JPH034963A - Method for applying water-soluble release agent to cold die - Google Patents
Method for applying water-soluble release agent to cold dieInfo
- Publication number
- JPH034963A JPH034963A JP13799089A JP13799089A JPH034963A JP H034963 A JPH034963 A JP H034963A JP 13799089 A JP13799089 A JP 13799089A JP 13799089 A JP13799089 A JP 13799089A JP H034963 A JPH034963 A JP H034963A
- Authority
- JP
- Japan
- Prior art keywords
- release agent
- water
- soluble
- mold release
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000006082 mold release agent Substances 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- 239000007921 spray Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract 1
- 239000004480 active ingredient Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、約１２０℃以下の低温の金型に水溶性離型剤
を塗布する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method of applying a water-soluble mold release agent to a mold at a low temperature of about 120° C. or lower.
（従来技術及びその問題点）
例えばポリウレタン製品を代表とする樹脂成形、セラミ
ック成形、金属のダイカスト法のような成形作業では、
金型温度が概ね１２０℃以下で行なわれる場合がしばし
ばあった。このような低温の金型表面に塗布する離型剤
としては、ワックス、鉱物油、合成油、シリコーンオイ
ル等の離型作用に寄与する有効成分を、石油系溶剤、塩
素系溶剤、フロン系溶剤等の有機溶剤で希釈又は溶解し
たものが用いられていた。(Prior art and its problems) For example, in molding operations such as resin molding of polyurethane products, ceramic molding, and metal die casting,
In many cases, the mold temperature was approximately 120° C. or lower. As a mold release agent applied to the surface of such a low-temperature mold, active ingredients that contribute to the mold release effect such as wax, mineral oil, synthetic oil, silicone oil, petroleum-based solvent, chlorine-based solvent, or fluorocarbon-based solvent may be used. diluted or dissolved with organic solvents such as
しかし石油系溶剤は火災の危険があり、塩素系溶剤とと
もに労働安全衛生法の規制を受けており、またフロン化
合物は大気中のオゾンを破壊するものとして規制の対象
となっている。またこれらの溶剤系は個別のタンクに収
容した状態で用いるため、タンクの設置に手間を要し、
面倒であった。However, petroleum-based solvents pose a fire risk and are subject to regulations under the Industrial Safety and Health Act, along with chlorinated solvents, and fluorocarbon compounds are subject to regulations as they destroy ozone in the atmosphere. In addition, these solvent systems are used in separate tanks, which requires time and effort to install the tanks.
It was a hassle.
そこで水溶性離型剤を用いることが望まれていた。Therefore, it has been desired to use a water-soluble mold release agent.
水溶性離型剤を用いるにおいては、有効成分を速かに金
型に付着させることが圧ましい。そのためには水溶性離
型剤中の水分を速かに蒸発させる必要がある。しかし金
型の温度が低い場合には水分は蒸発し難く、蒸発に要す
る時間が長くなる。When using a water-soluble mold release agent, it is important to quickly adhere the active ingredient to the mold. For this purpose, it is necessary to quickly evaporate water in the water-soluble mold release agent. However, when the temperature of the mold is low, moisture is difficult to evaporate and the time required for evaporation becomes longer.
一般に金型の温度が約１２０℃以下である場合には、水
分の蒸発に長時間を要するため生産ラインに支障を来た
す。一方水分の蒸発を速めるべく、金型に塗布された水
溶性離型剤に対し空気を吹付けることが考えられたが、
有効成分まで飛散してしまうという問題があった。Generally, when the temperature of the mold is about 120° C. or lower, it takes a long time for water to evaporate, which causes problems on the production line. On the other hand, in order to speed up the evaporation of water, it was considered to blow air against the water-soluble mold release agent applied to the mold, but
There was a problem that even the active ingredients were scattered.
（発明の目的）
本発明の目的は、低温の金型に水溶性離型剤を塗布する
方法であって、生産ラインに支障を来たすことのないよ
う水溶性離型剤中の水分を速かに蒸発させることのでき
る方法を提供することである。(Object of the Invention) The object of the present invention is to provide a method for applying a water-soluble mold release agent to a mold at a low temperature, and to quickly remove water in the water-soluble mold release agent so as not to cause trouble to the production line. The purpose of the present invention is to provide a method that allows the evaporation of
（発明の構成）
本発明は、塗布された水溶性離型剤中の水分が蒸発し難
いために生産ラインに支障を来たすような低温の金型に
、水溶性離型剤を塗布する方法において、加圧された熱
風により水溶性離型剤を噴霧するようにしたことを特徴
とする低温金型への水溶性離型剤塗布方法である。(Structure of the Invention) The present invention provides a method for applying a water-soluble mold release agent to a low-temperature mold where water in the applied water-soluble mold release agent is difficult to evaporate, causing problems on the production line. , a method for applying a water-soluble mold release agent to a low-temperature mold, characterized in that the water-soluble mold release agent is sprayed using pressurized hot air.
（作用）
水溶性離型剤中の水分は、金型に吹付けられるまでの間
に熱風の熱により蒸発する。(Function) The water in the water-soluble mold release agent is evaporated by the heat of the hot air before it is sprayed onto the mold.
（実施例）
第１図は本発明の低温金型への水溶性離型剤塗布方法に
用いられる塗布器具を示す概略図である。(Example) FIG. 1 is a schematic diagram showing an applicator used in the method of applying a water-soluble mold release agent to a low-temperature mold according to the present invention.
この塗布器具１０は、コイル状のニクロム線からなるヒ
ータ１と、噴霧ノズル２と、水溶性離型剤の供給管３と
を主要部品として備えている。４はウレタン製品を成形
するための金型であり、作業時には約８０℃となる。水
溶性離型剤としては有効成分としてワックスを３〜５％
含有したものを用いている。ワックスは水で希釈され又
は水に溶解されている。This applicator 10 includes a heater 1 made of a coiled nichrome wire, a spray nozzle 2, and a water-soluble release agent supply pipe 3 as main components. 4 is a mold for molding urethane products, and the temperature is approximately 80°C during operation. As a water-soluble mold release agent, 3-5% wax is used as an active ingredient.
I am using the one that contains it. The wax is diluted with water or dissolved in water.
本発明の方法は塗布器具１０を用いて次のように行なわ
れる。即ち例えば４〜１０Ｋｇ／ｃ−に加圧された空気
が、ヒータ１中を通ってノズル２に送られる。このとき
空気はヒータ１中にて例えば４００〜６００℃に加熱さ
れ、熱風となってノズル２に送られる。一方、水溶性離
型剤が例えば２１（ｇ／Ｃ−に加圧され、供給管３を経
てノズル２に送られる。これにより水溶性離型剤は熱風
によってノズル２から噴霧され、金型４に吹付けられる
。このとき水溶性離型剤中の水分は、金型４に吹付けら
れるまでの間に熱風の熱により蒸発する。従って有効成
分即ちワックスだけが熱風の圧力により金型４に吹付け
られ金型４に付着することとなる。The method of the present invention is carried out using the applicator 10 as follows. That is, air pressurized to, for example, 4 to 10 kg/c is sent to the nozzle 2 through the heater 1 . At this time, the air is heated in the heater 1 to, for example, 400 to 600°C, and is sent to the nozzle 2 as hot air. On the other hand, the water-soluble mold release agent is pressurized to, for example, 21 (g/C-) and sent to the nozzle 2 via the supply pipe 3. As a result, the water-soluble mold release agent is sprayed from the nozzle 2 by hot air, and the mold 4 At this time, the moisture in the water-soluble mold release agent is evaporated by the heat of the hot air before it is sprayed onto the mold 4. Therefore, only the active ingredient, that is, the wax, is evaporated into the mold 4 by the pressure of the hot air. It is sprayed and adheres to the mold 4.
（発明の効果）
以上のように本発明によれば、約８０℃の低温の金型４
に水溶性離型剤を塗布する際に、加圧された熱風により
水溶性離型剤を噴霧するようにしたので、金型４に吹付
けられるまでの間に水溶性離型剤中の水分を熱風の熱に
より蒸発させることができる。従って低温の金型４に水
溶性離型剤を塗布する場合において、生産ラインに支障
を来たすことなく水゛溶性離型剤中の水分を速かに蒸発
させることができ、低温の金型４を用いた成形作業に水
溶性離型剤を有効に用いることができる。(Effects of the Invention) As described above, according to the present invention, the mold 4 at a low temperature of about 80°C
When applying the water-soluble mold release agent to the mold 4, the water-soluble mold release agent is sprayed with pressurized hot air, so the moisture in the water-soluble mold release agent is removed before it is sprayed onto the mold 4. can be evaporated by the heat of hot air. Therefore, when applying a water-soluble mold release agent to the low-temperature mold 4, the water in the water-soluble mold release agent can be quickly evaporated without disturbing the production line. A water-soluble mold release agent can be effectively used in molding operations using.
また水溶性離型剤は有効成分を水で希釈したものである
ので、安価であり、個別タンクを用いることなく通常の
配管により用いることができる。Furthermore, since the water-soluble mold release agent is made by diluting the active ingredient with water, it is inexpensive and can be used through normal piping without using a separate tank.
従って低温の金型４を用いた成形作業を安価且つ簡易に
行なうことができる。Therefore, the molding operation using the low-temperature mold 4 can be performed easily and inexpensively.
（別の実施例）
用いる水溶性離型剤が上記実施例より少量の場合は第２
図に示すように、水溶性離型剤を供給ノズ・ル３ａにお
いて予め空気と混合し、ノズル２にプレミキシング供給
するようにしてもよい。なお図において、第１図と同一
符号は同じものを示す。(Another Example) If the amount of water-soluble mold release agent used is smaller than in the above example, the second
As shown in the figure, the water-soluble mold release agent may be premixed with air in the supply nozzle 3a and supplied to the nozzle 2 by premixing. In the figure, the same reference numerals as in FIG. 1 indicate the same things.
また上述した２つの実施例では金型４の温度は約８０℃
であるが、本発明の方法は、塗布された水溶性離型剤の
水分が蒸発し難いために生産ラインに支障を来たすよう
な温度の金型に有効に適用できる。具体的には約１２０
℃以下の温度である。Furthermore, in the two embodiments described above, the temperature of the mold 4 is approximately 80°C.
However, the method of the present invention can be effectively applied to molds whose temperature is such that the water in the applied water-soluble mold release agent is difficult to evaporate, thereby causing problems on the production line. Specifically about 120
The temperature is below ℃.
第１図は本発明の低温金型への水溶性離型剤塗布方法に
用いられる塗布器具を示す概略図、第２図は塗布器具の
別の例を示す概略図である。ｌ・・・ヒータ、２・・・
噴霧ノズル、３・・・供給管、３ａ・・・供給ノズル、
４・・・金型FIG. 1 is a schematic view showing an applicator used in the method of applying a water-soluble mold release agent to a low-temperature mold according to the present invention, and FIG. 2 is a schematic view showing another example of the applicator. l...Heater, 2...
Spray nozzle, 3... supply pipe, 3a... supply nozzle,
4... Mold
Claims (1)
産ラインに支障を来たすような低温の金型に、水溶性離
型剤を塗布する方法において、加圧された熱風により水
溶性離型剤を噴霧するようにしたことを特徴とする低温
金型への水溶性離型剤塗布方法。In this method, a water-soluble mold release agent is applied to a mold at a low temperature where the water in the water-soluble mold release agent is difficult to evaporate, causing problems on the production line. A method for applying a water-soluble mold release agent to a low-temperature mold, characterized in that the mold release agent is sprayed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13799089A JPH034963A (en) | 1989-05-31 | 1989-05-31 | Method for applying water-soluble release agent to cold die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13799089A JPH034963A (en) | 1989-05-31 | 1989-05-31 | Method for applying water-soluble release agent to cold die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH034963A true JPH034963A (en) | 1991-01-10 |
Family
ID=15211486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13799089A Pending JPH034963A (en) | 1989-05-31 | 1989-05-31 | Method for applying water-soluble release agent to cold die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034963A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4948283A (en) * | 1987-11-04 | 1990-08-14 | Hitachi, Ltd. | Apparatus for processing and printing document |
| JP2013208714A (en) * | 2012-03-30 | 2013-10-10 | Robotech Co Ltd | Spray device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5644069A (en) * | 1979-09-14 | 1981-04-23 | Toyota Motor Corp | Spray coating method of top coating water paint |
| JPS58104672A (en) * | 1981-12-15 | 1983-06-22 | Nippon Sogo Bosui Kk | Method for applying emulsion by spraying |
| JPS59150569A (en) * | 1983-02-16 | 1984-08-28 | Nissan Motor Co Ltd | Air spray coating method |
| JPS6064661A (en) * | 1983-09-16 | 1985-04-13 | Kyusaku Nomoto | Spray painting method |
-
1989
- 1989-05-31 JP JP13799089A patent/JPH034963A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5644069A (en) * | 1979-09-14 | 1981-04-23 | Toyota Motor Corp | Spray coating method of top coating water paint |
| JPS58104672A (en) * | 1981-12-15 | 1983-06-22 | Nippon Sogo Bosui Kk | Method for applying emulsion by spraying |
| JPS59150569A (en) * | 1983-02-16 | 1984-08-28 | Nissan Motor Co Ltd | Air spray coating method |
| JPS6064661A (en) * | 1983-09-16 | 1985-04-13 | Kyusaku Nomoto | Spray painting method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4948283A (en) * | 1987-11-04 | 1990-08-14 | Hitachi, Ltd. | Apparatus for processing and printing document |
| JP2013208714A (en) * | 2012-03-30 | 2013-10-10 | Robotech Co Ltd | Spray device |
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