JPH0348238U - - Google Patents
Info
- Publication number
- JPH0348238U JPH0348238U JP1989110235U JP11023589U JPH0348238U JP H0348238 U JPH0348238 U JP H0348238U JP 1989110235 U JP1989110235 U JP 1989110235U JP 11023589 U JP11023589 U JP 11023589U JP H0348238 U JPH0348238 U JP H0348238U
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead
- integrated
- semiconductor chip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989110235U JPH0348238U (mo) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989110235U JPH0348238U (mo) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348238U true JPH0348238U (mo) | 1991-05-08 |
Family
ID=31658783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989110235U Pending JPH0348238U (mo) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348238U (mo) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009537182A (ja) * | 2006-05-18 | 2009-10-29 | バビリス ファコ ソシエテ アノニム | 改善された毛髪ストレート化装置 |
-
1989
- 1989-09-19 JP JP1989110235U patent/JPH0348238U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009537182A (ja) * | 2006-05-18 | 2009-10-29 | バビリス ファコ ソシエテ アノニム | 改善された毛髪ストレート化装置 |