JPH0348228U - - Google Patents
Info
- Publication number
- JPH0348228U JPH0348228U JP10955089U JP10955089U JPH0348228U JP H0348228 U JPH0348228 U JP H0348228U JP 10955089 U JP10955089 U JP 10955089U JP 10955089 U JP10955089 U JP 10955089U JP H0348228 U JPH0348228 U JP H0348228U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- pot
- resin encapsulation
- semiconductor device
- plunger head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10955089U JPH0348228U (de) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10955089U JPH0348228U (de) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348228U true JPH0348228U (de) | 1991-05-08 |
Family
ID=31658137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10955089U Pending JPH0348228U (de) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348228U (de) |
-
1989
- 1989-09-19 JP JP10955089U patent/JPH0348228U/ja active Pending