductor plating layer 1, leaving only the vicinity of the gap G1 .
form 1. The conductor plating layers 1, 1 may be formed in advance by covering them with a mask so that they have such a shape, but usually, the shape of the conductor plating layer 1 is roughly formed by masking, and then by grinding. It is effective to mold it into the shape shown in the figure.
そして導体メツキ層１，１の上に、該導体メツ
キ層１が完全にセラミツク層２で隠れるように、
セラミツク溶射を行う。即ちロ図の窪み８１部分
の凹部１１中とシールド板９寄りの第１段目の凹
部１２中にセラミツク層２の端部が完全に埋め込
まれ、かつ導体メツキ層１より外側に延びてい
る。そしてセラミツク層２，２の表面とコア材な
いしハウジング部１５の表面１６が揃うように研
削によつて成形される。なおギヤツプG1付近に
おいて、コア材６の表面とセラミツク層２，２の
表面とが揃えられるのは、従来と同様である。 Then, on the conductor plating layers 1, 1, so that the conductor plating layer 1 is completely hidden by the ceramic layer 2,
Perform ceramic spraying. That is, the end of the ceramic layer 2 is completely buried in the recess 11 of the recess 81 in FIG. Then, it is shaped by grinding so that the surfaces of the ceramic layers 2, 2 and the surface 16 of the core material or housing portion 15 are aligned. Note that, in the vicinity of the gap G1 , the surface of the core material 6 and the surfaces of the ceramic layers 2, 2 are aligned, as in the conventional case.
第４図は別の実施例であり、シールド板９側
が、第３図のような２段の凹部１２，１３を形成
しないで、導体メツキ層１とセラミツク層２を重
ねた深さの凹部となつている。そして導体メツキ
層１を形成した後の研削時に、該シールド板９の
端面と導体メツキ層１の表面とを揃え、その上に
セラミツク層２を形成すれば、導体メツキ層１の
露出を容易に防止できる。 FIG. 4 shows another embodiment in which the shield plate 9 side does not have the two-stage recesses 12 and 13 as shown in FIG. It's summery. Then, during grinding after forming the conductor plating layer 1, if the end face of the shield plate 9 and the surface of the conductor plating layer 1 are aligned and the ceramic layer 2 is formed thereon, the conductor plating layer 1 can be easily exposed. It can be prevented.
したがつて少なくとも窪み８１部分で、コア材
ないしハウジング部１５にセラミツク層２と同じ
深さの凹部１１を形成すると共に、導体メツキ層
１の形成後も、該凹部１１には導体メツキが残ら
ない構成とし、該凹部１１にセラミツク層２の端
部が埋め込まれる構成とすることで、ギヤツプ部
のような立ち上がり部の無い個所においても、導
体メツキ層１が露出するのを確実に防止すること
が可能となる。 Therefore, a recess 11 having the same depth as the ceramic layer 2 is formed in the core material or housing part 15 at least in the recess 81 portion, and no conductor plating remains in the recess 11 even after the conductor plating layer 1 is formed. By embedding the end of the ceramic layer 2 in the recess 11, it is possible to reliably prevent the conductive plating layer 1 from being exposed even in areas where there is no rising part such as a gap. It becomes possible.
またテープ摺動面におけるセラミツク層２とコ
ア材ないしハウジング部１５との境界部１４が、
テープ摺動面に対し垂直になるので、セラミツク
層２が剥離したり欠けたりし難い。なおギヤツプ
G1側の半分も全く同様に構成されることは言う
までもない。また耐摩耗層としてセラミツクを用
いる場合について説明したが、硬質クロムを用い
る場合でも、本発明を適用できる。 In addition, the boundary portion 14 between the ceramic layer 2 and the core material or housing portion 15 on the tape sliding surface is
Since the tape is perpendicular to the sliding surface, the ceramic layer 2 is unlikely to peel or chip. Furthermore, the gap
It goes without saying that the G1 side half is configured in exactly the same way. Further, although the case where ceramic is used as the wear-resistant layer has been described, the present invention can also be applied to the case where hard chromium is used.
以上のように本発明の方法によれば、磁気テー
プなどの記録媒体の摺動面の少なくとも磁気ヘツ
ド端部寄りの導体メツキ層端縁において、磁気ヘ
ツドのハウジング部ないしコア材の表面に予め耐
摩耗層の厚さ分だけ深い凹部を形成した状態で、
導体のメツキを施し、かつ該導体メツキ層表面の
形成終了状態において、該導体メツキ層の端縁
が、前記凹部より引つ込むように形成し、前記凹
部中に耐摩耗層の端部が埋め込まれるように加工
する方法を採つている。そのため、耐摩耗層の形
成時に、軟質の導体メツキ層が露出して、砥石の
目詰まりを招くのを未然に防止することができ、
耐摩耗層の欠けや剥離を防止して、磁気ヘツドの
歩留りを向上させることができ、かつ砥石の長寿
命化も可能となる。また記録媒体摺動面の表面形
状は変化しないので、記録媒体を走行させてリー
ド・ライトする上で支障を来すようなこともな
い。
As described above, according to the method of the present invention, at least at the edge of the conductor plating layer near the end of the magnetic head on the sliding surface of a recording medium such as a magnetic tape, the surface of the housing portion or core material of the magnetic head is preliminarily coated. With a recess formed as deep as the thickness of the wear layer,
When plating the conductor and completing the formation of the surface of the conductor plating layer, the edge of the conductor plating layer is formed so as to retract from the recess, and the end of the wear-resistant layer is embedded in the recess. We have adopted a method to process the material so that it can be used. Therefore, when forming the wear-resistant layer, it is possible to prevent the soft conductive plating layer from being exposed and causing clogging of the grindstone.
By preventing chipping and peeling of the wear-resistant layer, the yield of magnetic heads can be improved, and the life of the grindstone can be extended. Furthermore, since the surface shape of the recording medium sliding surface does not change, there is no problem in running the recording medium for reading and writing.
第１図は従来の方法で製造されたセラミツク磁
気ヘツドの要部断面図、第２図は本発明の方法で
製造されたセラミツク磁気ヘツドの要部断面図、
第３図は同磁気ヘツドの製造工程を示す要部断面
図、第４図は本発明方法の別の実施例を示す要部
断面図である。
図において、G1，G2は（磁気）ギヤツプ、１
は導体メツキ層、２はセラミツク層、５１，５２
は凸部、６，１５はコア材ないしハウジング部、
１６はハウジング部表面、７１，７２は磁気ヘツ
ド端部、８１，８２は磁気ヘツド端部寄りの窪
み、９はシールド板、１１，１２，１３は凹部を
それぞれ示す。
FIG. 1 is a sectional view of a main part of a ceramic magnetic head manufactured by a conventional method, and FIG. 2 is a sectional view of a main part of a ceramic magnetic head manufactured by a method of the present invention.
FIG. 3 is a sectional view of a main part showing the manufacturing process of the magnetic head, and FIG. 4 is a sectional view of a main part showing another embodiment of the method of the present invention. In the figure, G 1 and G 2 are (magnetic) gaps, 1
is a conductive plating layer, 2 is a ceramic layer, 51, 52
is a convex part, 6 and 15 are core material or housing part,
Reference numeral 16 indicates the surface of the housing, 71 and 72 the ends of the magnetic head, 81 and 82 recesses near the ends of the magnetic head, 9 the shield plate, and 11, 12 and 13 the recesses, respectively.
Claims (1)
理と、耐摩耗層の形成と、研削とを行うことで、
耐摩耗層２より外側に、該耐摩耗層２より低いハ
ウジング部表面１６が露出してなる記録媒体摺動
面を形成する方法であつて、 磁気ヘツドのコア材ないしハウジング部の表面
における導体メツキ層１の外端１ｅより外側に、
耐摩耗層２の厚さ分だけ深い窪み１１を予め形成
した状態で、導体のメツキを施し、 かつ該導体メツキ層表面の成形終了状態におい
て、該導体メツキ層１の外端１ｅが、前記窪み１
１よりギヤツプ側に引つ込むように短く形成し、 前記窪み１１中に耐摩耗層２の端部２ｅが埋め
込まれるように耐摩耗層を積層し、 しかも、該端部の表面がハウジング部表面１６
と揃うように加工することを特徴とする磁気ヘツ
ドの製造方法。[Claims] 1. By performing conductor plating, forming a wear-resistant layer, and grinding on the recording medium sliding surface of the magnetic head,
A method for forming a recording medium sliding surface in which a housing part surface 16 lower than the wear-resistant layer 2 is exposed outside the wear-resistant layer 2, the method comprising conductor plating on the surface of the core material or housing part of a magnetic head. Outside the outer end 1e of layer 1,
Conductor plating is performed with a recess 11 as deep as the thickness of the wear-resistant layer 2 formed in advance, and when the surface of the conductor plating layer has been formed, the outer end 1e of the conductor plating layer 1 is inserted into the recess. 1
The wear-resistant layer 2 is formed to be shorter than the recess 11 so as to be retracted toward the gap side, and the wear-resistant layer 2 is laminated so that the end 2e of the wear-resistant layer 2 is embedded in the recess 11, and the surface of the end portion is the surface of the housing part. 16
A method of manufacturing a magnetic head, characterized by processing it so that it is aligned with the head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10982084A JPS615409A (en) | 1984-05-30 | 1984-05-30 | Manufacture of magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10982084A JPS615409A (en) | 1984-05-30 | 1984-05-30 | Manufacture of magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS615409A JPS615409A (en) | 1986-01-11 |
| JPH0343683B2 true JPH0343683B2 (en) | 1991-07-03 |
Family
ID=14520032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10982084A Granted JPS615409A (en) | 1984-05-30 | 1984-05-30 | Manufacture of magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS615409A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5840663Y2 (en) * | 1978-08-16 | 1983-09-13 | 株式会社東芝 | Variable time constant circuit |
| JPS5634127A (en) * | 1979-08-24 | 1981-04-06 | Nec Corp | Surface forming method of magnetic head |
-
1984
- 1984-05-30 JP JP10982084A patent/JPS615409A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS615409A (en) | 1986-01-11 |
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