JPH0412659U - - Google Patents

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Publication number
JPH0412659U
JPH0412659U JP5442390U JP5442390U JPH0412659U JP H0412659 U JPH0412659 U JP H0412659U JP 5442390 U JP5442390 U JP 5442390U JP 5442390 U JP5442390 U JP 5442390U JP H0412659 U JPH0412659 U JP H0412659U
Authority
JP
Japan
Prior art keywords
heat dissipation
fixed
semiconductor element
holding member
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5442390U
Other languages
English (en)
Other versions
JP2504608Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5442390U priority Critical patent/JP2504608Y2/ja
Publication of JPH0412659U publication Critical patent/JPH0412659U/ja
Application granted granted Critical
Publication of JP2504608Y2 publication Critical patent/JP2504608Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の分解斜視図、第２
図は第１図に示される実施例の縦断面図、第３図
はその実施例の構成を明瞭に示すための水平断面
図、第４図はその実施例の背後から見た斜視図、
第５図は本考案の他の実施例の一部の分解斜視図
、第６図は先行技術の断面図である。 １１，１２……半導体素子、１３……放熱部材
、１４……配線基板、１５……半導体素子用保持
部材、１６……放熱部材用保持部材、１７……下
ケース、１８……上ケース、４１，４２……リー
ド端子。

Claims (1)

  1. 【実用新案登録請求の範囲】 配線基板上に半導体素子用保持部材を立設して
    固定し、 放熱部材を、放熱部材用保持部材に固定し、 半導体素子用保持部材と放熱部材との間に、配
    線基板に接続される半導体素子を挟持して固定し
    、 配線基板が固定されるケースに、放熱部材用保
    持部材を、半導体素子の厚み方向に移動変位可能
    に、かつ厚み方向に垂直な軸線まわりに角変位可
    能に固定することを特徴とする半導体素子の放熱
    構造。
JP5442390U 1990-05-23 1990-05-23 半導体素子の放熱構造 Expired - Fee Related JP2504608Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5442390U JP2504608Y2 (ja) 1990-05-23 1990-05-23 半導体素子の放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5442390U JP2504608Y2 (ja) 1990-05-23 1990-05-23 半導体素子の放熱構造

Publications (2)

Publication Number Publication Date
JPH0412659U true JPH0412659U (ja) 1992-01-31
JP2504608Y2 JP2504608Y2 (ja) 1996-07-10

Family

ID=31576477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5442390U Expired - Fee Related JP2504608Y2 (ja) 1990-05-23 1990-05-23 半導体素子の放熱構造

Country Status (1)

Country Link
JP (1) JP2504608Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006158484A (ja) * 2004-12-03 2006-06-22 Pentax Corp 電子内視鏡用コネクタ
JP2013157484A (ja) * 2012-01-30 2013-08-15 Jvc Kenwood Corp 抑え部材、ヒートシンク装置、及びヒートシンクの取り付け方法
CN108399910A (zh) * 2018-05-02 2018-08-14 格力电器（合肥）有限公司 蜂鸣器及其外壳

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006158484A (ja) * 2004-12-03 2006-06-22 Pentax Corp 電子内視鏡用コネクタ
JP2013157484A (ja) * 2012-01-30 2013-08-15 Jvc Kenwood Corp 抑え部材、ヒートシンク装置、及びヒートシンクの取り付け方法
CN108399910A (zh) * 2018-05-02 2018-08-14 格力电器（合肥）有限公司 蜂鸣器及其外壳
CN108399910B (zh) * 2018-05-02 2024-06-04 格力电器（合肥）有限公司 蜂鸣器及其外壳

Also Published As

Publication number Publication date
JP2504608Y2 (ja) 1996-07-10

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