JPH0348976Y2 - - Google Patents
Info
- Publication number
- JPH0348976Y2 JPH0348976Y2 JP10759685U JP10759685U JPH0348976Y2 JP H0348976 Y2 JPH0348976 Y2 JP H0348976Y2 JP 10759685 U JP10759685 U JP 10759685U JP 10759685 U JP10759685 U JP 10759685U JP H0348976 Y2 JPH0348976 Y2 JP H0348976Y2
- Authority
- JP
- Japan
- Prior art keywords
- tile
- roof
- snow
- tiles
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 description 18
- 238000002844 melting Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 210000003298 dental enamel Anatomy 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010020 roller printing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Control Of Resistance Heating (AREA)
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は、融雪性の屋根瓦に関し、特に雪下し
等の作業を必要としない融雪性を有する屋根瓦に
関する。[Detailed description of the invention] (a) Industrial application field The present invention relates to a roof tile that melts snow, and particularly to a roof tile that melts snow without requiring work such as removing snow.
(ロ) 従来の技術
冬期、降雪の多い地方では、家屋を雪の被害か
ら守るために、屋根に上つて屋根の雪の掻き下し
作業は不可欠であり、これに投ずる労力は無視で
きないものがある。そこで、省力化をはかるため
に、屋根の勾配面にスクリユーコンベヤを配置
し、このコンベヤを順次屋根の雪面上を移動させ
ながら、屋根の雪をコンベヤを介して排雪口まで
下す方法がとられている。(b) Conventional technology In winter, in regions with heavy snowfall, it is essential to climb on the roof and shovel snow off the roof in order to protect the house from snow damage, and the effort required to do this cannot be ignored. be. Therefore, in order to save labor, a method is proposed in which a screw conveyor is placed on the sloped surface of the roof, and this conveyor is moved sequentially over the snow surface of the roof, and the snow on the roof is lowered to the snow removal port via the conveyor. It is taken.
(ハ) 考案が解決しようとする問題点
しかし、このように、屋根の雪の掻き下しのた
めに、屋根の上に上つたり或は、スクリユーコン
ベヤを屋根の勾配面に載置し、順次屋根の雪面上
を移動させることは、人手による屋根上の作業を
不可欠として、危険であり、その上屋根瓦の痛み
や、多くの経費を要し問題であつた。そこで、全
く人手を要しないで屋根上の積雪を除くために、
ニクロム線や鉄クロム線を瓦本体内に内装した融
雪瓦が提案されている。しかし、瓦本体は断熱性
が大きいので、融雪させるに要する電力の消費が
大きくなり実用的でない。また、屋根上にニクロ
ム線を這わせることも提案されているが、絶縁が
難しく問題であり、しかも、屋根に上つたとき足
元が悪くなり危険である。(c) Problems that the invention aims to solve However, in order to remove snow from the roof, it is difficult to climb onto the roof or place the screw conveyor on the slope of the roof. Moving the roof over the snow surface one by one requires manual work on the roof, which is dangerous, causes damage to the roof tiles, and costs a lot of money. Therefore, in order to remove the snow on the roof without requiring any manpower,
Snow-melting tiles have been proposed that have nichrome wires or iron-chrome wires inside the tile body. However, since the tile body has a large heat insulating property, it consumes a lot of electricity to melt snow, making it impractical. It has also been proposed to run nichrome wire on the roof, but it is difficult to insulate and is dangerous because it makes it difficult to step on the roof.
本考案は、従来の融雪瓦の有する大きな消費電
力並びに電気的絶縁及び足元の悪さ等の問題点を
悉く解決することを目的としている。 The present invention aims to solve all the problems of conventional snow-melting tiles, such as high power consumption, poor electrical insulation, and poor footing.
(ニ) 問題点を解決するための手段
本考案は、足元が悪くなるようなことがなく、
また、消費電力が少くて電気的絶縁にすぐれ、し
かも、加工が容易な融雪瓦を提供するものであ
る。(d) Means to solve the problem The present invention does not cause any problems,
Further, the present invention provides a snow melting tile that consumes less power, has excellent electrical insulation, and is easy to process.
すなわち、本考案は、瓦本体の少くとも一部の
表面上に配設される一対の導体部と、前記導体部
に対応する端部において該導体部に接続する皮膜
抵抗体部と、瓦本体の重ね代内に位置して瓦本体
の上面から下面に抜けて形成される少くとも一個
の貫通孔と、該貫通孔を通して設けられ、一端に
おいて前記導体部に接続し、他端において電線に
接続する接続部を具備することを特徴とする屋根
瓦にある。 That is, the present invention includes a pair of conductor parts disposed on at least a part of the surface of the tile main body, a film resistor part connected to the conductor part at an end corresponding to the conductor part, and a tile main body. at least one through hole located within the overlapping margin of the tile body and extending from the upper surface to the lower surface of the tile body, and provided through the through hole and connected to the conductor part at one end and connected to the electric wire at the other end. A roof tile is characterized in that it is provided with a connecting portion that connects the roof tile.
本考案において、瓦本体は、市販されている屋
根瓦を使用することができる。 In the present invention, commercially available roof tiles can be used as the tile body.
本考案において、皮膜抵抗体部形成用の皮膜材
料としては、主に、炭素皮膜抵抗材料及び厚膜抵
抗材料が使用されるが、瓦面上に被着されて発熱
性の皮膜を形成するものであれば、如何なる型式
の皮膜抵抗材料も使用でき、被着手段も皮膜材料
の形態及び性状に応じて適宜選択できる。例え
ば、炭素皮膜抵抗材料及び厚膜抵抗材料等の皮膜
抵抗材料は、瓦面上にスプレー、刷毛又はローラ
等による塗布、転写又はスクリーン印刷等により
被覆させ、これを適当な雰囲気で焼成又は焼付け
て、瓦面上に、例えば厚さ10〜20μｍ程度の比較
的厚い抵抗皮膜に形成される。 In the present invention, carbon film resistance materials and thick film resistance materials are mainly used as film materials for forming the film resistor part, but materials that are deposited on the tile surface to form a heat-generating film are used. If so, any type of film resistance material can be used, and the application means can be appropriately selected depending on the form and properties of the film material. For example, film resistance materials such as carbon film resistance materials and thick film resistance materials are coated on the tile surface by spraying, coating with a brush or roller, transfer, or screen printing, and then firing or baking in an appropriate atmosphere. A relatively thick resistive film with a thickness of, for example, about 10 to 20 μm is formed on the tile surface.
本考案において使用される炭素皮膜抵抗材料と
しては、炭素の微粉と熱硬化性樹脂の溶液からな
る抵抗インク等のコンポジシヨン皮膜抵抗材料等
がある。また、本考案において使用される厚膜抵
抗材料としては、市販のものであつてよく、例え
ば、金属粉末、金属酸化物粉末及びガラス質粉末
の混合物に有機樹脂バインダ、溶剤等を加えて塗
布するのに適当な粘度に調製されたものが使用さ
れる。金属粉末としては、例えば、銀、金、パラ
ジウム、ロジウム、タンタル、タングステン等が
使用され、金属酸化物粉末としては、例えば、パ
ラジウム、ロジウム、ルテニウム、タリウム、イ
ンジウム、アンチモン、銅、錫、ニツケル、トリ
ウム等の酸化物の粉末が使用され、ガラス粉末に
は、例えば、硼珪酸ガラスが用いられる。このよ
うな厚膜抵抗材料としては、例えば、RuO2，
RuO2−RhO2，RuO2−Ag，Ag−Pd，Pt又はAg
−Pd−PbO等を主成分としたものが市販されて
いる。 Examples of the carbon film resistance material used in the present invention include composite film resistance materials such as resistance ink made of fine carbon powder and a solution of thermosetting resin. Further, the thick film resistive material used in the present invention may be a commercially available material, such as a mixture of metal powder, metal oxide powder, and glassy powder to which an organic resin binder, a solvent, etc. are added, and then applied. A viscosity adjusted to the appropriate viscosity is used. Examples of metal powders used include silver, gold, palladium, rhodium, tantalum, and tungsten; examples of metal oxide powders include palladium, rhodium, ruthenium, thallium, indium, antimony, copper, tin, nickel, A powder of oxide such as thorium is used, and the glass powder is, for example, borosilicate glass. Such thick film resistance materials include, for example, RuO 2 ,
RuO 2 −RhO 2 , RuO 2 −Ag, Ag−Pd, Pt or Ag
-Pd-PbO etc. are commercially available.
本考案において、導体部、接続部、皮膜抵抗体
部は、その表面が、ほうろう或は釉薬によつて、
絶縁される。使用されるほうろう及び釉薬は、皮
膜抵抗体の融点より低い融点を有することが不可
欠であり、皮膜抵抗材料の種類に応じて適宜選ば
れる。釉薬の如何によつては、皮膜抵抗材料は、
瓦素地に直接塗布することができる。 In the present invention, the surfaces of the conductor part, the connection part, and the film resistor part are made of enamel or glaze.
Insulated. It is essential that the enamel and glaze used have a melting point lower than that of the film resistor, and are appropriately selected depending on the type of film resistor material. Depending on the type of glaze, the film resistance material can be
It can be applied directly to the tile base.
本考案において、皮膜抵抗体部を電源に接続さ
せるために、少くとも一対の導体部が、夫々、対
応する皮膜抵抗体部の端部に接続される。融雪の
際の水が屋根地に侵入するのを避け、かつ水によ
る絶縁不良を避けて、導体部を電源に接続するた
めに、導体部が接続する電線を、例えば桟瓦の場
合、屋根の地に例えば瓦桟に沿つて設けることが
できる。そこで、瓦の重ね代内に貫通孔を設け、
これに導体部に接続する接続部を介して、電線に
導体部を接続する。この接続部及び導体部は、例
えば導電塗料を塗布することによつて形成しても
よいが、リード線を埋設して形成してもよい。 In the present invention, in order to connect the film resistor part to a power source, at least one pair of conductor parts are respectively connected to the ends of the corresponding film resistor part. In order to prevent water from melting snow from entering the roof, and to avoid poor insulation due to water, and to connect the conductor to the power source, connect the electric wire connected to the conductor to the roof, e.g. For example, it can be provided along the roof tiles. Therefore, we created a through hole within the overlap of the tiles.
The conductor portion is connected to the electric wire via a connecting portion connected to the conductor portion. The connection portion and the conductor portion may be formed by applying a conductive paint, for example, or may be formed by embedding a lead wire.
本考案において、瓦面上に形成される皮膜抵抗
体部の形状は、導体間を接続するものであれば、
蛇行形、渦形、正方形、直方形等種々の形状に形
成することができる。しかし、平行する少くとも
一対の導体間を最短距離に結んで正方形、直方形
に形成するのが、加熱速度、温度の均一さ等の点
から好ましい。 In the present invention, the shape of the film resistor formed on the tile surface can be as long as it connects conductors.
It can be formed into various shapes such as serpentine, spiral, square, and rectangular. However, it is preferable to form a square or rectangular parallelepiped by connecting at least a pair of parallel conductors at the shortest distance from the viewpoint of heating rate, uniformity of temperature, etc.
本考案における融雪瓦は、屋根瓦として使用で
きるものであれば、平瓦、桟瓦、丸瓦、角瓦、掛
瓦、隅瓦、軒瓦、袖瓦、丸瓦、棟瓦、洋式瓦等
種々の形態のものとすることができる。 The snow-melting tiles in this invention can be used as roof tiles, such as flat tiles, cross tiles, round tiles, square tiles, hanging tiles, corner tiles, eave tiles, side tiles, round tiles, ridge tiles, Western-style tiles, etc. It can be of any form.
(ホ) 作用
本考案は、瓦本体面上に一対の導体を介して皮
膜抵抗体を電源に接続して設けたので、電源を入
れることによつて、瓦面上の皮膜抵抗体に電気が
通じ、その発熱により、瓦面上が加熱されること
になつて、瓦上に積つた雪を融かすことができ
る。したがつて、この融雪瓦を屋根の勾配面の例
えば上部及び中部等の適宜の箇所に設けると、上
部、中部及び下部の夫々下流側に溶けた水が流れ
て、屋根の雪を溶解することとなり、除雪の働き
をすることができる。(E) Effect In this invention, the film resistor is connected to the power source via a pair of conductors on the surface of the tile body, so when the power is turned on, electricity is applied to the film resistor on the tile surface. The generated heat heats the surface of the tiles, which can melt the snow that has piled up on the tiles. Therefore, if these snow melting tiles are installed at appropriate locations on the sloped surface of the roof, such as the upper and middle portions, the melted water will flow to the downstream side of the upper, middle, and lower portions, respectively, and melt the snow on the roof. This allows it to function as a snow remover.
また、本考案の瓦本体面の皮膜抵抗体部の面上
に、ほうろう或は釉薬を塗布し、さらに導体部と
配線間を接続する接続部案内用の貫通孔を重ね代
内に設けるので、融雪の際の水の屋根地への侵入
及び水による絶縁不良を避けることができ、しか
も、ほうろう、釉薬層の断熱作用は、層が薄いた
めに無視できる程小さい。 In addition, since enamel or glaze is applied to the surface of the film resistor portion on the surface of the tile main body of the present invention, and a through hole is provided within the overlap margin for guiding the connection portion that connects the conductor portion and the wiring. Intrusion of water into the roof during snow melting and poor insulation due to water can be avoided, and the insulation effect of the enamel and glaze layers is so small that it can be ignored because the layers are thin.
(ヘ) 実施例
添付図面を参照して、本考案の実施の態様の例
について説明するが、本考案は、以下の説明及び
例示により何ら制限されるものではない。(f) Examples Examples of embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited in any way by the following explanations and examples.
第１図は、本考案の屋根瓦の一実施例であつて
桟瓦の一例についてその一部を切欠いて現われる
断面を示した斜視図であり、第２図は、本考案の
屋根瓦の一実施例の桟瓦の一例について屋根に葺
いた場合の部分的平面図である。 FIG. 1 is an embodiment of the roof tile of the present invention, and is a perspective view showing a cross section of an example of the roof tile, which is partially cut away, and FIG. 2 is an embodiment of the roof tile of the present invention. It is a partial plan view when a roof is covered with an example of the crosspiece tile of the example.
本例の瓦１は桟瓦として一般に市販されている
ものであり、瓦素地２の略全面に釉薬掛けされて
釉薬層３が形成されている。 The tile 1 of this example is generally commercially available as a crosspiece tile, and substantially the entire surface of the tile base 2 is coated with glaze to form a glaze layer 3.
本例においては、尻部の釘穴４に並んで、ま
た、差込み部側の重ね代内に表面５から裏面に抜
けて、夫々、案内孔６及び６′が設けられており、
夫々の案内孔６及び６′には、接続線７及び７′が
配設されている。また、上側左隅部に、尻部の切
込８が設けられ、下側右隅部に頭部の切込８′
（切欠きにより完全に示されていない。）が設けら
れている。また、瓦１の上端部裏面には引掛（図
示されていない。）が設けられている。 In this example, guide holes 6 and 6' are provided, respectively, in line with the nail hole 4 in the butt part and extending from the front surface 5 to the back surface within the overlap margin on the insertion part side.
Connection lines 7 and 7' are arranged in the guide holes 6 and 6', respectively. Additionally, a butt cut 8 is provided at the upper left corner, and a head cut 8' is provided at the lower right corner.
(not fully shown due to cutout). Further, a hook (not shown) is provided on the back surface of the upper end of the tile 1.
本例の瓦１には、表面５に抵抗皮膜９が被着さ
れており、この抵抗皮膜９には、櫛形の導体部１
０及び１１が設けられている。この抵抗皮膜９及
び導体部１０及び１１の領域は、ほうろう、釉薬
等の皮膜により絶縁されている。櫛形の導体部１
０は、接続線７に接続して、瓦１の表面に被着さ
れており、その櫛形の端部１０′及び１０″が抵抗
皮膜に接続している。一方櫛形の導体部１１は、
接続線７′に接続して、瓦１の表面に被着されて
おり、その櫛形の端部１１′及び１１″は、他方の
櫛形導体部１０の端部１０′及び１０″と互い違い
に位置して抵抗皮膜９に接続している。 The roof tile 1 of this example has a resistive film 9 adhered to its surface 5, and this resistive film 9 has a comb-shaped conductor portion 1.
0 and 11 are provided. The regions of the resistive film 9 and the conductor portions 10 and 11 are insulated by a film of enamel, glaze, or the like. Comb-shaped conductor part 1
0 is connected to the connecting wire 7 and is adhered to the surface of the tile 1, and its comb-shaped ends 10' and 10'' are connected to the resistance film.On the other hand, the comb-shaped conductor part 11 is
It is connected to the connecting wire 7' and adhered to the surface of the tile 1, and its comb-shaped ends 11' and 11'' are positioned alternately with the ends 10' and 10'' of the other comb-shaped conductor part 10. and is connected to the resistive film 9.
本例の桟瓦１は、他の桟瓦と一緒に桟瓦葺の葺
き方に従つて葺かれるが、本例の桟瓦１は、例え
ば基準瓦桟から上方の同じ瓦桟１２に揃つて緊結
して葺かれる。この場合、屋根地１３に電線１４
及び１４′を桁行方向に這わせ、これに本例の桟
瓦１の接続線７及び７′を夫々接続する。ここで
使用する電線は漏電等の防止を考慮して被覆電線
が使用される。桟瓦１の接続する箇所では適宜接
続端子（図示されていない。）を有する電線が分
岐されており、該端子を介して、瓦１の接続線７
及び７′の接続が行われる。電線に負荷する電圧
は、６〜200ボルトの範囲で使用されるが、６〜
50ボルトの電圧を使用すると危険がなく好まし
い。 The tile roof tiles 1 of this example are roofed together with other tile tiles according to the method of roofing tile roofs, but the tile tiles 1 of this example are, for example, roofed by being tightly connected to the same tile roof 12 above the standard tile tile. It will be destroyed. In this case, the electric wire 14 is attached to the roof 13.
and 14' are extended in the column direction, and the connection lines 7 and 7' of the crosspiece tile 1 of this example are connected to these, respectively. The electric wire used here is a covered electric wire in consideration of prevention of electric leakage, etc. Electric wires having appropriate connection terminals (not shown) are branched at the locations where the crosspiece tile 1 is connected, and the connection wires 7 of the tile 1 are connected via the terminals.
and 7' connections are made. The voltage applied to the wire is used in the range of 6 to 200 volts, but
Using a voltage of 50 volts is safe and preferred.
本例の瓦は、屋根にこのようにして葺かれるの
で、例えば、降雪時に適宜断続的に電源を入れる
ようにしておけば、本例の瓦１に積る雪は抵抗皮
膜の発熱によつて融解されて除かれる。この融解
により水が流れ始めるが、この水の流れは、それ
より下部の屋根の雪を融解させるので、自動的に
除雪の働きを行うことができる。また、積雪した
屋根の雪を、例えば、夜間電力を使用して除雪す
ることができる。 Since the tile of this example is installed on the roof in this way, for example, if the power is turned on intermittently when it snows, the snow that accumulates on the tile 1 of this example will be absorbed by the heat generated by the resistive film. It is melted and removed. This melting causes water to start flowing, and this flow of water melts the snow on the roof below, so it can automatically perform the function of snow removal. Furthermore, snow on the roof can be removed by using nighttime electricity, for example.
(ト) 考案の効果
本考案は、瓦本体表面上に皮膜抵抗部を形成し
たので、皮膜抵抗体の発熱により、自動的に屋根
上の雪を融解して除去するので、従来の屋根瓦に
比較して、屋根上に上つて、除雪する必要がな
い。しかも、除雪するのに電源のスイツチを入れ
ればよく、除雪が簡単かつ容易に行うことができ
る。(g) Effects of the invention This invention forms a film resistor on the surface of the tile body, so the heat generated by the film resistor automatically melts and removes snow on the roof, making it different from conventional roof tiles. In comparison, there is no need to climb onto the roof to remove snow. Moreover, all that is required to remove snow is to turn on the power, making snow removal simple and easy.
また、本考案の瓦は、屋根瓦製造時に、或は、
市販の屋根瓦に厚膜抵抗材料を塗布して、焼成す
る等によつて画一的に製造できるので、機械化が
容易であり、大量に生産することができ、生産性
にすぐれている。 In addition, the tiles of the present invention can be used at the time of manufacturing roof tiles, or
Since it can be uniformly manufactured by coating a commercially available roof tile with a thick film resistive material and firing it, it is easy to mechanize, can be produced in large quantities, and has excellent productivity.
また、本考案の瓦は、瓦面上に、厚膜抵抗材料
層の皮膜抵抗体部及び導体部を形成させると共
に、瓦の重ね代内に貫通孔を形成して、電源との
接続を図るので、瓦面上に異物感がなく、屋根上
に上つても足場が悪くならない。しかも、ほうろ
う、釉薬等の電気絶縁材を塗布して焼成すること
によつて、電気絶縁できるので、電気絶縁によつ
て足場を損うこともなく、耐食性にすぐれ、腐食
等によるトラブルも解消することができる。 In addition, the tile of the present invention has a film resistor part and a conductor part of a thick film resistive material layer formed on the tile surface, and a through hole is formed in the overlapping margin of the tile to connect to a power source. Therefore, there is no feeling of foreign objects on the tile surface, and your footing will not be compromised even if you climb on the roof. Moreover, it can be electrically insulated by applying an electrically insulating material such as enamel or glaze and firing it, so the electrical insulation does not damage the scaffolding, has excellent corrosion resistance, and eliminates problems caused by corrosion. be able to.
第１図は、本考案の屋根瓦の一実施例であつて
桟瓦の一例についてその一部を切欠いて現われる
断面を示した斜視図であり、第２図は、本考案の
屋根瓦の一実施例の桟瓦の一例について屋根に葺
いた場合の部分的平面図である。
図中の符号については、１は瓦或は桟瓦、２は
瓦素地、３は釉薬層、４は釘穴、５は表面、６及
び６′は案内孔、７及び７′は接続線、８及び８′
は切込、９は抵抗皮膜、１０及び１１は櫛形の導
体部、１０′，１０″，１１′及び１１″は櫛形の端
部、１２は瓦桟、１３は屋根地並びに１４及び１
４′は電線である。
FIG. 1 is an embodiment of the roof tile of the present invention, and is a perspective view showing a cross section of an example of the roof tile, which is partially cut away, and FIG. 2 is an embodiment of the roof tile of the present invention. It is a partial plan view when a roof is covered with an example of the crosspiece tile of the example. Regarding the symbols in the figure, 1 is a tile or tile, 2 is a tile base, 3 is a glaze layer, 4 is a nail hole, 5 is a surface, 6 and 6' are guide holes, 7 and 7' are connection lines, and 8 and 8'
9 is a notch, 9 is a resistive film, 10 and 11 are comb-shaped conductor parts, 10', 10'', 11' and 11'' are comb-shaped ends, 12 is a tile beam, 13 is a roof, and 14 and 1
4' is an electric wire.
Claims (1)
対の導体部と、前記導体部に対応する端部におい
て該導体部に接続する皮膜抵抗体部と、瓦本体の
重ね代内に位置して瓦本体の上面から下面に抜け
て形成される少くとも一個の貫通孔と、該貫通孔
を通して設けられ、一端において前記導体部に接
続し、他端において電線に接続する接続部を具備
することを特徴とする屋根瓦。 a pair of conductor parts disposed on at least a part of the surface of the tile body; a film resistor part connected to the conductor part at an end corresponding to the conductor part; and a film resistor part located within the overlap margin of the tile body. at least one through hole formed through the tile main body from the upper surface to the lower surface, and a connecting portion provided through the through hole and connected to the conductor portion at one end and connected to the electric wire at the other end. Roof tiles characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10759685U JPH0348976Y2 (en) | 1985-07-16 | 1985-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10759685U JPH0348976Y2 (en) | 1985-07-16 | 1985-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6216618U JPS6216618U (en) | 1987-01-31 |
| JPH0348976Y2 true JPH0348976Y2 (en) | 1991-10-18 |
Family
ID=30984022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10759685U Expired JPH0348976Y2 (en) | 1985-07-16 | 1985-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348976Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0723641B2 (en) * | 1987-11-13 | 1995-03-15 | 島根県 | Snow melting roof tile |
-
1985
- 1985-07-16 JP JP10759685U patent/JPH0348976Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6216618U (en) | 1987-01-31 |
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