JPH0344006A - Thick film resistor drawing method - Google Patents

Abstract

PURPOSE:To shorten data creation time without need of conversion and re-input of writing position data by a method wherein data of a resistor such that reference points of writing data are equal on both the surface and the rear is converted to data of both faces of a substrate by writing start point calculation process and writing end point calculation process and lithography is done based on the data. CONSTITUTION:A resistor 2 is written on the surface of a substrate and a resistor 3 is written on the rear of the substrate by means of a CAD or the like. Then a pattern is to be written on the surface, data of writing start point 4 (x1, y1) and length l1 is used to calculate writing end point (x1+l1, y1) for performing lithography. However, when a pattern is to be written on the rear face, since the writing direction is limited to one direction in X and Y directions, the start point on the rear face 5 must be right from a point 7. Therefore, the coordinate of the start point 7 on the rear can be calculated by (-(x2+l2), y2) and writing end point 9 can be obtained since the length is l2, with this series of coordinate conversion processes, all of the writing start positions of the rear resistor can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thick film resistor drawing method for forming a resistor of a hybrid IC (hereinafter abbreviated as HIC).

In the conventional HIC technology, it is necessary to draw resistors on both the front and back sides of the board, but the drawing start position of the conventional resistance drawing machine is based on the data from the reference point on the front surface of the board. ,
In addition, on the back side of the substrate, the drawing start position was determined using the reference point for each side, so that the resistor was drawn using data from the reference point on the back side.

Problems to be Solved by the Invention However, in the conventional method, it is necessary to create a drawing start position by changing reference points on the front and back sides of the same substrate.

In recent years, resistance position data output from CAD, etc., is expressed using the same reference point on both the front and back sides, and when using data directly from CAD, the data on the back side has to be recalculated by the operator to re-calculate the drawing position. I was typing.

In other words, when the data shown in FIG. 1 is given, the drawing start position data for the surface 2 is (X+, yl), and direct drawing can be performed using that data. However, although the back side drawing start position data of 3 is (X2.y2), when it is on the back side, there is a limitation that drawing can only be done in one direction each in the X and Y directions, which is a unique drawing method. The data could not be used directly and had to be calculated and re-entered by the operator.

Means for Solving the Problems The technical means of the present invention for solving the above-mentioned problems is to use the data of a resistor whose reference point is the same on the front and back sides of the drawing data in a drawing start position calculation process and a drawing end position calculation process. Through the process, data is converted to data on both the front and back sides of the substrate, and drawing is performed based on this data.

action The effect of this technical means is as follows.

That is, when drawing start position data is given at the same reference point for both the front and back sides of the substrate, coordinate conversion is performed to calculate the drawing start position data for the back side, making it possible to perform resistance drawing on the back side.

Example An embodiment of the present invention will be described below based on the accompanying drawings.

In FIG. 1, 1 is a board on which drawing is performed, 2 is a resistor to be drawn on the surface of the substrate, 3 is a resistor to be drawn on the back side of the substrate, and 4 is the start of drawing of the resistor 2 on the surface given by CAD etc. Point 5 is the drawing start point of the resistors 3 on the back surface, and 6 is the drawing direction of these resistors.

FIG. 2 shows a state in which the X coordinate of the substrate 1 is reversed with respect to the Y axis so that the back side is formed. 7 is the drawing start point of the resistor 3 on the back side, 8 is the end point of the front side drawing of the resistor 2, and 9 is the end point of the back side drawing of the resistor 3.

When drawing the surface, the drawing start position of 4 (x +,
Drawing ends with data of y +) and drawing length 11 (x+
+j! +, Y+) and draw it.

However, when drawing the back side, the drawing start position of 5 (X2
．． Y2) and data with a drawing length of 12 cannot be used to draw. In the case of the back side, it will be shown in Figure 2, and the data of the drawing start position will be (
-x2. y2). However, since the drawing direction, which is a characteristic peculiar to drawing, is limited to one direction each downward in the X direction, the drawing start position of 5 on the back side must be drawn to the right from the position of 7 in FIG. Therefore, the coordinates of the drawing start point 7 for the back side can be found as ((X2 + 12) y2), and since the drawing length is 12, the drawing end point 9 can be found.

Through this series of coordinate conversion steps, the drawing start positions of all the backside resistors are determined. FIG. 3 shows this flowchart.

Effects of the Invention According to the present invention, when drawing a resistor on both the front and back surfaces using a resistance drawing device, even if drawing position data for the front and back sides are given at the same reference point, coordinate conversion is possible, and the work is simplified. There is no need for the operator to convert the drawing position data and re-enter it, reducing data creation time.

[Brief explanation of drawings]

FIG. 1 is a diagram of the drawing board seen from the front side, FIG. 2 is a diagram of the drawing board seen from the back side, and FIG. 3 is a flowchart of the coordinate conversion function. 1...Substrate, 2...Surface drawing resistor, 3
...Back side drawing resistance, 4...Surface drawing start position, 5...Back side drawing start position, 6...
...Drawing direction, 7...Drawing start position for back side,
8... Front side drawing end position, 9... Back side drawing end position.

Claims (1)

[Claims] In a thick film resistor drawing method in which a viscous material is discharged from a nozzle, when drawing resistors on both sides of the substrate, data of the resistor whose drawing data reference point is the same on both sides is used in the drawing start position calculation process and the drawing end position. A thick film resistor drawing method characterized by converting data on both the front and back sides of a substrate through a calculation process and drawing a resistor on the back side based on this drawing data.