JPH034U - - Google Patents
Info
- Publication number
- JPH034U JPH034U JP5773789U JP5773789U JPH034U JP H034 U JPH034 U JP H034U JP 5773789 U JP5773789 U JP 5773789U JP 5773789 U JP5773789 U JP 5773789U JP H034 U JPH034 U JP H034U
- Authority
- JP
- Japan
- Prior art keywords
- case material
- package structure
- case
- distance
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図は本考案の一実施例の電子部品のパツケ
ージ構造がプリント回路基板に取付けられた状態
を示す側面断面図、第2図a及びbは従来の電子
部品のパツケージ構造を説明するための正面断面
図及び側面断面図、第3図は第1図実施例の電子
部品のパツケージ構造の正面断面図、第4図a及
びbは端子板の平面図及び側面図を示す。
図において、11はケース材、12は蓋材、1
3は電子部品素子、14,15は端子板、14d
は段差、14e,15eは挿入部、16,17は
突起部を示す。
FIG. 1 is a side cross-sectional view showing a state in which a package structure for an electronic component according to an embodiment of the present invention is attached to a printed circuit board, and FIGS. 3 shows a front sectional view of the electronic component package structure of the embodiment shown in FIG. 1, and FIGS. 4a and 4b show a plan view and a side view of the terminal board. In the figure, 11 is a case material, 12 is a lid material, 1
3 is an electronic component element, 14 and 15 are terminal boards, 14d
14e and 15e are insertion portions, and 16 and 17 are protrusion portions.
Claims (1)
ース材に嵌合固定された蓋材と、 前記ケース材に収納された電子部品素子と、 前記電子部品素子を弾力挟持するように、前記
ケース材に取付けられており、かつ前記ケース材
の下面から外部に引出された部分を有する少なく
とも2枚の端子板とを備え、前記端子板のケース
材外の部分には、段差を経て相対的に幅の狭い挿
入部が先端側に設けられている電子部品のパツケ
ージ構造において、 前記ケース材の下面から前記段差までの距離よ
りも長い突起部が、前記ケース材の下面に突出形
成されていることを特徴とする電子部品のパツケ
ージ構造。[Scope of Claim for Utility Model Registration] A case material having an opening at the top; a lid material fitted and fixed to the case material so as to close the opening of the case material; and an electronic device housed in the case material. a component element; and at least two terminal boards that are attached to the case material so as to elastically sandwich the electronic component element and have a portion drawn out from the bottom surface of the case material, In a package structure for electronic components in which a relatively narrow insertion portion is provided on the tip side of the terminal board outside the case material through a step, the distance from the bottom surface of the case material to the step is greater than the distance from the bottom surface of the case material to the step. A package structure for electronic components, characterized in that a long protrusion is formed protrudingly from the lower surface of the case material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989057737U JP2508674Y2 (en) | 1989-05-18 | 1989-05-18 | Electronic component package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989057737U JP2508674Y2 (en) | 1989-05-18 | 1989-05-18 | Electronic component package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH034U true JPH034U (en) | 1991-01-07 |
| JP2508674Y2 JP2508674Y2 (en) | 1996-08-28 |
Family
ID=31582719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989057737U Expired - Lifetime JP2508674Y2 (en) | 1989-05-18 | 1989-05-18 | Electronic component package structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508674Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010268971A (en) * | 2009-05-21 | 2010-12-02 | Nittcho Yamato:Kk | Universal hair tapering leather and universal hair tapering method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987102U (en) * | 1982-12-02 | 1984-06-13 | ティーディーケイ株式会社 | Positive characteristic thermistor device |
| JPS6262401U (en) * | 1985-10-08 | 1987-04-17 |
-
1989
- 1989-05-18 JP JP1989057737U patent/JP2508674Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987102U (en) * | 1982-12-02 | 1984-06-13 | ティーディーケイ株式会社 | Positive characteristic thermistor device |
| JPS6262401U (en) * | 1985-10-08 | 1987-04-17 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010268971A (en) * | 2009-05-21 | 2010-12-02 | Nittcho Yamato:Kk | Universal hair tapering leather and universal hair tapering method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2508674Y2 (en) | 1996-08-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |