JPH0351900Y2 - - Google Patents
Info
- Publication number
- JPH0351900Y2 JPH0351900Y2 JP1984138916U JP13891684U JPH0351900Y2 JP H0351900 Y2 JPH0351900 Y2 JP H0351900Y2 JP 1984138916 U JP1984138916 U JP 1984138916U JP 13891684 U JP13891684 U JP 13891684U JP H0351900 Y2 JPH0351900 Y2 JP H0351900Y2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- board
- connector
- gold
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
この考案は、バイアス印加用コネクタと基板上
に形成された導体パターン間を、金ワイヤあるい
は金リボンで接続したマイクロ波集積回路に関す
るものである。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a microwave integrated circuit in which a bias application connector and a conductor pattern formed on a substrate are connected by a gold wire or a gold ribbon.
従来、この種のマイクロ波集積回路として第１
図に示すものがあつた。図において、１はマイク
ロ波基板、２はこの基板１に形成された金メツキ
された導体パターン、３はマイクロ波トランジス
タ、４は上記基板１を筐体５に実装，固定するた
めのキヤリア、５は筐体、６はRF信号入出力用
の同軸コネクタ、７は上記マイクロ波トランジス
タ３にバイアスを印加するための多極コネクタ、
８はこの多極コネクタ７と上記導体パターンとを
接続するリード線である。
Conventionally, this was the first microwave integrated circuit of this type.
I got what is shown in the figure. In the figure, 1 is a microwave board, 2 is a gold-plated conductor pattern formed on this board 1, 3 is a microwave transistor, 4 is a carrier for mounting and fixing the board 1 to a housing 5, and 5 is a housing, 6 is a coaxial connector for RF signal input/output, 7 is a multi-pole connector for applying bias to the microwave transistor 3,
8 is a lead wire that connects this multipolar connector 7 and the above-mentioned conductor pattern.
次に組立方法について説明する。組立手順は、
先ずマイクロ波基板１にパターン印刷によつて導
体２を形成し、穴明けおよび外形加工後、キヤリ
ア４に半田付け等により接合する。次いで、マイ
クロ波トランジスタ３を半田付け等で接合した
後、筐体６に実装，固定する。この後、同軸コネ
クタ６および多極コネクタ７を筐体５に取付け、
ねじ止めする。最後に、多極コネクタ７の端子と
導体パターン２とをリード線８を用いて半田付け
により接続する。 Next, the assembly method will be explained. The assembly procedure is
First, the conductor 2 is formed on the microwave board 1 by pattern printing, and after drilling and contour processing, it is joined to the carrier 4 by soldering or the like. Next, after the microwave transistor 3 is joined by soldering or the like, it is mounted and fixed in the casing 6. After that, attach the coaxial connector 6 and the multi-pole connector 7 to the housing 5,
Fasten with screws. Finally, the terminals of the multipolar connector 7 and the conductive pattern 2 are connected by soldering using the lead wires 8.
従来のマイクロ波集積回路は以上のような手順
で組立てられる。ここで、多極コネクタ７と導体
パターン２とをリード線８を用いて半田付けする
接続構造は、リード線の被覆剥しや半田フラツク
スの除去等が必要であるので、作業性が悪く、し
かもリード線の曲げ硬さ等により一定以上のスペ
ースを要するため小型化の妨げとなる等の欠点が
あつた。特に複数の端子部を有する多極コネクタ
に接続する際には、作業性が低下するという問題
点があつた。 Conventional microwave integrated circuits are assembled using the steps described above. Here, the connection structure in which the multi-pole connector 7 and the conductor pattern 2 are soldered using the lead wires 8 requires stripping the lead wires and removing the solder flux, so the workability is poor, and the This has disadvantages, such as requiring a certain amount of space due to the bending hardness of the wire, which hinders miniaturization. Particularly when connecting to a multipolar connector having a plurality of terminal sections, there is a problem in that workability is reduced.
この考案は上記のような従来のものの欠点を除
去するためになされたもので、複数の端子部を有
する多極コネクタとマイクロ波基板とをリード線
の代りに金ワイヤあるいは金リボンを使用し熱圧
着等で接合することにより、小型で作業性の良い
マイクロ波集積回路を提供することを目的として
いる。
This idea was made to eliminate the drawbacks of the conventional connectors mentioned above, and it uses gold wire or gold ribbon instead of lead wires to connect a multi-pin connector with multiple terminals and a microwave board. The purpose is to provide a microwave integrated circuit that is small and easy to work with by joining by crimping or the like.
以下、この考案の一実施例を図について説明す
る。第２図において、第１図と同符号のものは同
一又は相当部分を示す。
An embodiment of this invention will be described below with reference to the drawings. In FIG. 2, the same reference numerals as in FIG. 1 indicate the same or corresponding parts.
８は金ワイヤである。 8 is a gold wire.
次に組立手順について説明する。組立手順は従
来のものと同じであるが、バイアス印加用の多極
コネクタ７と導体パターン２との接続は、金ワイ
ヤ８と多極コネクタ７の金メツキされた端子部お
よび導体パターン２に熱圧着等の方法によつて接
合する。 Next, the assembly procedure will be explained. The assembly procedure is the same as the conventional one, but the connection between the multi-pole connector 7 for bias application and the conductor pattern 2 is performed by applying heat to the gold wire 8, the gold-plated terminals of the multi-pole connector 7, and the conductor pattern 2. Join by crimping or other methods.
なお、上記実施例では、多極コネクタと導体パ
ターンとを金ワイヤによつて接続した場合につい
て説明したが、金リボンでもよく、上記実施例と
同様の効果を奏する。 In the above embodiment, a case has been described in which the multipolar connector and the conductor pattern are connected by a gold wire, but a gold ribbon may also be used, and the same effects as in the above embodiment can be obtained.
以上のように、この考案によれば、金ワイヤあ
るいは金リボンを用い、バイアス印加用の多極コ
ネクタと該導体パターンとを熱圧着等により複数
の端子部を有する多極コネクタとマイクロ波基板
とを接続するようにしたので、作業性が向上し、
コスト低減，小型，軽量化が図れる効果がある。
As described above, according to this invention, a multi-pole connector for bias application and the conductor pattern are bonded to a multi-pole connector having a plurality of terminal portions and a microwave board by thermocompression bonding or the like using gold wire or gold ribbon. Since it is now connected, work efficiency has improved,
This has the effect of reducing cost, size, and weight.
第図は従来のマイクロ波集積回路の外観図、
第２図はこの考案の一実施例によるマイクロ波集
積回路の外観図である。
１……基板、２……導体パターン、３……マイ
クロ波トランジスタ、４……キヤリア、５……筐
体、６……同軸コネクタ、７……多極コネクタ、
８……金ワイヤ。なお、図中、同一符号は同一、
又は相当部分を示す。
The figure shows an external view of a conventional microwave integrated circuit.
FIG. 2 is an external view of a microwave integrated circuit according to an embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Conductor pattern, 3... Microwave transistor, 4... Carrier, 5... Housing, 6... Coaxial connector, 7... Multi-pole connector,
8...Gold wire. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
マイクロ波集積回路において、複数の端子部を有
する外部多極コネクタを介して上記基板に内部接
続される基板引出しリードを金ワイヤあるいは金
リボンで形成したことを特徴とするマイクロ波集
積回路。 In a microwave integrated circuit that incorporates a microwave board on which electronic components are mounted, a board lead that is internally connected to the board via an external multi-pole connector having a plurality of terminals is formed of gold wire or gold ribbon. A microwave integrated circuit featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984138916U JPH0351900Y2 (en) | 1984-09-13 | 1984-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984138916U JPH0351900Y2 (en) | 1984-09-13 | 1984-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153935U JPS6153935U (en) | 1986-04-11 |
| JPH0351900Y2 true JPH0351900Y2 (en) | 1991-11-08 |
Family
ID=30697307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984138916U Expired JPH0351900Y2 (en) | 1984-09-13 | 1984-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351900Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH052180Y2 (en) * | 1987-08-13 | 1993-01-20 |
-
1984
- 1984-09-13 JP JP1984138916U patent/JPH0351900Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153935U (en) | 1986-04-11 |
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