JPH0350793A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable adsorption to a mounting head by an automatic machine, and to attain automatic mounting by installing an adsorption pad, which does not constitute an electric circuit and an upper section of which is formed in a plane, at a central section on the surface side of a substrate. CONSTITUTION:Conductor patterns 2 are printed and formed onto a ceramic board 1, and a printed resistance element 3 and protective glass are printed, thus shaping a thick-film circuit board. Electronic parts 4 are mounted onto the thick-film circuit board, and external terminals 5 are soldered. An adsorption pad 7 is fixed at an assigned position at the central section of the thick-film circuit board by an insulating adhesive material. The thick-film circuit board, the electronic parts 4, the conductor patterns 2 and external-terminal joining sections are sheathed with a liquefied resin 6. Accordingly, adsorption to the mounting head of an automatic machine is enabled, thus attaining the automatic mounting of a hybrid integrated circuit device.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a hybrid integrated circuit device used in various electronic devices.

2. Description of the Related Art A conventional hybrid integrated circuit device will be explained with reference to FIGS. 4 and 5.

FIG. 4 is a perspective view of a conventional hybrid integrated circuit device, in which a conductor pattern 2 is printed on a ceramic substrate 1, a printed resistive element 3 and a protective glass are printed, and a thick film circuit is formed. A substrate (hereinafter abbreviated as a substrate) is configured.

Next, the electronic component 4 is mounted on the board, the external terminals 5 are soldered, and the joints between the board, the electronic component 4, the conductor pattern 2, and the external terminal 5 are covered with liquid resin.

FIG. 5 is a sectional view of a conventional hybrid integrated circuit device, which has the same configuration as FIG. 5 and is covered with liquid resin 6.

Problems to be Solved by the Invention However, with the above configuration, if the layout of the electronic components differs in the design of the conductor pattern 2, or if the shape (length, width, thickness) of the electronic components used differs, the resin Since the external shape of the product after packaging is complicated and irregular, there was a problem that it could not be automatically mounted using an automatic machine.

FIG. 6 shows a side view of the positional relationship between a conventional hybrid integrated circuit device and a suction bed of an automatic machine.

In the figure, the mounting head 8 of the automatic machine is adapted to adsorb a designated flat portion of the hybrid integrated circuit device.
Due to the shape of the electronic component 4, there is a step in the external shape, so the mounting head 8 of an automatic machine cannot pick it up, and automatic mounting is not possible.

The present invention solves the above problems and provides a structure of a hybrid integrated circuit device that can be automatically mounted.

Means for Solving the Problems In order to solve this problem, in the present invention, a suction pad with a flat top, which does not constitute an electric circuit, is provided in the center of the front side of the substrate.

Effects According to the above configuration, the flat part can be fixed to the outer shape of the hybrid integrated circuit device, and it is possible to adsorb it to the mounting head by an automatic machine, and also the suction pad, the external terminal, and the ceramic substrate to which the external terminal is connected. Automatic mounting can be achieved by adjusting the relative position with the land above.

Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view of a hybrid integrated circuit device having a structure according to an embodiment of the present invention, in which a conductor pattern 2 is printed on a ceramic substrate 1, and a printed resistor element 3 and a protective glass (not shown) are also printed. Then, a thick film circuit board is formed.

Next, electronic components 4 are mounted on the thick film circuit board, and external terminals 5 are soldered.

Next, the suction pad 7 is fixed to a designated location in the center of the thick film circuit board using an insulating adhesive material (not shown).

Note that the pattern is designed in advance so that the electronic component 4 is not mounted at the location where the suction pad 7 is fixed. After that, liquid resin 6 is applied to thick film circuit boards, electronic parts 4. The conductor pattern 2 and the external terminal joint are covered.

FIG. 2 is a sectional view of a hybrid integrated circuit device according to the present invention, which has the same configuration as FIG. 1, but is packaged with liquid resin 6.

FIG. 3 is a side view showing the positional relationship between a hybrid integrated circuit device having a structure according to the present invention and an automatic machine mounting head.

In the figure, the mounting head 8 of the automatic machine can perform suction using the flat portion 7a of the suction pad 7 fixed to the thick film circuit board.

As described in detail, according to the present invention, by fixing the suction pad, an automatic machine mounting head can be suctioned, and a hybrid integrated circuit device can be automatically mounted.

[Brief explanation of drawings]

1 and 2 are respectively a perspective view and a side sectional view of a hybrid integrated circuit device according to an embodiment of the present invention, and FIG. 3 shows the positional relationship between the hybrid integrated circuit device of the present invention and an automatic machine mounting head. 4 and 5 are respectively a perspective view and a sectional side view of a conventional hybrid integrated circuit, and FIG. 6 is a side view showing the positional relationship between a conventional hybrid integrated circuit device and an automatic machine mounting head. . DESCRIPTION OF SYMBOLS 1...Ceramic board, 2...Conductor pattern, 3...Printed resistance element, 4...Electronic component, 5...External terminal, 6... ...Suction pad.

Claims (1)

[Claims] A hybrid integrated circuit device that has a suction pad in the center of a thick film circuit board that has a flat top and is not connected to an electrical circuit.