JPH0345669U - - Google Patents
Info
- Publication number
- JPH0345669U JPH0345669U JP1989107059U JP10705989U JPH0345669U JP H0345669 U JPH0345669 U JP H0345669U JP 1989107059 U JP1989107059 U JP 1989107059U JP 10705989 U JP10705989 U JP 10705989U JP H0345669 U JPH0345669 U JP H0345669U
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- plate
- cylindrical part
- shaped part
- supporting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図は本考案による光半導体装置の一実施例
装置を含んだ光半導体モジユールを示した図、第
２図および第３図はともに従来の光半導体装置を
示した図である。 ２１……担持部材、２２……光半導体素子、２
３……筒状部、２５……板状部、２６……透孔、
２７，３０……リード線、２８……ワイヤ、３１
……ガラス、３３……光フアイバ、３５……レセ
プタクル。
装置を含んだ光半導体モジユールを示した図、第
２図および第３図はともに従来の光半導体装置を
示した図である。 ２１……担持部材、２２……光半導体素子、２
３……筒状部、２５……板状部、２６……透孔、
２７，３０……リード線、２８……ワイヤ、３１
……ガラス、３３……光フアイバ、３５……レセ
プタクル。
Claims (1)
- 【実用新案登録請求の範囲】 両端が開口した筒状部およびこの筒状部の一端
に結合した板状部を有し、その板状部にて光半導
体素子を担持する担持部材と、 前記板状部に形成された透孔を通して前記光半
導体素子に接続されるリード線とを備えた光半導
体装置であつて、 前記担持部材はその板状部の肉厚が筒状部より
も薄く形成されていることを特徴とする光半導体
装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989107059U JPH0345669U (ja) | 1989-09-12 | 1989-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989107059U JPH0345669U (ja) | 1989-09-12 | 1989-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345669U true JPH0345669U (ja) | 1991-04-26 |
Family
ID=31655777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989107059U Pending JPH0345669U (ja) | 1989-09-12 | 1989-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345669U (ja) |
-
1989
- 1989-09-12 JP JP1989107059U patent/JPH0345669U/ja active Pending