JPH01121966U - - Google Patents
Info
- Publication number
- JPH01121966U JPH01121966U JP1799988U JP1799988U JPH01121966U JP H01121966 U JPH01121966 U JP H01121966U JP 1799988 U JP1799988 U JP 1799988U JP 1799988 U JP1799988 U JP 1799988U JP H01121966 U JPH01121966 U JP H01121966U
- Authority
- JP
- Japan
- Prior art keywords
- front side
- back side
- circuit pattern
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示したプリント
回路基板の平面図、第２図は第１図を２―２線で
切断した断面図、第３図は実施例のプリント回路
基板を製造する射出成形装置の要部断面図、第４
図各図は実施例において用いられる回路フイルム
の製造工程を図の順にしたがつて示した一部拡大
断面図、第５図は射出成形装置の型締状態を示し
た金型の一部拡大断面図、第６図は射出成形装置
の成形時の状態を示した金型の一部拡大断面図で
ある。
１０……回路フイルム、１１……キヤリアフイ
ルム、１２……表面側回路パターン、１３……裏
面側回路パターン、１４……連結部、１５……基
板部材。
Fig. 1 is a plan view of a printed circuit board showing an embodiment of this invention, Fig. 2 is a sectional view taken along line 2-2 of Fig. 1, and Fig. 3 is a manufactured printed circuit board of the embodiment. A sectional view of the main parts of the injection molding apparatus, No. 4
Each figure is a partially enlarged cross-sectional view showing the manufacturing process of the circuit film used in the example in the order of the figures, and Figure 5 is a partially enlarged cross-sectional view of the mold showing the mold clamping state of the injection molding device. FIG. 6 is a partially enlarged sectional view of the mold showing the state of the injection molding apparatus during molding. DESCRIPTION OF SYMBOLS 10... Circuit film, 11... Carrier film, 12... Front side circuit pattern, 13... Back side circuit pattern, 14... Connection portion, 15... Board member.
Claims (1)
面側回路パターン１２と前記キヤリアフイルムの
裏面側に形成された前記表面側回路パターンと連
結部１４によつて接続された裏面側回路パターン
１３を有する回路フイルム１０の裏面側に基板部
材１５が一体に形成されていることを特徴とする
プリント回路基板。 A circuit film having a front side circuit pattern 12 formed on the front side of a carrier film 11 and a back side circuit pattern 13 connected to the front side circuit pattern formed on the back side of the carrier film by a connecting part 14. 1. A printed circuit board characterized in that a substrate member 15 is integrally formed on the back side of the printed circuit board 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1799988U JPH0510380Y2 (en) | 1988-02-12 | 1988-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1799988U JPH0510380Y2 (en) | 1988-02-12 | 1988-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121966U true JPH01121966U (en) | 1989-08-18 |
| JPH0510380Y2 JPH0510380Y2 (en) | 1993-03-15 |
Family
ID=31232253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1799988U Expired - Lifetime JPH0510380Y2 (en) | 1988-02-12 | 1988-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510380Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016054016A (en) * | 2014-09-04 | 2016-04-14 | 日本発條株式会社 | Interleave circuit of wiring part of disk unit flexure |
-
1988
- 1988-02-12 JP JP1799988U patent/JPH0510380Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016054016A (en) * | 2014-09-04 | 2016-04-14 | 日本発條株式会社 | Interleave circuit of wiring part of disk unit flexure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510380Y2 (en) | 1993-03-15 |