JPH0346812A - Surface acoustic wave filter - Google Patents
Surface acoustic wave filterInfo
- Publication number
- JPH0346812A JPH0346812A JP18350689A JP18350689A JPH0346812A JP H0346812 A JPH0346812 A JP H0346812A JP 18350689 A JP18350689 A JP 18350689A JP 18350689 A JP18350689 A JP 18350689A JP H0346812 A JPH0346812 A JP H0346812A
- Authority
- JP
- Japan
- Prior art keywords
- band
- terminal
- wave filter
- base
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 10
- 239000002390 adhesive tape Substances 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、例えばビデオ、テレビなどの映−像中間層
波フィルタなどとして用いる表面波フィルタに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a surface wave filter used as an image intermediate layer wave filter for videos, televisions, etc., for example.
〈従来の技術〉
最近、異形電子部品をラジアルテーピング化して自動挿
入する方法が提案されている。<Prior Art> Recently, a method has been proposed for automatically inserting irregularly shaped electronic components into radial taping.
第４図は従来のテーピングタイプの表面波フィルタに使
用する端子を示すもので、ｌは表面波フィルタチップを
取付ける部分、２は表面波フィルタチップを樹脂モール
ド後外部リード端子となる部分で帯状部分３に継なかっ
ている。そして、該帯状部分３には一定の間隔で送り孔
４を設ける。Figure 4 shows the terminals used in a conventional taping type surface wave filter, where l is the part where the surface wave filter chip is attached, and 2 is the band-shaped part that becomes the external lead terminal after the surface wave filter chip is molded with resin. It has not been continued to 3. Feed holes 4 are provided in the belt-shaped portion 3 at regular intervals.
〈発明が解決しようとする課題〉
上記のような従来の表面波フィルタ用端子の場合、リー
ド端子２の部分が５例えば全長２９ｍｍに対して幅０．
５ ｍｍと極めて細長く組立途中において端子臼りが発
生して組立不能となるなどの問題があった。<Problems to be Solved by the Invention> In the case of the conventional surface wave filter terminal as described above, the portion of the lead terminal 2 has a width of 0.5 mm for a total length of 29 mm, for example.
The terminal was extremely thin at 5 mm, and there were problems such as the terminal being crushed during assembly, making it impossible to assemble.
又、端子先端が左右に振れやす（自動取付機でチップを
うまく半田付けできない問題があった。Also, the tip of the terminal tends to swing left and right (there was a problem that the chip could not be soldered properly using an automatic mounting machine).
く課題を解決するための手段〉
この発明は上記のような問題点を解決するためになされ
たもので、テーピングタイプの弾性表面波フィルタにお
いて、その端子の台紙に粘着テープで貼着せしめる部分
の、少なくとも一部を含む基部の幅を他の部分より広（
した表面波フィルタを提供するものである。Means for Solving the Problems> The present invention was made to solve the above-mentioned problems.In a taping-type surface acoustic wave filter, the part of the surface acoustic wave filter that is attached to the mount of the terminal with adhesive tape is improved. , the width of the base, including at least a part, is wider than the other part (
The present invention provides a surface wave filter with a
〈実施例〉
以下、この発明の実施例を添付図面の第１図乃至第３図
に基づいて説明する。<Embodiments> Hereinafter, embodiments of the present invention will be described based on FIGS. 1 to 3 of the accompanying drawings.
第１図において、１１は表面波フィルタチップを取付け
る部分、１２は該各版付部１１に一体に続（リード端子
である。In FIG. 1, numeral 11 is a portion for attaching a surface wave filter chip, and numeral 12 is a lead terminal integrally connected to each printing portion 11.
そして、この各リード端子１２の基部１３．１４をワー
ド端子１２の幅よりも太くしである。また、各基部１３
．１４の端部は帯状部分１５の一側に一体に続いている
。この帯状部分１５には一定の間隔で送り孔１６を設け
る。各基部１３．１４の効果として組立て時の端子面が
りがな（なった。又、先端の振れが小さくなったので自
動取付機での半田付けが可能になった。The base portions 13 and 14 of each lead terminal 12 are made thicker than the width of the word terminal 12. In addition, each base 13
．． The end portion of 14 continues integrally with one side of the strip portion 15. Feed holes 16 are provided in this band-shaped portion 15 at regular intervals. As a result of each base 13 and 14, there is no terminal surface bending during assembly.Also, since the deflection of the tip has been reduced, it is now possible to solder with an automatic mounting machine.
第２図はテーピング状態を示すもので、帯状の台紙１７
上に、前記帯状部分１５を除去したリード端子１２を載
せて粘着テープ１８により貼着する。このとき、幅の広
い基部１４の一部をテープ１８により押さえる。Figure 2 shows the taping state, with a band-shaped mount 17
The lead terminal 12 from which the strip portion 15 has been removed is placed on top and adhered with an adhesive tape 18. At this time, a part of the wide base 14 is held down by the tape 18.
１９は台紙１７に一定の間隔で設けたテープ送り孔であ
る。又、図中２０は弾性表面波フィルタの本体である。Reference numeral 19 denotes tape feed holes provided in the mount 17 at regular intervals. Further, 20 in the figure is the main body of the surface acoustic wave filter.
。
第３図は端子の材料使用率を上げるために両面取りとし
た例を示１′もので、斜線部分ａで所定のリード端子１
２を連結したものを薄い金属板を打ち抜くことにより形
成し、その後、斜線部分ａを切除して前記第１図のよう
な形状にする。. Figure 3 shows an example in which double-sided chamfering is used to increase the material usage rate of the terminal.
2 are connected by punching out a thin metal plate, and then the shaded portion a is cut out to form the shape as shown in FIG. 1.
上記の実施例に用いる薄い金属板としては、例えば、約
０．４ ｍｍ厚の鉄（ＳＰＣＣ材）の表面に下地として
約２−厚の銅メツキを施し、その上にＰＳメツキを約６
±２ ｌ１ｍの厚みに形成したものである。The thin metal plate used in the above example is, for example, about 0.4 mm thick iron (SPCC material) on which about 2-thick copper plating is applied as a base, and on top of that, about 6-6 mm thick PS plating is applied.
It is formed to a thickness of ±2 l1m.
５ｐｃｃ材を打抜いてから、後メツキ処理するのが望ま
しい。It is desirable to punch out the 5pcc material and then perform post-plating.
〈発明の効果〉
この発明は上記のように７弾性表面波フィルタの端子の
台紙に粘着テープで貼着せしめる部分の、少なくとも一
部を含む基部の幅を他の部分より広くし、たことにより
、基部の接続された帯状部分に対して先端の振れが小さ
くなったので自動半田付けが可能となり、又組立時の取
扱いによる変形もなくなったので、組立容易となる。<Effects of the Invention> As described above, the present invention makes the width of the base part including at least a part of the part attached to the terminal mount of the 7 surface acoustic wave filter with adhesive tape wider than the other part. Since the deflection of the tip with respect to the connected band-shaped portion of the base is reduced, automatic soldering is possible, and deformation due to handling during assembly is eliminated, so assembly is facilitated.
第１図はこの発明の弾性表面波フィルタ用端子の一実施
例を示す平面図、第２図は表面波フィルタのテーピング
状態の平面図、第３図は端子の両面取りを示す平面図、
第４図は従来の弾性表面波フィルタ用端子の平面図であ
る。
１１・・・電極部 １２・・・リード
端子Ｉ３・・・幅の広い基部 １５・・・帯
状部分１７・・・台紙 １８・・・
粘着テープ第１図
１FIG. 1 is a plan view showing an embodiment of the surface acoustic wave filter terminal of the present invention, FIG. 2 is a plan view of the surface acoustic wave filter in a taped state, and FIG. 3 is a plan view showing both sides of the terminal.
FIG. 4 is a plan view of a conventional surface acoustic wave filter terminal. DESCRIPTION OF SYMBOLS 11... Electrode part 12... Lead terminal I3... Wide base part 15... Band-shaped part 17... Mounting paper 18...
Adhesive tape Figure 1 1
Claims (1)
の端子の台紙に粘着テープで貼着せしめる部分の、少な
くとも一部を含む基部の幅を他の部分より広くすること
を特徴とする弾性表面波フィルタ。1. A taping-type surface acoustic wave filter, characterized in that a base portion including at least a portion of a portion attached to a terminal mount with adhesive tape is wider than the other portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18350689A JPH0346812A (en) | 1989-07-14 | 1989-07-14 | Surface acoustic wave filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18350689A JPH0346812A (en) | 1989-07-14 | 1989-07-14 | Surface acoustic wave filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0346812A true JPH0346812A (en) | 1991-02-28 |
Family
ID=16137028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18350689A Pending JPH0346812A (en) | 1989-07-14 | 1989-07-14 | Surface acoustic wave filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346812A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4755763B2 (en) * | 1999-04-28 | 2011-08-24 | シチズンホールディングス株式会社 | Electronic clock |
-
1989
- 1989-07-14 JP JP18350689A patent/JPH0346812A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4755763B2 (en) * | 1999-04-28 | 2011-08-24 | シチズンホールディングス株式会社 | Electronic clock |
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