JPH0352008Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an improvement of a package that houses microwave devices such as amplifiers, mixers, and oscillators.

[Prior Art] Fig. 4 is an exploded perspective view showing a conventional package for a microwave device disclosed in, for example, Japanese Patent Publication No. 60-43022. In the figure, 1 is a metal carrier plate, 2 is a A first dielectric frame 3 surrounding the microwave device is placed on this metal carrier plate 1, and a second dielectric frame 3 is laminated as a spacer on this first dielectric frame 2. The body frame 4 is a metal cover plate which is a protection plate, and these carrier plate 1, dielectric frames 2 and 3 and cover plate 4 are
This constitutes a box that houses the microwave device. 5 is a metal film for input/output, and 6 is a metal film for bias. These are arranged on the surface of the first dielectric frame 2, and are connected to the input/output terminals and bias terminals of the microwave device by wire bonding or the like. connected to.

Therefore, the microwave input from the input/output metal film 5 is transmitted through the microstrip line formed on the first dielectric frame 2 and the first dielectric frame 2 and the second dielectric frame 3. The signal propagates to the input terminal of the microwave device via the triplate line.

Further, the output of the microwave device is taken out of the package from the input/output metal film 5 through a path opposite to that described above. Application of bias to the microwave device is also performed in the same manner as described above through the bias metal film 6.

[Problems to be solved by the invention] In the microwave device package with the above configuration,
Since the line width of the input/output metal film is uniform in the parts that constitute the microstrip line and the triplate line, the characteristic impedance of the microstrip line and the triplate line is different, and the microstrip line and the triplate line are different. There was a problem in that the reflection characteristics deteriorated in the conversion section of the plate line, and the input could no longer be effectively propagated to the microwave device.

This idea was made to solve this problem, and the reflection characteristics of the conventional microstrip line and the part corresponding to the conversion part of the triplate line are good, and the input can be effectively transferred to microwave equipment. The purpose is to obtain a package for microwave equipment that can be supplied to

[Means for Solving the Problems] A package for a microwave device according to the present invention includes a metal carrier plate, a frame-shaped first metal frame, and facing the first metal frame. A frame-shaped second metal frame with a small size and a large internal size and a lid body covering this second metal frame are stacked one after another from below, and the first metal frame is stacked one after another from below.
A recess with an upward opening is provided at a predetermined location on the upper surface of the metal frame, and a lower dielectric substrate having a metal film for forming a line on its upper surface and a portion of this lower dielectric substrate are formed in this recess. A two-layer dielectric substrate consisting of an upper dielectric substrate covering a portion facing the second metal frame is arranged at a portion thereof, and the line width of the portion of the line-constituting metal film covered with the upper dielectric substrate is determined. This makes the line width narrower than the uncovered portion, and a taper is provided at the portion where the line width changes.

[Function] In the microwave device package of the present invention,
A rectangular coaxial line is formed by a metal film for line construction, a lower dielectric substrate, an upper dielectric substrate, a first metal frame surrounding this, and a second metal frame. The microstrip line is made up of a metal frame, and the line width of the rectangular coaxial line part is narrower than the line width of the microstrip line part, so the characteristic impedance of the rectangular coaxial line and the microstrip line is The difference between the lines becomes smaller, the reflection characteristics at the rectangular coaxial line and the microstrip line conversion section become better, and the input is effectively propagated to the microwave device.

[Example] Hereinafter, an example of this invention will be described with reference to the drawings. Figure 1 is an exploded perspective view showing an embodiment of this invention, Figure 2 is a cross-sectional view of Figure 1, and Figure 3 is a cross-sectional view of Figure 1.
FIG. 2 is an exploded perspective view of a layered dielectric substrate.

1 and 2, 1 is a metal carrier plate, 4 is a metal lid plate, 7 is a frame-shaped first metal frame surrounding the microwave device, and 8 is this first metal frame.
a frame-shaped second metal frame 9, 10 having a smaller outer dimension and larger inner dimension than the metal frame 7;
are placed on the surface of the frame-shaped first metal frame 7 placed on the metal carrier plate 1 at the center of each side,
11 is a lower dielectric substrate for input/output; 12 is an upper dielectric substrate for input/output; these are stacked to form a two-layer dielectric substrate 13 for input/output. , are arranged in the recess 9, respectively. 14 is a lower layer dielectric substrate for bias, 15 is an upper layer dielectric substrate for bias, and these are stacked to form a two-layer dielectric substrate 16 for bias,
They are arranged in the recesses 10, respectively. A frame-shaped second metal frame 8 is placed on the first metal frame 7 in which the two-layer dielectric substrates 13 and 16 are disposed in each of the recesses 9 and 10, and a lid plate 4 is placed on top of the first metal frame 7.
is installed.

FIG. 3 is an exploded perspective view of the two-layer dielectric substrate 13.
In the figure, reference numeral 17 denotes frame attachment metal films 18a and 18b provided on the upper surface of the upper dielectric substrate 12 so as to face the second metal frame 8.
19 is a metal film for configuring a rectangular coaxial line provided on the upper surface of the lower dielectric substrate 11, 19 is a metal film for configuring a rectangular coaxial line, and 20 is a lower dielectric substrate 11.
Back metal films 21a and 21b provided on the lower surface of
is a taper.

Microstrip line configuration metal film 18a,
18b and the back metal film 20, the lower dielectric substrate 1
A microstrip line is constructed on 1.
Further, a rectangular coaxial line is constituted by the metal film 19 for forming the rectangular coaxial line, the lower dielectric substrate 11, the upper dielectric substrate 12, the first metal frame 7, and the second metal frame 8.

The line width of the metal film 19 for forming a rectangular coaxial line is the same as that of the metal films 18a and 18b for forming a microstrip line.
The characteristic impedance of the rectangular coaxial line and the microstrip line are respectively
It shall be 50Ω.

Further, the upper dielectric substrate 12 is stacked on the lower dielectric substrate 11 so that its end face faces the tapered portions 21a and 21b.

The microwave input is conducted through the metal film 18a for microstrip line configuration and the metal film 1 for rectangular coaxial line configuration.
9. Metal film 18b for microstrip line configuration
is propagated and supplied to the microwave device.

At this time, the characteristic impedance of the microstrip line and rectangular coaxial line are each 50Ω, so the reflection characteristics of the microstrip line and rectangular coaxial line conversion part are good, and the microwave input is effectively Propagate to the device.

Further, the upper dielectric substrate 12 has a tapered end surface 21.
a, 21b, the lower dielectric substrate 1
1, variations in characteristics due to misalignment of the mounting position of the upper dielectric substrate 12 are relatively small.

In the above embodiment, the case where four two-layer dielectric substrates are provided has been described, but the number is not limited to this and may be any number.

[Effects of the invention] As described above, in the package for microwave equipment of this invention, the line width of the part forming the rectangular coaxial line with the input/output metal film is equal to the line width of the part forming the microstrip line. Since it is narrower than the other hand, the difference in characteristic impedance between the microstrip line and the rectangular coaxial line is small, and the reflection characteristics of the microstrip line and rectangular coaxial line conversion part are good, making the input effective for microwave equipment. It has the effect of supplying Furthermore, since the parts other than the rectangular coaxial line are covered with metal, there is an effect of blocking microwave radiation from the microwave device to the outside of the package.

[Brief explanation of the drawing]

Figure 1 is an exploded perspective view showing one embodiment of this invention, Figure 2 is a cross-sectional view of Figure 1, and Figure 3 is a cross-sectional view of Figure 1.
FIG. 4 is an exploded perspective view showing a layered dielectric substrate, and FIG. 4 is an exploded perspective view showing a conventional package for a microwave device. In the figure, 1 is a metal carrier plate, 4 is a metal lid plate, 7 is a first metal frame, 8 is a second metal frame, 9 and 10 are recesses, 11 and 14 are lower dielectric substrates, 12, 15 is an upper dielectric substrate, 1
3 and 16 are two-layer dielectric substrates, 17 is a metal film for frame attachment, 18a and 18b are metal films for configuring a microstrip line, 19 is a metal film for configuring a rectangular coaxial line, 20 is a back metal film, 21a, 21b is a taper. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] It is composed of a metal carrier plate, a frame-like frame body placed on the metal carrier plate, and a metal lid plate that covers this frame body, and is formed by these carrier plate, frame body, and lid plate. In a package for a microwave device that houses a microwave device in a box body, the carrier plate, a frame-shaped first metal frame serving as the frame body, and a first metal frame opposite to the first metal frame, A frame-shaped second metal frame with small dimensions and a large internal dimension and the lid plate that covers this second metal frame are stacked one after another from the bottom, and the first
A recess with an upward opening is provided at a predetermined location on the upper surface of the metal frame, and a lower dielectric substrate having a metal film for forming a line on its upper surface and a portion of this lower dielectric substrate are formed in this recess. A two-layer dielectric substrate consisting of an upper dielectric substrate covering a portion facing the second metal frame is arranged at a portion thereof, and the line width of the portion of the line-constituting metal film covered with the upper dielectric substrate is determined. A package for a microwave device characterized in that the line width is narrower than the line width of the part not covered by this, and a taper is provided at the part where the line width changes.