JPH0348257U - - Google Patents
Info
- Publication number
- JPH0348257U JPH0348257U JP10956589U JP10956589U JPH0348257U JP H0348257 U JPH0348257 U JP H0348257U JP 10956589 U JP10956589 U JP 10956589U JP 10956589 U JP10956589 U JP 10956589U JP H0348257 U JPH0348257 U JP H0348257U
- Authority
- JP
- Japan
- Prior art keywords
- board
- holding
- electronic
- mechanical parts
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006351 engineering plastic Polymers 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す斜視図である
。
１……スイツチ・ＬＥＤ保持板、２……スイツ
チ端子接続台、３……ＬＥＤ端子接続台、４……
コネクタ、５……大形部品用スナツプ、６……ス
タンドオフ、７……スナツプ型保持固定部、８…
…配線パターン、９……Ｌ形カードエツジコネク
タ、１０……基板。
FIG. 1 is a perspective view showing an embodiment of the present invention. 1...Switch/LED holding plate, 2...Switch terminal connection block, 3...LED terminal connection block, 4...
Connector, 5...Snap for large parts, 6...Standoff, 7...Snap type holding and fixing part, 8...
... Wiring pattern, 9 ... L-shaped card edge connector, 10 ... Board.
Claims (1)
配線基板において、エンジニアリングプラスチツ
ク材料を使用し射出成形により前記基板の一体構
造に形成した前記電子及び機構部品を保持し接続
する複数の保持接続手段と、前記基板及び前記保
持接続手段の所定の位置に表面メツキされた配線
パターンとを備えたことを特徴とする印刷配線基
板。 A printed wiring board having a board on which electronic and mechanical parts are mounted, a plurality of holding and connecting means for holding and connecting the electronic and mechanical parts formed in an integral structure of the board by injection molding using an engineering plastic material; 1. A printed wiring board, comprising a board and a wiring pattern whose surface is plated at a predetermined position of the holding and connecting means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10956589U JPH0348257U (en) | 1989-09-18 | 1989-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10956589U JPH0348257U (en) | 1989-09-18 | 1989-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348257U true JPH0348257U (en) | 1991-05-08 |
Family
ID=31658149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10956589U Pending JPH0348257U (en) | 1989-09-18 | 1989-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051169A (en) * | 2003-07-31 | 2005-02-24 | Denso Corp | Multi-layer board with connector |
-
1989
- 1989-09-18 JP JP10956589U patent/JPH0348257U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051169A (en) * | 2003-07-31 | 2005-02-24 | Denso Corp | Multi-layer board with connector |
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