JPH0350927Y2 - - Google Patents
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- Publication number
- JPH0350927Y2 JPH0350927Y2 JP6107285U JP6107285U JPH0350927Y2 JP H0350927 Y2 JPH0350927 Y2 JP H0350927Y2 JP 6107285 U JP6107285 U JP 6107285U JP 6107285 U JP6107285 U JP 6107285U JP H0350927 Y2 JPH0350927 Y2 JP H0350927Y2
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- 239000004065 semiconductor Substances 0.000 claims description 80
- 150000002500 ions Chemical class 0.000 claims description 34
- 239000013078 crystal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 230000035515 penetration Effects 0.000 claims description 21
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000003574 free electron Substances 0.000 description 16
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- 230000004888 barrier function Effects 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 7
- 238000005036 potential barrier Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 241000227653 Lycopersicon Species 0.000 description 5
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- 229910052737 gold Inorganic materials 0.000 description 5
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 210000003141 lower extremity Anatomy 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 210000000056 organ Anatomy 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000001225 therapeutic effect Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 102000014150 Interferons Human genes 0.000 description 2
- 108010050904 Interferons Proteins 0.000 description 2
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- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
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- 238000002474 experimental method Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
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- 229940047124 interferons Drugs 0.000 description 2
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- 239000008188 pellet Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910017942 Ag—Ge Inorganic materials 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 241000699660 Mus musculus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KTLOQXXVQYUCJU-UHFFFAOYSA-N [Cu].[Cu].[Se] Chemical compound [Cu].[Cu].[Se] KTLOQXXVQYUCJU-UHFFFAOYSA-N 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
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Landscapes
- Electrotherapy Devices (AREA)
Description
本考案は、生体の皮膚表面から半導体イオンを
体内に浸透せしめる半導体イオン浸透具に関す
る。
生体は20〜30種類の元素の有機的結合体で形成
された非常に効率的な熱機関である。外部より補
給されたエネルギー源は体内で分解精製されて最
終的には比較的簡単な組成の有機物となり、酸化
還元反応の結果熱エネルギーを放出する。生体は
この熱エネルギーを摂取して各器官の動力源とし
ている。前記した生体系のエネルギー補給素過程
を担う器官が病源菌の侵入や機械的損傷などによ
つてうまく機能しなくなると、生体活動全体が深
刻な影響を受ける。そこで生体には自己補修能力
が備わつており、器官の機能回復にあたる。外敵
抗原の侵入を察知し防禦体制を作動させる(抗体
反応)自己免疫作用を司どる物質として、最近イ
ンターフエロンやインターロイキンが注目されて
いる。このような物質は動物自らが作り出してい
るが、臨戦時(機能損傷発生時)に必らずしも充
分濃度存在するわけではなく、治癒効果が不充分
であることも多い。前記自己免疫作用を活性化さ
せるひとつの方策として、近年生体組織内に元来
存在していないか或いはごく微量しか存在してい
ない元素を人為的に生体組織内に投与し、該元素
の排斥を生理的に促す過程でインターフエロンや
インターロイキンの増殖をはかることが試みら
れ、注目されている。このような効果を示す元素
にゲルマニウムやシリコン、セレニウムなどの半
導体がある。通常これら半導体は無機質であり、
したがつてそのまま人体等に経口投与しても組織
内に吸収されずに排出されるため、有機化して用
いることが多い。しかし、有機化することによつ
て製造コストがかさみ、高価になることや、経口
投与のため必要患部への局所高濃度投与が難しい
などの問題点があつた。
本考案の半導体イオン浸透具はきわめて簡単な
構造であり、生体電池と半導体接合の原理を組合
せて応用し、生体外から生体組織内の必要個所へ
半導体元素をイオン化して浸透せしめることによ
つて前記問題点を解消せんとするものである。す
なわち、被浸透イオンを発生する半導体結晶と標
準単極電位が該半導体よりほぼEg/2eボルト以
上高い金属とを電気的に接合した素子に皮接具を
貼布し、該皮接具で該素子を生体皮膚面の必要個
所に圧着して用いる。ここで、Egは上記半導体
の禁制帯幅に相当するエネルギーであり、eは電
子電荷量をさす。生体皮膚面は電気的にみれば一
種の導電抵抗体であり、この結果、半導体結晶の
両側に抵抗体の接合(電位障壁)が生じ、電池作
用とこの半導体接合の作用によつて半導体のイオ
ン化と生体内浸透拡散が惹起する。以下に図面を
用いて本考案の原理を説明する。
第1図aは本考案の実施例である半導体イオン
浸透具(1例)を生体皮膚面4に装着した様子を
示す(断面図)。図において半導体イオン浸透具
は、被浸透イオンを発生する半導体結晶(甲)
1、甲と電気的に接合した金属(乙)2、皮接具
3より成る。第1図aでは甲1および乙2が同時
に皮膚面4に圧接しているが、エネルギーバンド
を用いて本考案の原理を説明するために、まず乙
2のみが生体皮膚面4に接しており、甲1は4に
接していない場合を考える。この時、各物質
(1,2,4)は一応熱的平衡状態にあると見做
されるので、エネルギーバンドダイヤグラムは第
1図bのようになる。半導体結晶甲は非ドープn
型導電性をもつ単結晶とした。甲1と乙2の界面
および甲1と生体皮膚面4との界面には、いわゆ
るシヨツトキー障壁が形成され、空乏層が甲1側
に広がつている。空乏層の拡散電位φpは非ドープ
半導体の場合Eg/2eよりわずかに小さな値をと
る。金属乙2の標準単極電位が半導体結晶甲1に
比べてほぼEg/2eだけ大きいと仮定すれば、第
1図aのように甲1、乙2が同時に皮膚面4に圧
接した場合、第1図cのようなエネルギーバンド
ダイヤグラムが得られる。すなわち、電池作用が
発動するため、金属乙2の正電極効果によつて甲
1と乙2の界面に形成された拡散電位φpが偏倚さ
れて電位障壁が消失する。この結果、半導体結晶
甲1の伝導帯にある自由電子がこれよりエネルギ
ー的に低い(安定な)位置にある金属乙2の伝導
帯へ流れ込む。生体皮膚面4の抵抗は乙2よりか
なり高いので電池電界印加による皮膚面4のバン
ド傾斜は乙2よりかなりゆるやかになる。一方、
半導体結晶甲1と皮膚面4との界面ではシヨツト
キー障壁が残っており、電池電界印加によつて皮
膚面4の伝導帯は傾斜してもこの電位障壁に妨げ
られて皮膚面4から電子が半導体結晶甲1へ流れ
込むことはない。ところで金属とは異なり半導体
内では、キヤリア(電荷担体)は自由電子と自由
正孔の2種類があり、自由電子密度n、自由正孔
密度p、陽イオン密度N+ D、陰イオン密度N- Aの間
に電気的中立の条件
n+N- A=p+N+ D …(1)
が成立している。また熱平衡状態にある半導体結
晶中では、
n・p=一定 …(2)
の関係がある。第1図cのような場合、半導体結
晶甲1のバルク領域には外部電界がほとんど作用
しないので(空乏層領域に電界が集中する)ほぼ
熱平衡状態とみなしうる。n型半導体の場合は、
少数キヤリア(自由正孔)密度pは保存されてお
り、したがつて第1図cのように流出によつてn
が減少すると、式(1),(2)を同時に満足するには減
少分だけ自由電子を半導体中で発生させて補給し
なければならない。この結果半導体甲のバルク領
域で発生した自由電子に見合うだけの自由正孔が
発生する。自由正孔は半導体結晶のどの部分で発
生してもドリフトして電気的に安定な皮膚面4と
の界面領域に移る。正孔(すなわち価電子のぬけ
がら)をもつ原子はすなわち陽イオンであつて化
学的に不安定な状態にあるから、2と4の界面領
域では生体皮膚の電解作用によつて結晶甲1より
溶出し、生体内に浸透拡散する。こようなプロセ
スで次々に半導体イオンの電離浸透が生ずる。
甲1と乙2との標準単極電位差がEg/2eボル
トよりもつと大きければ、甲1と乙2の界面付近
では、甲1のバンドが第1図bとは逆方向に傾斜
するため、第1図cの場合よりもつと速やかに自
由電子が乙2へ流入し、甲1の生体皮膚面4との
界面における電離溶解がより速やかに進行する。
逆に甲1と乙2の標準単極電位差がEg/2eより
かなり小さければ、甲1と乙2の界面に形成され
たシヨツトキー障壁は乙2の正電極効果で消滅さ
せることができず、甲1の自由電子はこの電位障
壁に妨げられて乙2へ流入することはできない。
したがつてこの場合は、第1図aのように皮膚面
4へ装着しても半導体イオンの発生と生体内浸透
は起きない。固体中の自由電子は周囲の結晶格子
から熱エネルギーを供給されるので、ほぼ3KT
程度の運動エネルギーを有している。そこで、室
温では0.1V程度の電位障壁はとびこえうる。甲
1と乙2との標準単極電位差がEg/2eより0.1V
程度小さい範囲であれば、効果は弱いが半導体イ
オンの発生と生体内浸透は可能である。
さて、金属乙2と電気的に接合する半導体結晶
甲1の導電型がp型である場合、第1図bに相当
する熱平衡状態のエネルギーバンドダイヤグラム
は第2図aのようになる。この場合、半導体結晶
甲1の多数キヤリアは自由正孔であり、甲1と乙
2および甲1と生体皮膚面4との界面に形成され
るシヨツトキー障壁によつて、甲1の充満帯内に
閉じ込められている。第1図aのようにして生体
皮膚面4に圧着した時、電池作用が発揮されてバ
ンドは傾斜するが、甲1と乙2の界面のシヨツト
キー障壁は逆偏倚となるので障壁の高さが更に高
まり、甲1と皮膚面4との界面の障壁は順偏倚さ
れて低くなる。しかし、一般に金属より生体皮膚
面の抵抗ははるかに大きいため、甲1と皮膚面4
との界面障壁の拡散電位φp′は甲1と乙2との界
面障壁拡散電位φpより高い。したがつて、電池作
用によつて甲1の少数キヤリア(自由電子)が乙
2の伝導帯に流れ込んだ時式(1),(2)を成立させる
ため少数キヤリアの発生とこれに対応した自由正
孔の増加を生ずるが、過剰の自由正孔が甲1から
生体皮膚面4へ流出する際、前記n型半導体の場
合より流れが悪くなる。すなわち、乙2の標準単
極電位が甲1よりEg/2eボルトだけ高くても甲
1と皮膚面4の境界にはシヨツトキー障壁が残
る。このような理由で、p型半導体を甲1として
用いた場合、n型半導体を用いた場合より半導体
イオンの発生が弱くなるという欠点がある。
以上第1,2図aを用いて本考案の半導体イオ
ン浸透具を説明したが、n型、p型それぞれの半
導体はいずれも単結晶を前提としていた。金属乙
2と接合を成す半導体甲1が多結晶である場合、
状況はかなり複雑になる。たとえば、非ドープn
型半導体1と金属2との接合の場合、仮に非ドー
プn型半導体1が3つの粒界をもつ多結晶とする
と、第1図bに相当する熱平衡状態は第2図bの
如くなる。粒界では1と2および1と4との界面
のように空乏層(小規模)が発生し、粒界面に高
密度の再結合中心が生成している。
今、甲1乙2を同時に皮膚面4に圧接した時、
第1図cに相当するエネルギーバンドダイヤグラ
ムは第2図cの如くなる。すなわち、甲1と乙2
との界面では甲1と2の標準単極電位差がEg/
2eの場合、第1図c同様甲1より乙2に多数キヤ
リア(自由電子)が流れ込む。しかし、第1図c
の場合とは異なり、粒界面の空乏層電位障壁も順
方向偏倚される結果高密度の再結合中心が活性化
され、粒界より右側の伝導帯自由電子は乙2との
境界に至る前に粒界面の再結合中心に吸い込ま
れ、少数キヤリア自由正孔と再結合して消滅して
しまう。再結合した自由電子−自由正孔のエネル
ギーは熱として放出される。再結合で消滅した自
由正孔(少数キヤリア)は式(1),(2)を満足させる
ため電離によつて補給されるが、電離して発生し
た自由正孔も大部分が再び粒界面での自由電子と
の再結合で消費されるため、甲1と生体皮膚面4
との界面に流れて半導体イオンの発生に使われる
自由正孔密度が低く、イオン源としての効率が低
下する。
乙2と接合する半導体結晶甲1がp型半導体の
場合も事情は全く同じである。粒界によるキヤリ
アの吸い込みは当然粒界密度が高い程甚しくなる
ため、たとえば、特開昭56−1160号で開示されて
いる如く甲1と乙2との接合を小粒子どうしから
成る焼結体で構成した場合などは、粒界間距離が
少数キヤリアの拡散距離(数ミクロン)程度とな
り、ほとんど半導体イオンが発生しなくなる。
したがつて、甲1の半導体はn型の場合もp型
の場合も単結晶であることがもつとも望ましく、
多結晶である場合は、粒界の大きさ(grain
size)が少数キヤリアの拡散距離に比べて充分大
きい(100ミクロン程度以上)であることが望ま
しいと云える。
以上の説明から明らかなように、本考案の半導
体イオン浸透具においてはイオン化の程度は半導
体の種類、導電型、結晶性と共に甲1と乙2の電
位差にも依存するので、甲1と乙2との間に甲1
を正、乙2を負に偏倚するような向きに直流外部
電源を接続するならば、その電圧によつて半導体
のイオン化および生体内への浸透が著しく加速さ
れることは充分首肯できる所である。
さて、以上には金属と半導体の接合素子の原理
を述べたが、甲1および乙2が共に金属である場
合(乙2の標準単極電位がより高い場合)どのよ
うな効果が期待できるであろうか。第1図aのよ
うな皮膚面4への装着によつてエネルギーバンド
ダイヤグラムは第3図のようになる。キヤリアは
実質上自由電子のみであり、異なる物質の界面で
伝導帯底(エネルギーEc)が連続しているため電
位障壁は存在しない。電子の発生源は甲1であ
り、電子流は甲1→乙2→皮膚面4→(生体内)
→皮膚面4→甲1の如く流れる。甲1で自由電子
が発生すると、原理的にはこれに見合つた金属イ
オンが発生するはずであるが、金属には室温でも
ともと高密度の自由電子が存在しており、また第
3図のように電位勾配によつて生体系から甲1へ
自由電子が補給されるため甲1の電離は惹越しに
くい状態にある。生体系の強い電解作用が働いて
甲1がイオン化溶解した場合に電離は促進される
が、この現象は生体皮膚表面では通常起きにくい
し、またイオン化傾向の比較的小さな金属では起
きにくい。したがつて、甲1、乙2が共に金属で
ある場合、第1図aの素子構成は電流源となるが
イオン源にはなりにくい。このようなイオン化傾
向の異なる2種類の金属の接合を利用した「治療
具」は既に公開されている(実開昭57−103743
号)。該治療具は第3図を用いて説明したように
生体に環状電流を流す目的で開発された。
これに対して本考案の「半導体イオン浸透具」
は、第1,2図で説明したように金属と半導体の
界面で発生するエネルギーバンドの不連続に原因
するシヨツトキー障壁(空乏層の拡散電位φp)の
効果と半導体の性質を利用し、半導体と金属との
適切な組合せを選択することによつて効率的に半
導体イオンを発生させ、生体系に浸透させて所期
の治療目的に資することができるのである。すな
わち、本考案の装置はイオン源として効果的に作
用するのである。
以下に本考案を実施例により説明する。
(実施例 1)
半導体結晶甲1として純度99.99%のアンドー
プn型ゲルマニウム単結晶を、また金属乙2とし
て貴金属を選び、第1図aのような構造の半導体
イオン浸透具を形成した。貴金属は耐蝕性にすぐ
れ、長期連用にたえる。甲1乙2共直径5mmの球
形状を有し、不活性ガス雰囲気で両球を圧接した
まま50°〜650℃の適当な温度に短時間加熱して圧
接点をわずかに溶着する。バンソウコウ3の粘着
面にこの連結球を貼布し、半熟成したトマトの実
に該半導体イオン浸透具を圧着貼布した。事前に
トマト表面をアルコール洗浄し、乾燥させて後貼
着を行なつた。120時間を経過して取りはずし、
被検体を枝から切りとつた後、貼着個所の直下領
域(深さ約1cm)を切り出してすりつぶし、物理
分析によつて含有Ge濃度を調べた。乙2として
金、銀、白金を用い、比較のために銅も用いた。
各場合につき3検体を用意し、得られた結果を平
均値で第1表に示す。
The present invention relates to a semiconductor ion penetration device that allows semiconductor ions to penetrate into the body of a living body through the skin surface. Living organisms are highly efficient heat engines made up of organic combinations of 20 to 30 different elements. Energy sources supplied from the outside are decomposed and purified within the body, eventually becoming organic substances with a relatively simple composition, which release thermal energy as a result of redox reactions. Living organisms take in this thermal energy and use it as a power source for each organ. If the organs responsible for the energy supply process of the biological system described above cease to function properly due to invasion by pathogenic bacteria or mechanical damage, the entire biological activity will be seriously affected. Therefore, living organisms have the ability to self-repair and restore organ function. Interferons and interleukins have recently attracted attention as substances that control autoimmunity, which detects the invasion of foreign antigens and activates the defense system (antibody reaction). Although these substances are produced by animals themselves, they are not always present in sufficient concentrations during times of war (when functional damage occurs), and their healing effects are often insufficient. As one measure to activate the autoimmune effect, in recent years, elements that do not originally exist in living tissues or exist only in very small amounts are artificially administered into living tissues, and the exclusion of these elements has been attempted. Attempts have been made to increase the proliferation of interferons and interleukins through physiologically induced processes, and these efforts are attracting attention. Elements that exhibit this effect include semiconductors such as germanium, silicon, and selenium. These semiconductors are usually inorganic;
Therefore, even if it is orally administered to the human body as it is, it is not absorbed into the tissues and is excreted, so it is often used after being converted into an organic form. However, there have been problems with organicization, such as increased manufacturing costs and high prices, and oral administration, which makes it difficult to locally administer high concentrations to affected areas. The semiconductor ion permeation device of the present invention has an extremely simple structure and combines the principles of biological batteries and semiconductor bonding to ionize and infiltrate semiconductor elements from outside the body to the necessary locations within the body tissue. This is an attempt to solve the above-mentioned problems. That is, a skin contact tool is attached to an element in which a semiconductor crystal that generates penetrating ions and a metal whose standard unipolar potential is approximately Eg/2e volt or more higher than that of the semiconductor are electrically bonded, and the skin contact tool is used to The device is used by being crimped onto the required location on the skin of the living body. Here, Eg is the energy corresponding to the forbidden band width of the semiconductor, and e is the amount of electron charge. From an electrical point of view, the biological skin surface is a type of conductive resistor, and as a result, a resistor junction (potential barrier) is created on both sides of the semiconductor crystal, and the semiconductor is ionized by the battery action and the action of this semiconductor junction. and in vivo osmotic diffusion. The principle of the present invention will be explained below using the drawings. FIG. 1a shows a state in which a semiconductor iontophoresis device (one example) according to an embodiment of the present invention is attached to a biological skin surface 4 (cross-sectional view). In the figure, the semiconductor ion penetration device is a semiconductor crystal (A) that generates ions to be penetrated.
1. Consists of a metal (B) electrically connected to the A, 2, and a leather fitting 3. In Fig. 1a, A 1 and Otsu 2 are in pressure contact with the skin surface 4 at the same time, but in order to explain the principle of the present invention using an energy band, first, only Otsu 2 is in contact with the biological skin surface 4. , consider the case where A1 is not in contact with 4. At this time, each substance (1, 2, 4) is considered to be in a state of thermal equilibrium, so the energy band diagram becomes as shown in FIG. 1b. Semiconductor crystal shell is non-doped
It was made into a single crystal with type conductivity. A so-called Schottky barrier is formed at the interface between the A1 and the A2 and the interface between the A1 and the biological skin surface 4, and a depletion layer spreads toward the A1 side. The diffusion potential φ p of the depletion layer takes a value slightly smaller than Eg/2e in the case of an undoped semiconductor. Assuming that the standard unipolar potential of the metal Otsu 2 is larger than that of the semiconductor crystal A 1 by approximately Eg/2e, when A 1 and Otsu 2 are pressed against the skin surface 4 at the same time as shown in Figure 1a, the An energy band diagram as shown in Figure 1c is obtained. That is, since the battery action is activated, the diffusion potential φ p formed at the interface between A 1 and Otsu 2 due to the positive electrode effect of metal Otsu 2 is biased, and the potential barrier disappears. As a result, free electrons in the conduction band of the semiconductor crystal A1 flow into the conduction band of the metal B2, which is located at a lower (stable) position in terms of energy. Since the resistance of the biological skin surface 4 is considerably higher than that of Otsu 2, the band inclination of the skin surface 4 due to the application of the battery electric field becomes considerably gentler than that of Otsu 2. on the other hand,
A Schottky barrier remains at the interface between the semiconductor crystal A1 and the skin surface 4, and even if the conduction band of the skin surface 4 is tilted due to the application of a battery electric field, this potential barrier prevents electrons from flowing from the skin surface 4 into the semiconductor. It does not flow into Crystal A1. By the way, unlike metals, there are two types of carriers (charge carriers) in semiconductors: free electrons and free holes. Free electron density n, free hole density p, cation density N + D , anion density N - The condition of electrical neutrality n+N - A = p+N + D ...(1) is established between A. In addition, in a semiconductor crystal in a state of thermal equilibrium, n.p = constant...(2). In the case as shown in FIG. 1c, since almost no external electric field acts on the bulk region of the semiconductor crystal A 1 (the electric field is concentrated in the depletion layer region), it can be considered to be in almost a thermal equilibrium state. In the case of n-type semiconductor,
The minority carrier (free hole) density p is conserved, so as shown in Figure 1c, n
When , decreases, in order to simultaneously satisfy equations (1) and (2), free electrons must be generated in the semiconductor to compensate for the decrease. As a result, free holes corresponding to the free electrons generated in the bulk region of the semiconductor shell are generated. No matter where free holes are generated in the semiconductor crystal, they drift and move to the electrically stable interface region with the skin surface 4. Atoms with holes (i.e., valence electron shells) are cations and are in a chemically unstable state, so in the interface area between 2 and 4, the electrolytic action of the skin of the living body causes it to move away from crystal A1. It elutes and permeates and diffuses into the living body. In this process, ionization and penetration of semiconductor ions occur one after another. If the standard monopolar potential difference between A1 and Otsu2 is greater than Eg/2e volts, the band of A1 will tilt in the opposite direction to that in Figure 1b near the interface between A1 and Otsu2, so Free electrons flow into A2 2 more quickly than in the case of FIG.
Conversely, if the standard monopolar potential difference between A1 and Otsu2 is much smaller than Eg/2e, the Schottky barrier formed at the interface between A1 and Otsu2 cannot be eliminated by the positive electrode effect of Otsu2, and A The free electrons of 1 cannot flow into 2 because they are blocked by this potential barrier.
Therefore, in this case, even if it is attached to the skin surface 4 as shown in FIG. Free electrons in a solid are supplied with thermal energy from the surrounding crystal lattice, so approximately 3KT
It has a certain amount of kinetic energy. Therefore, the potential barrier of about 0.1V at room temperature can be extremely high. The standard single-pole potential difference between A1 and Otsu2 is 0.1V from Eg/2e.
In a small range, semiconductor ions can be generated and penetrated into the body, although the effect is weak. Now, when the conductivity type of the semiconductor crystal A 1 electrically connected to the metal A 2 is p-type, the energy band diagram in the thermal equilibrium state corresponding to FIG. 1b is as shown in FIG. 2a. In this case, the majority carriers in semiconductor crystal A1 are free holes, and the Schottky barrier formed at the interfaces between A1 and A1 and the interface between A1 and the biological skin surface 4 allows the carriers to be absorbed into the filled zone of A1. Trapped. When it is pressed against the biological skin surface 4 as shown in Figure 1a, the battery action is exerted and the band tilts, but the Schottky barrier at the interface between A1 and Otsu2 is biased in the opposite direction, so the height of the barrier is reduced. The barrier at the interface between the upper 1 and the skin surface 4 is further biased and lowered. However, in general, the resistance of the body's skin surface is much greater than that of metal, so instep 1 and skin surface 4
The diffusion potential φ p ′ of the interface barrier between A1 and B2 is higher than the diffusion potential φ p of the interface barrier between A1 and Otsu2. Therefore, when the minority carriers (free electrons) of A1 flow into the conduction band of B2 due to battery action, in order to establish equations (1) and (2), the generation of minority carriers and the corresponding freedom are determined. Although the number of holes increases, when the excess free holes flow from the shell 1 to the biological skin surface 4, the flow becomes worse than in the case of the n-type semiconductor. In other words, even if the standard unipolar potential of Otsu 2 is higher than that of Otsu 1 by Eg/2e volts, a Schottky barrier remains at the boundary between Otsu 1 and the skin surface 4. For this reason, when a p-type semiconductor is used as A1, there is a drawback that the generation of semiconductor ions is weaker than when an n-type semiconductor is used. Although the semiconductor ion penetration device of the present invention has been described above using FIGS. 1 and 2a, it is assumed that each of the n-type and p-type semiconductors is a single crystal. When semiconductor A 1 that forms a bond with metal Otsu 2 is polycrystalline,
The situation becomes quite complicated. For example, undoped n
In the case of a junction between a type semiconductor 1 and a metal 2, if the undoped n-type semiconductor 1 is a polycrystal with three grain boundaries, the thermal equilibrium state corresponding to FIG. 1b will be as shown in FIG. 2b. Depletion layers (small scale) are generated at the grain boundaries, such as at the interfaces between 1 and 2 and between 1 and 4, and high-density recombination centers are generated at the grain boundaries. Now, when A1 and Otsu2 are pressed against the skin surface 4 at the same time,
The energy band diagram corresponding to FIG. 1c is as shown in FIG. 2c. In other words, A1 and Otsu2
At the interface, the standard monopolar potential difference between A1 and A2 is Eg/
In the case of 2e, a large number of carriers (free electrons) flow from A1 to B2 as in Figure 1c. However, Fig. 1c
Unlike in the case of It is sucked into the recombination center at the grain interface, recombines with minority carrier free holes, and disappears. The energy of the recombined free electrons and free holes is released as heat. Free holes (minority carriers) annihilated by recombination are replenished by ionization to satisfy equations (1) and (2), but most of the free holes generated by ionization are returned to the grain interface. Because it is consumed by recombination with free electrons, instep 1 and biological skin surface 4
The density of free holes that flow to the interface with the semiconductor and are used to generate semiconductor ions is low, reducing its efficiency as an ion source. The situation is exactly the same when the semiconductor crystal A1 to be bonded to the A2 is a p-type semiconductor. Naturally, the suction of carriers by grain boundaries becomes more severe as the grain boundary density increases. In the case of a semiconductor ion structure, the distance between grain boundaries is approximately the diffusion distance of minority carriers (several microns), and almost no semiconductor ions are generated. Therefore, it is desirable that the semiconductor of A1 is a single crystal in both n-type and p-type cases.
If it is polycrystalline, the grain boundary size (grain
It can be said that it is desirable that the size) is sufficiently large (approximately 100 microns or more) compared to the diffusion distance of the minority carriers. As is clear from the above explanation, in the semiconductor iontophoresis device of the present invention, the degree of ionization depends on the type, conductivity type, and crystallinity of the semiconductor as well as the potential difference between A1 and Otsu2. Between the
If an external DC power source is connected in a direction that biases Otsu2 to positive and Otsu2 to negative, it can be fully agreed that the ionization of the semiconductor and its penetration into the living body will be significantly accelerated by that voltage. . Now, the principle of a metal-semiconductor junction element has been described above, but what kind of effect can be expected if A1 and Otsu2 are both metals (if the standard unipolar potential of Otsu2 is higher)? I wonder if there is. By attaching it to the skin surface 4 as shown in FIG. 1a, the energy band diagram becomes as shown in FIG. 3. The carriers are essentially only free electrons, and there is no potential barrier because the bottom of the conduction band (energy E c ) is continuous at the interface of different materials. The source of electrons is A1, and the electron flow is A1 → Otsu2 → skin surface 4 → (in the living body)
→ Skin surface 4 → Flows like instep 1. When free electrons are generated in A1, in principle metal ions corresponding to the generation should be generated, but metals inherently have a high density of free electrons at room temperature, and as shown in Figure 3. Since free electrons are supplied from the biological system to A1 by the potential gradient, ionization of A1 is difficult to attract. Ionization is promoted when A1 is ionized and dissolved by the strong electrolytic action of biological systems, but this phenomenon usually does not occur on the surface of living skin, and also does not occur with metals that have a relatively small tendency to ionize. Therefore, if both A1 and B2 are metal, the element configuration shown in FIG. A "therapeutic device" that utilizes the bonding of two types of metals with different ionization tendencies has already been published (Utility Model Publication No. 57-103743).
issue). As explained using FIG. 3, this therapeutic device was developed for the purpose of passing a circular current through a living body. In contrast, the "semiconductor ion penetration device" of this invention
As explained in Figures 1 and 2, the semiconductor By selecting an appropriate combination of ions and metals, semiconductor ions can be efficiently generated and penetrated into biological systems to serve the intended therapeutic purpose. That is, the device of the present invention effectively acts as an ion source. The present invention will be explained below using examples. (Example 1) An undoped n-type germanium single crystal with a purity of 99.99% was selected as the semiconductor crystal A1, and a noble metal was selected as the metal B2 to form a semiconductor ion penetration tool having the structure as shown in FIG. 1a. Precious metals have excellent corrosion resistance and can be used for long periods of time. Both A1 and B2 have a spherical shape with a diameter of 5 mm, and while both spheres are pressed together in an inert gas atmosphere, the pressure contact points are slightly welded by heating to an appropriate temperature of 50° to 650°C for a short time. This connecting ball was applied to the adhesive surface of Bansouko 3, and the semiconductor ion permeation device was applied by pressure to a semi-ripened tomato fruit. The surface of the tomato was washed in advance with alcohol, dried, and then pasted. Removed after 120 hours,
After cutting the specimen from the branch, the area directly below the attachment point (approximately 1 cm deep) was cut out and ground, and the concentration of Ge contained was examined by physical analysis. Gold, silver, and platinum were used as Otsu 2, and copper was also used for comparison.
Three samples were prepared for each case, and the results obtained are shown in Table 1 as an average value.
【表】
半導体イオン浸透具を貼着しなかつた検体に含
有されているGe濃度は検出限界(1ppm)程度で
あつたので、第1表の結果は、明らかに浸透具貼
布の効果を示していると考えられる。
半導体Geの定理における禁制帯幅は0.66(eV)
である。また乙2と甲(Ge)1との標準単極電
位差は、Agの場合1.4ボルト、Ptの場合約1.0ボル
ト、Auの場合0.8ボルト、Cuの場合約0.2ボルト
であり、Eg/2e0.33(V)と比較して、貴金属
陽極の場合は充分大きい。しかし、銅陽極の場合
はEg/2eより0.1ボルト以上小さくGeのイオン化
がおきにくいことがわかる。一方、甲1としてイ
ンジウムを1017atoms/cm3ドープしたp型Ge単結
晶を用い、乙2としてAuを用いて上記と同じ半
導体イオン浸透具を構成した。これを前記同様ト
マトの実に貼布して120時間浸透実験を行ない。
含有Ge濃度を分析すると、300〜500ppmであり、
n型Ge陰極の場合の半分以下であることがわか
つた。
さて、第1表でもつとも効果のあつた乙2の
Agを陽極金属とし、甲1Geとの電気的接合を小
粒子の焼結体で構成した。すなわち、非ドープn
型Ge単結晶を粉砕してほぼ7〜10μmサイズの小
粒子とし、ほぼ同粒径のAg粉末と1対1のモル
比で混合し、直径10mm、厚さ2mmの円板形状にプ
レスして不活性ガス雰囲気で500℃に短時間加熱
することによりAg−Ge接合を高密度に含む焼結
体を得た。更に同様な手段でGe粉末を95モル%、
Ag粉末を5モル%の割合で混合した焼結体を得
た。これらをバンソウコウ4により、トマトの実
表面に圧着し、120時間経過後のGeイオン浸透状
況を調べた。前記同様の方法で物理分析すると、
トマトの含有Ge濃度はGe:Ag=1:1のサンプ
ルの場合10〜50ppm、Ge:Ag=95:5の場合5
〜10ppmであることがわかつた。第1表の単結晶
Geを用いた場合に比べるとイオン浸透効果は2
〜3桁も低下していることがわかる。この結果
は、半導体結晶甲1と金属乙2との接合界面面積
を半導体バルク体積で割つた値(接合比表面積)
が単結晶Geを用いた場合に比べてきわめて高い
場合(Ge:Ag=1:1の場合)も、Geの粒界密
度が高く粒界サイズが少数キヤリア拡散距離程度
である場合(Ge:Ae=95:5の場合)も共に第
2図b,cで説明した界面再結合中心の影響で半
導体のイオン化が妨げられ、本考案の目的である
イオン源には不敵であることを示している。
(実施例 2)
平均粒界サイズが約2mmのアンドープn型セレ
ン化銅(Cu2Se)1多結晶を直径5mm、高さ5mm
の円筒状ペレツトに加工し、全面に厚み約3μmの
金2をメツキした後、片側底面のみを研磨し、被
研磨底面に粘着テープ3を貼布して半導体イオン
浸透具を第4図の如く形成し生体4に接着させ
た。ヌードマウスの右下肢外側をアルコールで清
浄にした後、該浸透具を取りつけて浸透実験を行
なつた。120時間経過後、該浸透具を取りはずし、
直下領域の下肢肉(深さ5mm)を切りとりすりつ
ぶして含有セレン濃度を物理分析で調べた。比較
のために形状・寸法は同じで、1として亜鉛、2
として金を用いた装置を作り、別のヌードマウス
検体右下肢外側に粘着して亜鉛の浸透を試みた。
120時間経過後の含有濃度は、Seが500〜
800ppm、Znが5〜10ppmであつた。装置を粘着
しないヌードマウスの含有Se濃度、Zn濃度は
1ppm程度であつたので装置粘着によるイオン浸
透効果は両者で認められるが、金属接合素子にお
けるイオン浸透効果に比べて本考案の金属−半導
体接合素子では2桁も高い効果が認められる。
Au2とCu2Se1の標準単極電位差は、Cu2Se1の
空乏層拡散電位より充分大きく、Cu2Se1のイオ
ン化が促進されたためと考えられる。
一方、上記のアンドープn型セレン化銅多結晶
1および金2をそれぞれ直径5mm、厚さ1mmの円
板状に加工し、両者を第5図のように銅線で連結
し、その間に可変抵抗と電池を接続し、セレン化
銅1側が正、金2側が負になるように偏倚した。
上記同様ヌードマウス右下肢皮膚面4に、この素
子をバンソウコウ3で電極間隔2mmとして貼着
し、約1mAの直流電流が流れるように可変抵抗
を調節した。貼着後4時間してこの装置をとりは
ずし、貼布面直下領域(深さ5mm)の肉片を採取
して含有Se濃度を調べると100〜200ppmに達し
ており、電池付勢によつてSeの浸透効果が著し
く高まつていることがわかつた。
以上実施例を用いて詳しく述べたように、本考
案の半導体イオン浸透具は従来から公知の金属陰
陽極を用いた電流発生型電池とは異なり、半導体
陰極とこれより標準単極電位がほぼEg/2e以上
高い金属陽極との組合せを用い、金属−半導体、
或いは半導体−生体皮膚界面に惹起する電位障壁
を電池起電力によつて巧みに制御して半導体イオ
ンを発生せしめ、生体系に拡散浸透させる機能を
有する。被浸透イオンを発生する半導体陰極はp
型半導体よりもn型半導体(できればイオン化し
やすいドナーを多量含まないタイプ)が望まし
い。また金属陽極は、標準単極電位の大きさと耐
蝕性の観点から貴金属が望ましい。更に半導体結
晶は単結晶か粒界サイズの大きな多結晶が望まし
く、小粒子の焼結体(比表面積の大きな多結晶)
は避けるべきである。
本考案の半導体イオン浸透具によつて生体に有
用な半導体イオンが生体系外から必要個所に選択
的かつ継続して供給することが容易にできるよう
になつた。[Table] Since the Ge concentration contained in the sample to which the semiconductor ion penetration device was not attached was around the detection limit (1 ppm), the results in Table 1 clearly show the effect of the penetration device being applied. It is thought that The forbidden band width in the semiconductor Ge theorem is 0.66 (eV)
It is. In addition, the standard single-pole potential difference between Otsu 2 and A (Ge) 1 is 1.4 volts for Ag, approximately 1.0 volts for Pt, 0.8 volts for Au, and approximately 0.2 volts for Cu, and Eg/2e0.33 (V) In the case of a noble metal anode, it is sufficiently large. However, in the case of a copper anode, it is found that Ge ionization is difficult to occur because it is more than 0.1 volt lower than Eg/2e. On the other hand, the same semiconductor ion penetration device as above was constructed using a p-type Ge single crystal doped with 10 17 atoms/cm 3 of indium as A1 and Au as A2. This was applied to tomato seeds as described above, and a penetration experiment was conducted for 120 hours.
Analysis of the contained Ge concentration shows that it is 300 to 500 ppm,
It was found that this was less than half that of the n-type Ge cathode. Now, in Table 1, Otsu 2, which was also very effective,
Ag was used as the anode metal, and the electrical connection with A1 Ge was made of a sintered body of small particles. That is, undoped n
The type Ge single crystal is crushed into small particles with a size of approximately 7 to 10 μm, mixed with Ag powder of approximately the same particle size at a 1:1 molar ratio, and pressed into a disk shape with a diameter of 10 mm and a thickness of 2 mm. A sintered body containing a high density of Ag-Ge bonds was obtained by heating to 500°C in an inert gas atmosphere for a short time. Furthermore, 95 mol% of Ge powder was added using the same method.
A sintered body was obtained in which Ag powder was mixed at a ratio of 5 mol %. These were pressed onto the surface of the tomato fruit using Bansoukou 4, and the state of Ge ion penetration was examined after 120 hours had elapsed. When physically analyzed using the same method as above,
The concentration of Ge contained in tomatoes is 10 to 50 ppm in the case of Ge:Ag=1:1 sample, and 5 in the case of Ge:Ag=95:5.
It was found to be ~10ppm. Single crystals in Table 1
Compared to the case using Ge, the ion penetration effect is 2
It can be seen that it has decreased by ~3 orders of magnitude. This result is the value obtained by dividing the bonding interface area between semiconductor crystal A1 and metal B2 by the semiconductor bulk volume (junction specific surface area).
is extremely high compared to the case using single-crystal Ge (Ge:Ag=1:1), and when the Ge grain boundary density is high and the grain boundary size is about the minority carrier diffusion distance (Ge:Ae = 95:5), the ionization of the semiconductor is hindered by the influence of the interfacial recombination centers explained in Figure 2 b and c, indicating that the ion source, which is the purpose of this invention, is invincible. There is. (Example 2) An undoped n-type copper selenide (Cu 2 Se) 1 polycrystal with an average grain boundary size of about 2 mm is 5 mm in diameter and 5 mm in height.
After processing the pellet into a cylindrical pellet, plating the entire surface with gold 2 with a thickness of about 3 μm, polishing only the bottom surface of one side, pasting adhesive tape 3 on the bottom surface to be polished, and attaching a semiconductor ion penetration tool as shown in Figure 4. It was formed and adhered to the living body 4. After cleaning the outside of the right lower limb of a nude mouse with alcohol, the penetrant was attached to it and a penetration experiment was conducted. After 120 hours, remove the penetration tool,
The lower leg meat (5 mm in depth) was cut out and ground directly below, and the selenium concentration was examined by physical analysis. For comparison, the shape and dimensions are the same, 1 is zinc, 2 is
They created a device using gold and attached it to the outside of the right lower limb of another nude mouse specimen in an attempt to infiltrate zinc.
After 120 hours, the concentration of Se is 500~
800 ppm, and Zn was 5 to 10 ppm. The Se concentration and Zn concentration of nude mice that do not stick to the device are
Since it was about 1 ppm, the ion penetration effect due to device adhesion was observed in both cases, but compared to the ion penetration effect in the metal bonding element, the metal-semiconductor bonding element of the present invention has an effect that is two orders of magnitude higher.
This is considered to be because the standard unipolar potential difference between Au2 and Cu 2 Se1 was sufficiently larger than the depletion layer diffusion potential of Cu 2 Se1, and the ionization of Cu 2 Se1 was promoted. On the other hand, the above undoped n-type copper selenide polycrystal 1 and gold 2 are each processed into a disk shape with a diameter of 5 mm and a thickness of 1 mm, and both are connected with a copper wire as shown in Fig. 5, and a variable resistor is connected between them. The battery was connected to the battery, and biased so that the copper selenide 1 side was positive and the gold 2 side was negative.
Similar to the above, this device was attached to the skin surface 4 of the right lower limb of a nude mouse using a band 3 with an electrode spacing of 2 mm, and the variable resistance was adjusted so that a direct current of about 1 mA would flow. 4 hours after application, this device was removed, a piece of flesh was taken from the area directly below the application surface (depth 5 mm), and the concentration of Se was found to be 100 to 200 ppm. It was found that the penetration effect was significantly enhanced. As described in detail using the examples above, the semiconductor ion penetration device of the present invention differs from conventionally known current generating batteries using metal cathodes and anodes; Metal-semiconductor,
Alternatively, it has the function of generating semiconductor ions by skillfully controlling the potential barrier caused at the semiconductor-living skin interface using battery electromotive force, and causing them to diffuse and permeate into the living system. The semiconductor cathode that generates penetrating ions is p
An n-type semiconductor (preferably a type that does not contain a large amount of easily ionized donors) is preferable to a type semiconductor. Further, the metal anode is preferably a noble metal from the viewpoint of standard single electrode potential and corrosion resistance. Furthermore, the semiconductor crystal is preferably a single crystal or a polycrystal with a large grain boundary size, and a sintered body with small particles (a polycrystal with a large specific surface area).
should be avoided. By means of the semiconductor iontophoresis device of the present invention, semiconductor ions useful to the living body can be easily and selectively and continuously supplied to necessary locations from outside the living body.
第1〜3図は本考案の実施例図及び原理を説明
するための図、第4,5図は本考案のそれぞれ別
の実施例を示す図である。
図において、1……半導体結晶、2……金属陽
極、3……皮接具、4……生体皮膚面。
1 to 3 are diagrams showing embodiments of the present invention and diagrams for explaining the principle, and FIGS. 4 and 5 are diagrams showing different embodiments of the present invention. In the figure, 1... semiconductor crystal, 2... metal anode, 3... skin fitting, 4... biological skin surface.
Claims (1)
上の半導体結晶(以下甲と称する)と、標準単
極電位が甲よりもほぼEg/2e(ただしEgは甲の
禁制帯幅でありeは電子電荷量)以上高い金属
(以下乙と称する)とを電気的に接合して成る
素子と、該素子を貼布し甲乙を同時に皮接する
ための皮接具とより成る半導体イオン浸透具。 2 実用新案登録請求の範囲第1項記載の甲と乙
との間に、甲が正、乙が負になる向きに偏倚さ
れるよう外部直流電源を接続した半導体イオン
浸透具。[Scope of claim for utility model registration] 1. Semiconductor crystal with a grain boundary size of 100 μm or more that generates penetrating ions (hereinafter referred to as A), and a standard monopolar potential of approximately Eg/2e than A (however, Eg is prohibited in A). It consists of an element made by electrically bonding a metal (hereinafter referred to as ``B'') that has a higher band width than the electronic charge amount (e is the amount of electronic charge), and a skin bonding tool for pasting the element and simultaneously contacting ``A'' and ``B'' with the skin. Semiconductor ion penetration device. 2. A semiconductor iontophoresis device in which an external DC power source is connected between Party A and Party B described in Paragraph 1 of Claims for Utility Model Registration so that Party A is biased in a positive direction and Party B is biased in a negative direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6107285U JPH0350927Y2 (en) | 1985-04-25 | 1985-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6107285U JPH0350927Y2 (en) | 1985-04-25 | 1985-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177657U JPS61177657U (en) | 1986-11-06 |
| JPH0350927Y2 true JPH0350927Y2 (en) | 1991-10-30 |
Family
ID=30589009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6107285U Expired JPH0350927Y2 (en) | 1985-04-25 | 1985-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350927Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3566346B2 (en) * | 1994-09-14 | 2004-09-15 | 株式会社ポリトロニクス | Transdermal drug delivery device |
-
1985
- 1985-04-25 JP JP6107285U patent/JPH0350927Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177657U (en) | 1986-11-06 |
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