JPH0348231U - - Google Patents

Info

Publication number
JPH0348231U
JPH0348231U JP1989108668U JP10866889U JPH0348231U JP H0348231 U JPH0348231 U JP H0348231U JP 1989108668 U JP1989108668 U JP 1989108668U JP 10866889 U JP10866889 U JP 10866889U JP H0348231 U JPH0348231 U JP H0348231U
Authority
JP
Japan
Prior art keywords
black
bonding
semiconductor components
pedestal
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989108668U
Other languages
Japanese (ja)
Other versions
JPH0610684Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989108668U priority Critical patent/JPH0610684Y2/en
Publication of JPH0348231U publication Critical patent/JPH0348231U/ja
Application granted granted Critical
Publication of JPH0610684Y2 publication Critical patent/JPH0610684Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るボンデイング装置の構成
の概略を示す図、第２図、第３図及び第４図は本
考案の実施例を示す図である。 １……ボンデイングヘツド、２……ボンデイン
グステージ、３……リードフレーム、５……ロー
ダ、６……アンローダ、７……ヒータプレート、
８……マガジン、９……ワイヤ、１０，１１ａ…
…被ボンデイング部品受台、１１ｂ……コーテイ
ング面。 FIG. 1 is a diagram schematically showing the structure of a bonding apparatus according to the present invention, and FIGS. 2, 3, and 4 are diagrams showing embodiments of the present invention. 1... bonding head, 2... bonding stage, 3... lead frame, 5... loader, 6... unloader, 7... heater plate,
8... Magazine, 9... Wire, 10, 11a...
...Bonding component holder, 11b...Coating surface.

Claims (1)

【実用新案登録請求の範囲】 (1) 半導体部品の電極とリードとの接続を行な
うボンデイング装置において、被ボンデイング部
品である半導体部品が載置される受台を黒色また
は黒色系のセラミツクにより構成したことを特徴
とするボンデイング装置。 (2) 半導体部品の電極とリードとの接続を行な
うボンデイング装置において、被ボンデイング部
品である半導体部品が載置される受台上面に黒色
または黒色系のセラミツク層を設けるようにした
ことを特徴とするボンデイング装置。 (3) 黒色または黒色系のセラミツクはボンデイ
ング接続を行なう作業台のみに形成するようにし
たことを特徴とする請求項１または請求項２記載
のボンデイング装置。[Scope of Claim for Utility Model Registration] (1) In a bonding device that connects electrodes and leads of semiconductor components, a pedestal on which a semiconductor component to be bonded is placed is made of black or black-colored ceramic. A bonding device characterized by: (2) A bonding device for connecting electrodes and leads of semiconductor components, characterized in that a black or black ceramic layer is provided on the top surface of the pedestal on which the semiconductor components to be bonded are placed. bonding equipment. (3) The bonding apparatus according to claim 1 or 2, wherein the black or black-colored ceramic is formed only on the work table on which the bonding connection is to be made.
JP1989108668U 1989-09-19 1989-09-19 Bonding device Expired - Lifetime JPH0610684Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (en) 1989-09-19 1989-09-19 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (en) 1989-09-19 1989-09-19 Bonding device

Publications (2)

Publication Number Publication Date
JPH0348231U true JPH0348231U (en) 1991-05-08
JPH0610684Y2 JPH0610684Y2 (en) 1994-03-16

Family

ID=31657293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989108668U Expired - Lifetime JPH0610684Y2 (en) 1989-09-19 1989-09-19 Bonding device

Country Status (1)

Country Link
JP (1) JPH0610684Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001902A1 (en) * 1996-07-08 1998-01-15 Kabushiki Kaisha Toshiba Semiconductor component fixing jig, table for placement of semiconductor component and bonding apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278U (en) * 1980-09-18 1982-03-30
JPS5790943A (en) * 1980-11-26 1982-06-05 Mitsubishi Electric Corp Heating base for bonding of semiconductor element
JPS59174576A (en) * 1983-03-18 1984-10-03 日立化成工業株式会社 Sic tool
JPS61143686A (en) * 1984-12-18 1986-07-01 イビデン株式会社 Silicon carbide sintered body for heat-resistant jig having excellent dimensional accuracy
JPH0265245A (en) * 1988-08-31 1990-03-05 Nec Yamagata Ltd Semiconductor manufacturing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278U (en) * 1980-09-18 1982-03-30
JPS5790943A (en) * 1980-11-26 1982-06-05 Mitsubishi Electric Corp Heating base for bonding of semiconductor element
JPS59174576A (en) * 1983-03-18 1984-10-03 日立化成工業株式会社 Sic tool
JPS61143686A (en) * 1984-12-18 1986-07-01 イビデン株式会社 Silicon carbide sintered body for heat-resistant jig having excellent dimensional accuracy
JPH0265245A (en) * 1988-08-31 1990-03-05 Nec Yamagata Ltd Semiconductor manufacturing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001902A1 (en) * 1996-07-08 1998-01-15 Kabushiki Kaisha Toshiba Semiconductor component fixing jig, table for placement of semiconductor component and bonding apparatus

Also Published As

Publication number Publication date
JPH0610684Y2 (en) 1994-03-16

Similar Documents

Publication Publication Date Title
JPH0348231U (en)
JPH031540U (en)
JPH0415238U (en)
JPS5933913U (en) panel base
JPS606063U (en) handle
JPH039618B2 (en)
JPS6355538U (en)
JPS60130642U (en) die bonding equipment
JPS6384941U (en)
JPH0455135U (en)
JPS5817146U (en) injection head
JPS5858354U (en) Lead frame for semiconductor devices
JPH0163145U (en)
JPS5989554U (en) Semiconductor element mounting structure
JPH029435U (en)
JPH02122440U (en)
JPS636748U (en)
JPS5850932U (en) Electrical laminate
JPH0281039U (en)
JPS5820538U (en) Hybrid integrated circuit device
JPS6142846U (en) semiconductor equipment
JPS6063970U (en) Chip component mounting structure
JPS6349235U (en)
JPS5954927U (en) bonding equipment
JPS62147343U (en)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term