JPH0352769B2 - - Google Patents
Info
- Publication number
- JPH0352769B2 JPH0352769B2 JP4021784A JP4021784A JPH0352769B2 JP H0352769 B2 JPH0352769 B2 JP H0352769B2 JP 4021784 A JP4021784 A JP 4021784A JP 4021784 A JP4021784 A JP 4021784A JP H0352769 B2 JPH0352769 B2 JP H0352769B2
- Authority
- JP
- Japan
- Prior art keywords
- bis
- polyfunctional
- prepolymer
- parts
- aminophenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000001412 amines Chemical class 0.000 claims description 17
- 239000004643 cyanate ester Substances 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 13
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 8
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 7
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 claims description 5
- MEZJQXVOMGUAMP-UHFFFAOYSA-N 1-(2-methylnaphthalen-1-yl)pyrrole-2,5-dione Chemical group CC1=CC=C2C=CC=CC2=C1N1C(=O)C=CC1=O MEZJQXVOMGUAMP-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000000203 mixture Substances 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 15
- -1 alicyclic amines Chemical class 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 8
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 5
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000001913 cyanates Chemical class 0.000 description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- GGSRTHRSSCWGGK-UHFFFAOYSA-L 2,2-dibutyl-5-hydroxy-1,3,2-dioxastannepane-4,7-dione Chemical compound CCCC[Sn]1(CCCC)OC(=O)CC(O)C(=O)O1 GGSRTHRSSCWGGK-UHFFFAOYSA-L 0.000 description 1
- ACUUVWABACRCCZ-UHFFFAOYSA-N 2-(2-ethyl-1h-imidazol-5-yl)propanenitrile Chemical compound CCC1=NC=C(C(C)C#N)N1 ACUUVWABACRCCZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- SIQHSJOKAUDDLN-UHFFFAOYSA-N 2-methyl-1-propylimidazole Chemical compound CCCN1C=CN=C1C SIQHSJOKAUDDLN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- BLMSGSGJGUHKFW-UHFFFAOYSA-N 4-[(4-aminophenyl)-diphenylsilyl]aniline Chemical compound C1=CC(N)=CC=C1[Si](C=1C=CC(N)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BLMSGSGJGUHKFW-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- KTZLSMUPEJXXBO-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylphosphoryl]aniline Chemical compound C1=CC(N)=CC=C1P(=O)(C=1C=CC(N)=CC=1)C1=CC=CC=C1 KTZLSMUPEJXXBO-UHFFFAOYSA-N 0.000 description 1
- CJXRYVQHINFIKO-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-1-phenylethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C=1C=CC(N)=CC=1)(C)C1=CC=CC=C1 CJXRYVQHINFIKO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- KIMCSKCETOAMBU-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dibromophenyl)propan-2-yl]-2,6-dibromoaniline Chemical compound C=1C(Br)=C(N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(N)C(Br)=C1 KIMCSKCETOAMBU-UHFFFAOYSA-N 0.000 description 1
- GGMWECHOWWCLRU-UHFFFAOYSA-N 4-[2-(4-amino-3-chlorophenyl)propan-2-yl]-2-chloroaniline Chemical compound C=1C=C(N)C(Cl)=CC=1C(C)(C)C1=CC=C(N)C(Cl)=C1 GGMWECHOWWCLRU-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- HEHUZGFZNPSQMW-UHFFFAOYSA-N NC1=CC=C(C=C1)C(C1=CC=C(C=C1)N)[PH2]=O Chemical compound NC1=CC=C(C=C1)C(C1=CC=C(C=C1)N)[PH2]=O HEHUZGFZNPSQMW-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- GXFRMDVUWJDFAI-UHFFFAOYSA-N [2,6-dibromo-4-[2-(3,5-dibromo-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Br)=C(OC#N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OC#N)C(Br)=C1 GXFRMDVUWJDFAI-UHFFFAOYSA-N 0.000 description 1
- YKONYNBAMHVIMF-UHFFFAOYSA-N [2,6-dichloro-4-[2-(3,5-dichloro-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Cl)=C(OC#N)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(OC#N)C(Cl)=C1 YKONYNBAMHVIMF-UHFFFAOYSA-N 0.000 description 1
- SNYVZKMCGVGTKN-UHFFFAOYSA-N [4-(4-cyanatophenoxy)phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OC1=CC=C(OC#N)C=C1 SNYVZKMCGVGTKN-UHFFFAOYSA-N 0.000 description 1
- HEJGXMCFSSDPOA-UHFFFAOYSA-N [4-(4-cyanatophenyl)phenyl] cyanate Chemical group C1=CC(OC#N)=CC=C1C1=CC=C(OC#N)C=C1 HEJGXMCFSSDPOA-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
- HYAOCWBXRFEHDV-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphoryloxyphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1OP(OC=1C=CC(OC#N)=CC=1)(=O)OC1=CC=C(OC#N)C=C1 HYAOCWBXRFEHDV-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- IWZNWGDJJJKIOC-UHFFFAOYSA-N bis(3-aminophenyl)methyl-oxidophosphanium Chemical compound NC=1C=C(C=CC1)C(C1=CC(=CC=C1)N)[PH2]=O IWZNWGDJJJKIOC-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- ZSWDZQGVDJWLBK-UHFFFAOYSA-N dichloromethanediamine Chemical compound NC(N)(Cl)Cl ZSWDZQGVDJWLBK-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- NWADXBLMWHFGGU-UHFFFAOYSA-N dodecanoic anhydride Chemical compound CCCCCCCCCCCC(=O)OC(=O)CCCCCCCCCCC NWADXBLMWHFGGU-UHFFFAOYSA-N 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Polymers [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002825 nitriles Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002102 polyvinyl toluene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【発明の詳細な説明】
本発明は、成形性、耐熱性、接着性などに優れ
た硬化物を与える硬化性樹脂組成物に関するもの
で、詳しくは、A.分子中にN−マレイミド基を
2個以上含有する多官能性マレイミド、トリアル
ケニルイソシアヌレートおよび多官能性アミンを
加熱反応させてなるプレポリマーとB.分子中に
シアナト基を2個以上含有する多官能性シアン酸
エステル、該シアン酸エステルプレポリマー或い
は該シアン酸エステルとアミンとのプレポリマー
とを必須成分としてなる硬化性樹脂組成物であ
る。
従来、トリアルケニルイソシアヌレートの単独
硬化物は脆く、単独ではその優れた耐熱性、耐薬
品性などにもかかわらず使用困難であり、メチル
メタクリレート、スチレン、不飽和ポリエステル
などのビニル系樹脂の改質剤として利用されてい
る。又、多官能性シアン酸エステル類と多官能性
マレイミド類とを必須成分とする硬化性樹脂組成
物は、耐熱性、耐薬品性、接着性、耐湿性等には
優れたものであるが、より高度の耐湿性の面から
はやや不十分であり、また、注型等に用いる場
合、表面光沢などの面で不十分であつた。
多官能性シアン酸エステル類、多官能性マレイ
ミド類およびトリアルケニルイソシアヌレートを
必須成分とする硬化性樹脂組成物は、耐熱性、耐
薬品性、接着性、耐湿性等には優れたものである
が、溶剤溶解性に劣り高濃度の溶液として使用す
る用途においては、均一な組成物として使用する
ことが困難であり、かつ、無溶剤液状樹脂として
用いる場合は、透明性の無い不均一な組成物とし
てしか使用出来ないという欠点がある。又、多官
能性マレイミド類と多官能性アミン類とを加熱反
応させた後、エポキシ樹脂を混合する方法は、多
官能性マレイミド類と多官能性アミン類との溶融
反応が急速なため、通常、溶剤中で反応する必要
があり、無溶剤化が困難な作業であつた。
更に、多官能性マレイミド、多官能性アミン、
トリアルケニルイソシアヌレート、および多官能
性シアン酸エステルの混合物は、多官能性アミン
と多官能性マレイミドや多官能性シアン酸エステ
ルとが容易に反応し保存安定性に劣り、又、これ
らの予備反応は多官能性マレイミド類と多官能性
アミン類との反応が急速であり、かつ、多官能性
シアン酸エステルと多官能性アミンとの反応でイ
ミン炭酸エステルケ結合が形成されるため、硬化
物の耐熱性や未硬化組成物の保存安定性が劣る。
本発明者らは以上のような欠点を解消すべく鋭
意研究を重ねた結果、多官能性マレイミド類、ト
リアルケニルイソシアヌレート、および多官能性
アミン類を加熱反応してなるプレポリマーと多官
能性シアン酸エステル類とを組み合せることによ
り、耐熱性、耐湿性、耐薬品性、電気特性、機械
的強度などに優れ、かつ加工において作業性の良
好な耐熱性樹脂組成物を得ることに成功し、本発
明に至つた。
以下、本発明について説明する。
本発明のA.成分中の多官能性マレイミドとし
て好適なものは下記一般式(2)
(式中、Rは2価以上、通常5価以下の芳香族ま
たは脂環族性有機基、X1、X2は水素、ハロゲン、
またはアルキル基であり、nは通常2〜5の整数
である。)
で表される化合物である。上式で表されるマレイ
ミド類は無水マレイン酸類とアミノ基を2〜5個
含有するポリアミン類とを反応させマレアミド酸
を調整し、次いでマレアミド酸を脱水環化させる
それ自体公知の方法で製造することができる。用
いるポリアミン類は芳香族ポリアミンであること
が最終樹脂の耐熱性等の点で好ましいが、樹脂の
可撓性や柔軟性が望ましい場合には、脂環族アミ
ンを単独或いは組合せで使用してもよい。また、
ポリアミン類は第一級アミンであることが反応性
の点で望ましいが、第二級アミンも使用できる。
好適なアミン類としては、メタまたはパラフエニ
レンジアミン、メタまたはパラキシリレンジアミ
ン、1,4−または1,3−シクロヘキサンジア
ミン、ヘキサヒドロキシリレンジアミン、4,
4′−ジアミノビフエニル、ビス(4−アミノフエ
ニル)メタン、ビス(4−アミノフエニル)エー
テル、ビス(4−アミノフエニル)スルホン、ビ
ス(4−アミノ−3−メチルフエニル)メタン、
ビス(4−アミノ−3,5−ジメチルフエニル)
メタン、ビス(4−アミノフエニル)シクロヘキ
サン、2,2−ビス(4−アミノフエニル)プロ
パン、2,2−ビス(4−アミノ−3−メチルフ
エニル)プロパン、2,2ビス(4−アミノ−3
−クロロフエニル)プロパン、ビス(4−アミノ
−3−クロロフエニル)メタン、2,2−ビス
(4−アミノ−3,5−ジブロモフエニル)プロ
パン、ビス(4−アミノフエニル)フエニルメタ
ン、3,4−ジアミノフエニル−4′−アミノフエ
ニルメタン、1,1−ビス(4−アミノフエニ
ル)−1−フエニルエタン、およびs−トリアジ
ン環をもつたメラミン類、アニリンとホルマリン
とを反応させてベンゼン環をメチレン結合で結ん
だポリアミン類等である。
本発明のA成分中のトリアルケニルイソシアヌ
レートとは、下記一般式
〔式中のRは、炭素数2〜4のアルケニル基〕
で表される化合物である。好ましいR(アルケニ
ル基)を例示すれば、ビニル基、アリル基、クロ
チル基、メタアリル基、クロルプロペニル基、ブ
タジエニル基などが挙げられる。又、これらトリ
アルケニルイソシアヌレートを有機過酸化物、紫
外線、熱などによりプレポリマー化したものも好
適に用いられる。又、可撓性その他の点から、反
応性希釈剤としてアクリル酸エステル、スチレ
ン、ジアリルフタレートなどのビニル化合物を併
用してもよい。
本発明のA成分中の多官能性アミンとは、炭素
数2以上の2価以上の有機基に第一級アミノ基
(−NH2)を2個以上有する多官能性アミンであ
る。好適なものとしては、ベンゾグアナミン、メ
ラミン、グアナミン、4,4′−ジアミノシクロヘ
キシルメタン、1,4−ジアミノシクロヘキサ
ン、2,6−ジアミノピリジン、メタフエニレン
ジアミン、パラフエニレンジアミン、ジクロルジ
アミノメタン、4,4′−ジアミノジフエニルメタ
ン、2,2−ビス(4−アミノフエニル)プロパ
ン、ベンジジン、4,4′−ジアミノフエニルオキ
サイド、4,4′−ジアミノジフエニルサルフアイ
ド、4,4′−ジアミノフエニルスルホン、ビス
(4−アミノフエニル)ジフエニルシラン、ビス
(4−アミノフエニル)メチルホスフインオキサ
イド、ビス(3−アミノフエニル)メチルホスフ
インオキサイド、ビス(4−アミノフエニル)フ
エニルホスフインオキサイド、1,5−ジアミノ
ナフタレン、メタキシリレンジアミン、パラキシ
リレンジアミン、ヘキサメチレンジアミン、1,
3,5−ペンタトリアミン、3,5−ジアミノ−
1,2,4−トリアゾール等が例示される。
本発明のB成分である多官能性シアン酸エステ
ルとして好適なものは、下記一般式(2)
R(OCN)n ……(2)
(式中のmは2以上、通常5以下の整数であり、
Rは芳香族の有機基であつて、上記シアナト基は
該有機基の芳香環に結合しているもの)
で表される化合物である。具体的に例示すれば
1,3−又は1,4−ジシアナトベンゼン、1,
3,5−トリシアナトベンゼン、1,3−,1,
4−,1,6−,1,8−,2,6−,又は2,
7−ジシアナトナフタレン、1,3,6−トリシ
アナトナフタレン、4,4′−ジシアナトビフエニ
ル、ビス(4−ジシアナトフエニル)メタン、
2,2−ビス(4−シアナトフエニル)プロパ
ン、2,2−ビス(3,5−ジクロロ−4−シア
ナトフエニル)プロパン、2,2−ビス(3,5
−ジブロモ−4−シアナトフエニル)プロパン、
ビス(4−シアナトフエニル)エーテル、ビス
(4−シアナトフエニル)チオエーテル、ビス
(4−シアナトフエニル)スルホン、トリス(4
−シアナトフエニル)ホスフアイト、トリス(4
−シアナトフエニル)ホスフエート、およびノボ
ラツクとハロゲン化シアンとの反応により得られ
るシアン酸エステルなどである。これらのほかに
特公昭41−1928、同43−18468、同44−4791、同
45−11712、同46−41112、同47−26853および特
開昭51−63149などに記載のシアン酸エステルも
用いうる。
また、上述した多官能性シアン酸エステルを鉱
酸、ルイス酸、炭酸ナトリウム或いは塩化リチウ
ム等の塩類、トリブチルホスフイン等のリン酸エ
ステル類などの存在下に重合させて得られるプレ
ポリマーとして用いることができる。これらのプ
レポリマーは、前記シアン酸エステル中のシアン
基が三量化することによつて形成されるsym−ト
リアジン環を、一般に分子中に有している。本発
明においては、数平均分子量300〜6000の前記プ
レポリマーを用いるのが好ましい。
本発明の硬化性樹脂組成物中のAは、多官能性
マレイミド1molに対して、多官能性アミンを
0.009〜0.3mol、好ましくは0.011〜0.11molであ
り、多官能性マレイミド100wt部に対して、トリ
アルケニルイソシアヌレートを5〜40wt部、好
ましくは、10〜35wt部用いて加熱反応すること
によつて調整する。加熱反応の条件は上記の三成
分の使用量比にもよるが、通常、80〜200℃、0.5
〜24時間の範囲から、3成分が均一な液状となり
且つゲル化しない範囲より適宜選択され、所望に
より、ハイドロキノン、ターシヤリーブチルカテ
コール、ハイドロキノンモノメチルエーテルなど
のラジカル重合禁止剤を添加して行う。ここに、
多官能性マレイミド1molに対して、多官能性ア
ミンが0.3molより多い場合、過剰の未反応多官
能性アミンが残存し、B成分の多官能性シアン酸
エステル類と反応して、イミン炭酸結合を形成
し、耐熱性を劣化させ、未硬化の樹脂組成物の保
存安定性も低下させるので好ましくない。トリア
ルケニルイソシアヌレートが5wt部未満では、溶
融反応がしづらく、40wt部を超えると、硬化物
の耐熱性が低下するので好ましくない。
本発明の硬化性樹脂組成物中のA、B両成分の
使用量比については特に限定のないものである
が、通常、A:B=1:99〜90:10の範囲が好適
であり、好ましくは10:90〜80:20用いるのが良
い。
本発明の硬化性樹脂組成物のA、B両成分の混
合調整方法は、A、B両成分を単に混合する方
法、溶媒に溶解または均一に分散させて混合する
方法、混合後さらに80〜200℃で0〜24時間予備
反応させる方法などによる。
本発明の硬化性樹脂組成物はそれ自体加熱によ
り結合し網状化して耐熱性樹脂となる性質を有し
ているが、架橋網状化を促進する目的で、触媒を
含有させて使用してもよい。このような触媒とし
ては、2−メチルイミダゾール、2−ウンデシル
イミダゾール、2−ヘプタデシルイミダゾール、
2−フエニルイミダゾール、2−エチル−4−メ
チルイミダゾール、1−ベンジル−2−メチルイ
ミダゾール、1−プロピル−2−メチルイミダゾ
ール、1−シアノエチル−2−メチルイミダゾー
ル、1−シアノエチル−2−エチルイミダゾー
ル、1−シアノエチル−2−ウンデシルイミダゾ
ール、1−シアノエチル−2−フエニルイミダゾ
ール、1−シアノエチル−2−エチル−4−メチ
ルイミダゾール、1−グアナミノエチル−2−メ
チルイミダゾールで例示されるイミダゾール類、
さらには、これらのイミダゾール類へのカルボン
酸もしくはその無水物類の付加体など;N,N−
ジメチルベンジルアミン、N,N−ジメチルアニ
リン、N,N−ジメチルトルイジン、N,N−ジ
メチル−p−アニシジン、p−ハロゲノ−N,N
−ジメチルアニリン、2−N−エチルアニリノエ
タノール、トリ−n−ブチルアミン、ピリジン、
キノリン、N−メチルモルホリン、トリエタノー
ルアミン、トリエチレンジアミン、N,N,N′,
N′−テトラメチルブタンジアミン、N−メチル
ピペリジンなどの第3級アミン類;フエノール、
キシレノール、クレゾール、レゾルシン、カテコ
ール、フロログリシンなどのフエノール類;ナフ
テン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オ
クチル酸亜鉛、オレイン酸錫、ジブチル錫マレー
ト、ナフテン酸マンガン、ナフテン酸コバルト、
アセチルアセトン鉄などの有機金属塩;SnCl4、
ZnCl2、AlCl3などの無機金属塩;過酸化ベンゾ
イル、ラウロイルパーオキサイド、カプリルパー
トキサイド、アセチルパーオキサイド、パラクロ
ロベンゾイルパーオキサイド、ジ−tert−ブチル
−ジ−パーフタレートなどの過酸化物;無水マレ
イン酸、無水フタル酸、無水ラウリル酸、無水ピ
ロメリツト酸、無水トリメリツト酸、ヘキサヒド
ロ無水フタル酸、ヘキサヒドロ無水トリメリツト
酸、ヘキサヒドロ無水ピロメリツト酸などの酸無
水物;さらには、アゾビスイソブチルニトリルな
どのアゾ化合物類などが挙げられる。これら触媒
の添加量は、一般的な意味での触媒量の範囲で充
分であり、たとえば全組成物に対して5wt%以下
の量で使用されればよい。
本発明の硬化性樹脂組成物を硬化させるための
温度は、硬化剤や触媒の有無、組成成分の種類な
どによつても変化するが、通常100〜250℃の範囲
で選ばれればよい。この組成物は種々の用途に用
いられるが、成形品、積層品、接着構造物等の製
造に用いられる場合には、加熱硬化に際して圧力
を加えることが好ましく、一般的に言つて1〜
500Kg/cm2、好ましくは5〜150Kg/cm2の範囲内で
適宜選ばれる。
本発明の硬化性樹脂組成物には、組成物本来の
特性が損なわれない範囲で、所望に応じて種々の
添加物を配合することが出来る。これらの添加物
としては、天然または合成の熱硬化性もしくは熱
可塑性の樹脂類およびその低分子量物、繊維質補
強剤、充填剤、染料、顔料、増粘剤、滑剤、カツ
プリング剤、難燃剤など公知の各種添加剤が含ま
れ、所望に応じて適宜組合せて用いられる。ここ
に熱可塑性樹脂類もしくはその低分子量化合物と
しては、例えば、ポリビニルホルマール、ポリビ
ニルアセタール、ポリビニルブチラールなどのポ
リビニルアセタール樹脂;熱可塑性ポリウレタン
樹脂;ポリブタジエン、ブタジエン−アクリロニ
トリル共重合体、ポリクロロプレン、ブタジエン
−スチレン共重合体、ポリイソプレン、ブチルゴ
ム、天然ゴムなどの無架橋(無加硫)のゴム類;
ポリエチレン、ポリプロピレン、ポリブテン、ポ
リ−4−メチルペンテン−1、ポリ塩化ビニル、
塩化ビニリデン樹脂、ポリスチレン、ポリビニル
トルエン、ポリビニルフエノール、AS樹脂、
ABS樹脂、MBS樹脂、ポリ−4−フツ化エチレ
ン、フツ化エチレン−プロピレン共重合体、4−
フツ化エチレン−6−フツ化エチレン共重合体、
フツ化ビニリデンなどのビニル化合物重合体類;
ポリカーボネート、ポリエステルカーボネート、
ポリフエニレンエーテル、ポリスルホン、ポリエ
ステル、ポリエーテルサルホン、ポリアミド、ポ
リアドイミド、ポリエステルイミド、ポリフエニ
レンサルフアイドなどの樹脂類並びにこれらの熱
可塑性樹脂の低重合物である分子量が1万以下、
通常、千〜数千の低分子量重合体(プレポリマ
ー)を挙げらことができる。
以下、実施例、比較例によつて本発明をさらに
具体的に説明する。尚、実施例、比較例中の部は
特に断らない限り重量部である。
実施例1および比較例1
ビス(4−マレイミドフエニル)メタン100部
(0.28モル)にビス(4−アミノフエニル)メタ
ン5部(0.025モル)およびトリアリルイソシア
ヌレート20部を混合し、145℃で2時間加熱反応
し、プレポリマーを得た。このプレポリマーに
2,2−ビス(4−シアナフエニル)プロパンを
150℃で1時間予備反応させたプレポリマー67部
を加え、120℃で1時間混合した後、冷却して褐
色透明な粘度3400PS(30℃)の樹脂液を得た。
この樹脂液を金型に入れ、150℃で2時間、180
℃で2時間硬化後、240℃で20時間硬化させ、厚
み4mmの注型板を得た。この注型板の試験結果を
第1表に示した。
又、上記の樹脂液をN,N−ジメチルホルムア
ミドと混合し、濃度55%の常温で褐色透明な溶液
とし、この溶液182部に触媒として、オクチル酸
亜鉛0.05部、ジクミルパーオキサイド0.1部を添
加混合し、厚み0.2mmのガラス織布に含浸し加熱
乾燥してB−stageプリプレグとし、このプリプ
レグ8枚の両側に厚み35μの電解銅箔を重ね、温
度180℃、圧力50Kg/cm2で120分間積層成形し、更
に240℃で24時間後硬化した。
得られた銅張積層板の試験結果を第1表に示し
た。
実施例 2
ビス(3−クロロ−4−マレイミドフエニル)
メタン100部(0.23モル)にベンゾグアナミン1
部(0.0053モル)、トリアリルイソシアヌレート
30部及びハイドロキノン0.1部を混合し、160℃で
1時間加熱反応し、プレポリマーを得た。このプ
レポリマーに2,2−ビス(4−シアナトフエニ
ル)プロパンを150℃で1時間予備反応させたプ
レポリマー150部を加え、140℃で1時間混合した
後、冷却して褐色透明な粘度12000PS(30℃)の
樹脂液を得た。
この樹脂液を用いる他は実施例1と同様にして
注型板を得た。この注型板の試験結果を第1表に
示した。
又、上記の樹脂液をN,N−ジメチルホルムア
ミドと混合し、濃度55%の常温で褐色透明な溶液
とする他は実施例1と同様にして銅張積層板を
得、試験した。
試験結果を第1表に示した。
比較例 1
トリアリルイソシアヌレートを用いない事の他
は実施例1と同様の予備反応を試みた。しかし、
反応温度145℃では均一な反応液と成らなかつた
ため、反応温度を160℃とした所、15分後にゲル
化を起こし、プレポリマーを得ることは出来なか
つた。
比較例 2
ビス(4−アミノフエニル)メタンを用いない
ことの他は実施例1と同様の方法を試みた。予備
反応温度145℃では、45分後に急激なゲル化を起
こしたので、予備反応温度を120℃として2時間
加熱反応させた。
予備反応終了後、このプレポリマーに2,2−
ビス(4−シアナトフエニル)プロパンを150℃
で1時間予備反応させたプレポリマー67部を加
え、120℃で1時間混合した後、冷却して黄褐色
の不透明なペースト状の固体状態に近い樹脂であ
つた。
比較例 3
ビス(4−マレイミドフエニル)メタン100部
に、2,2−ビス(4−シアナトフエニル)プロ
パン67部及びトリアリルイソシアヌレート20部を
混合し、145℃で2時間加熱反応し、冷却して黄
褐色不透明な粘度31000PS(30℃)の樹脂液を得
た。
この樹脂液を用いる他は同様にして注型板、お
よび銅張積層板を得た。ここに、ワニスとする場
合、不均一な樹脂液のため、ガラス織布への含浸
に当たつては、樹脂液を撹拌混合して直ちに含浸
する必要があつた。試験結果を第1表に示した。
比較例 4
実施例1において、ビス(4−マレイミドフエ
ニル)メタン、ビス(4−アミノフエニル)メタ
ンおよびトリアリルイソシアヌレートの混合物の
予備反応を行わずに、2,2−ビス(4−シアナ
トフエニル)プロパンを150℃で1時間予備反応
したものを加え、120℃で1時間混合したが、均
一で透明な樹脂液とはならず、ビス(4−マレイ
ミドフエニル)メタンが多量に析出したほぼ固体
状の混合物となつた。
この混合物を用い、注型温度を120℃と加熱下
に行う他は実施例1と同様にして注型板を得た。
結果を第1表に示した。
又、実施例1と同様にしてプリプレグの製造を
試みたが、極めて不均一なワニスしか得られず、
且つ、この不均一に基づいて異常に流れが大き
く、良好なプリプレグを製造することが出来なか
つた。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a curable resin composition that provides a cured product with excellent moldability, heat resistance, adhesiveness, etc. B. A prepolymer obtained by heat-reacting polyfunctional maleimide, trialkenyl isocyanurate, and polyfunctional amine containing two or more cyanato groups, and B. a polyfunctional cyanate ester containing two or more cyanato groups in the molecule, and the cyanic acid. This is a curable resin composition containing an ester prepolymer or a prepolymer of the cyanate ester and an amine as an essential component. Conventionally, cured products of trialkenyl isocyanurate were brittle and difficult to use alone, despite their excellent heat resistance and chemical resistance, and were used to modify vinyl resins such as methyl methacrylate, styrene, and unsaturated polyester. It is used as a drug. In addition, curable resin compositions containing polyfunctional cyanate esters and polyfunctional maleimides as essential components have excellent heat resistance, chemical resistance, adhesiveness, moisture resistance, etc. It was somewhat insufficient in terms of higher moisture resistance, and when used for casting etc., it was insufficient in terms of surface gloss. Curable resin compositions containing polyfunctional cyanate esters, polyfunctional maleimides, and trialkenyl isocyanurates as essential components have excellent heat resistance, chemical resistance, adhesiveness, moisture resistance, etc. However, it is difficult to use as a uniform composition when used as a highly concentrated solution due to poor solvent solubility, and when used as a solvent-free liquid resin, it has a non-uniform composition with no transparency. The drawback is that it can only be used as an object. In addition, the method of heating and mixing polyfunctional maleimides and polyfunctional amines and then mixing them with epoxy resin is usually difficult because the melt reaction between polyfunctional maleimides and polyfunctional amines is rapid. , it was necessary to react in a solvent, and it was difficult to make it solvent-free. Furthermore, polyfunctional maleimide, polyfunctional amine,
In a mixture of trialkenyl isocyanurate and polyfunctional cyanate ester, the polyfunctional amine easily reacts with polyfunctional maleimide or polyfunctional cyanate ester, resulting in poor storage stability. The reaction between polyfunctional maleimides and polyfunctional amines is rapid, and the reaction between polyfunctional cyanate ester and polyfunctional amine forms an imine carbonate bond, so that the cured product is Heat resistance and storage stability of uncured compositions are poor. The present inventors have conducted intensive research to solve the above-mentioned drawbacks, and as a result, we have developed a prepolymer and a polyfunctional prepolymer obtained by heat-reacting polyfunctional maleimides, trialkenyl isocyanurates, and polyfunctional amines. By combining it with cyanate esters, we succeeded in obtaining a heat-resistant resin composition that has excellent heat resistance, moisture resistance, chemical resistance, electrical properties, mechanical strength, etc., and has good workability in processing. , led to the present invention. The present invention will be explained below. A preferred polyfunctional maleimide in component A of the present invention is represented by the following general formula (2): (In the formula, R is an aromatic or alicyclic organic group with a valence of 2 or more and usually 5 or less, X 1 and X 2 are hydrogen, halogen,
or an alkyl group, and n is usually an integer of 2 to 5. ) is a compound represented by Maleimides represented by the above formula are produced by a method known per se, in which maleic anhydride and polyamines containing 2 to 5 amino groups are reacted to prepare maleamic acid, and then maleamic acid is cyclized by dehydration. be able to. The polyamines used are preferably aromatic polyamines in terms of the heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. good. Also,
It is desirable that the polyamines be primary amines in terms of reactivity, but secondary amines can also be used.
Suitable amines include meta or paraphenylene diamine, meta or para xylylene diamine, 1,4- or 1,3-cyclohexane diamine, hexahydroxylylene diamine, 4,
4'-diaminobiphenyl, bis(4-aminophenyl)methane, bis(4-aminophenyl)ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane,
Bis(4-amino-3,5-dimethylphenyl)
Methane, bis(4-aminophenyl)cyclohexane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-amino-3-methylphenyl)propane, 2,2bis(4-amino-3
-chlorophenyl)propane, bis(4-amino-3-chlorophenyl)methane, 2,2-bis(4-amino-3,5-dibromophenyl)propane, bis(4-aminophenyl)phenylmethane, 3,4-diamino Phenyl-4'-aminophenylmethane, 1,1-bis(4-aminophenyl)-1-phenylethane, and melamines with an s-triazine ring, aniline and formalin are reacted to bond the benzene ring with methylene. Polyamines etc. bound with The trialkenyl isocyanurate in component A of the present invention has the following general formula: [R in the formula is an alkenyl group having 2 to 4 carbon atoms] This is a compound represented by the following formula. Preferred examples of R (alkenyl group) include vinyl group, allyl group, crotyl group, metaallyl group, chlorpropenyl group, butadienyl group, and the like. Prepolymerization of these trialkenyl isocyanurates using organic peroxides, ultraviolet rays, heat, etc. can also be suitably used. Furthermore, from the viewpoint of flexibility and other aspects, a vinyl compound such as acrylic acid ester, styrene, diallyl phthalate, etc. may be used in combination as a reactive diluent. The polyfunctional amine in component A of the present invention is a polyfunctional amine having two or more primary amino groups ( -NH2 ) in a divalent or higher organic group having two or more carbon atoms. Suitable examples include benzoguanamine, melamine, guanamine, 4,4'-diaminocyclohexylmethane, 1,4-diaminocyclohexane, 2,6-diaminopyridine, metaphenylenediamine, paraphenylenediamine, dichlorodiaminomethane, 4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, benzidine, 4,4'-diaminophenyl oxide, 4,4'-diaminodiphenyl sulfide, 4,4'- Diaminophenyl sulfone, bis(4-aminophenyl)diphenylsilane, bis(4-aminophenyl)methylphosphine oxide, bis(3-aminophenyl)methylphosphine oxide, bis(4-aminophenyl)phenylphosphine oxide, 1,5 -diaminonaphthalene, metaxylylene diamine, paraxylylene diamine, hexamethylene diamine, 1,
3,5-pentatriamine, 3,5-diamino-
Examples include 1,2,4-triazole. Suitable polyfunctional cyanate esters as component B of the present invention have the following general formula (2) R(OCN) n ...(2) (m in the formula is an integer of 2 or more and usually 5 or less). can be,
R is an aromatic organic group, and the cyanato group is bonded to the aromatic ring of the organic group. Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,
3,5-tricyanatobenzene, 1,3-,1,
4-, 1, 6-, 1, 8-, 2, 6-, or 2,
7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4'-dicyanatobiphenyl, bis(4-dicyanatophenyl)methane,
2,2-bis(4-cyanatophenyl)propane, 2,2-bis(3,5-dichloro-4-cyanatophenyl)propane, 2,2-bis(3,5
-dibromo-4-cyanatophenyl)propane,
Bis(4-cyanatophenyl) ether, bis(4-cyanatophenyl) thioether, bis(4-cyanatophenyl) sulfone, tris(4
-cyanatophenyl) phosphite, tris(4
-cyanatophenyl) phosphate, and cyanic acid esters obtained by the reaction of novolacs with cyanogen halides. In addition to these, Tokuko Sho 41-1928, Sho 43-18468, Sho 44-4791, Sho 44-4791,
Cyanic acid esters described in JP-A No. 45-11712, No. 46-41112, No. 47-26853, and JP-A No. 51-63149 can also be used. Alternatively, the above-mentioned polyfunctional cyanate ester can be used as a prepolymer obtained by polymerizing it in the presence of a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, or a phosphate ester such as tributylphosphine. I can do it. These prepolymers generally have a sym-triazine ring in the molecule, which is formed by trimerization of the cyanide groups in the cyanate ester. In the present invention, it is preferable to use the prepolymer having a number average molecular weight of 300 to 6,000. A in the curable resin composition of the present invention refers to the amount of polyfunctional amine per 1 mol of polyfunctional maleimide.
0.009 to 0.3 mol, preferably 0.011 to 0.11 mol, by heating and reacting trialkenyl isocyanurate with 5 to 40 wt parts, preferably 10 to 35 wt parts, with respect to 100 wt parts of polyfunctional maleimide. adjust. The conditions for the heating reaction depend on the ratio of the amounts used of the three components above, but are usually 80 to 200℃, 0.5
to 24 hours, the three components are suitably selected from a range in which they become a uniform liquid and do not gel, and if desired, a radical polymerization inhibitor such as hydroquinone, tert-butylcatechol, or hydroquinone monomethyl ether is added. Here,
If the amount of polyfunctional amine is more than 0.3 mol per 1 mol of polyfunctional maleimide, excess unreacted polyfunctional amine remains and reacts with the polyfunctional cyanate ester of component B, forming an imine carbonate bond. This is undesirable because it forms a compound that deteriorates the heat resistance and also reduces the storage stability of the uncured resin composition. If the trialkenyl isocyanurate is less than 5 parts by weight, the melting reaction is difficult to occur, and if it exceeds 40 parts by weight, the heat resistance of the cured product decreases, which is not preferable. Although there is no particular limitation on the ratio of the amounts used of both components A and B in the curable resin composition of the present invention, a range of A:B = 1:99 to 90:10 is usually suitable; Preferably, the ratio is 10:90 to 80:20. The method of mixing and adjusting both components A and B of the curable resin composition of the present invention includes a method of simply mixing both components A and B, a method of dissolving them in a solvent or dispersing them uniformly, and a method of mixing the components A and B by dissolving them in a solvent or dispersing them uniformly. This can be done by pre-reacting for 0 to 24 hours at °C. The curable resin composition of the present invention itself has the property of becoming a heat-resistant resin by bonding and reticulating when heated, but it may also contain a catalyst for the purpose of promoting cross-linking and reticulating. . Such catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecyl imidazole,
2-Phenylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethylimidazole , 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and imidazoles exemplified by 1-guanaminoethyl-2-methylimidazole,
Furthermore, adducts of carboxylic acids or their anhydrides to these imidazoles; N,N-
Dimethylbenzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine, p-halogeno-N,N
-dimethylaniline, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine,
Quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N,N,N',
Tertiary amines such as N'-tetramethylbutanediamine and N-methylpiperidine; phenol,
Phenols such as xylenol, cresol, resorcin, catechol, phlologlycin; lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, tin oleate, dibutyltin malate, manganese naphthenate, cobalt naphthenate,
Organometallic salts such as iron acetylacetonate; SnCl 4 ,
Inorganic metal salts such as ZnCl2 , AlCl3 ; peroxides such as benzoyl peroxide, lauroyl peroxide, caprylic peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert-butyl-di-perphthalate; Acid anhydrides such as maleic anhydride, phthalic anhydride, lauric anhydride, pyromellitic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, hexahydro trimellitic anhydride, hexahydropyromellitic anhydride; Examples include compounds. The amount of these catalysts to be added is sufficient within the range of catalytic amounts in a general sense, and may be used, for example, in an amount of 5 wt% or less based on the total composition. The temperature for curing the curable resin composition of the present invention varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but may be generally selected within the range of 100 to 250°C. This composition is used for various purposes, but when used for manufacturing molded products, laminated products, adhesive structures, etc., it is preferable to apply pressure during heat curing, and generally speaking,
It is suitably selected within the range of 500 Kg/cm 2 , preferably 5 to 150 Kg/cm 2 . The curable resin composition of the present invention may contain various additives as desired, as long as the original properties of the composition are not impaired. These additives include natural or synthetic thermosetting or thermoplastic resins and their low molecular weight products, fibrous reinforcing agents, fillers, dyes, pigments, thickeners, lubricants, coupling agents, flame retardants, etc. Various known additives are included and can be used in appropriate combinations as desired. Examples of thermoplastic resins or low molecular weight compounds thereof include polyvinyl acetal resins such as polyvinyl formal, polyvinyl acetal, and polyvinyl butyral; thermoplastic polyurethane resins; polybutadiene, butadiene-acrylonitrile copolymer, polychloroprene, butadiene-styrene. Non-crosslinked (non-vulcanized) rubbers such as copolymers, polyisoprene, butyl rubber, and natural rubber;
polyethylene, polypropylene, polybutene, poly-4-methylpentene-1, polyvinyl chloride,
Vinylidene chloride resin, polystyrene, polyvinyltoluene, polyvinylphenol, AS resin,
ABS resin, MBS resin, poly-4-fluorinated ethylene, fluorinated ethylene-propylene copolymer, 4-
Fluorinated ethylene-6-fluorinated ethylene copolymer,
Vinyl compound polymers such as vinylidene fluoride;
polycarbonate, polyester carbonate,
Resins such as polyphenylene ether, polysulfone, polyester, polyethersulfone, polyamide, polyadimide, polyester imide, polyphenylene sulfide, and low polymers of these thermoplastic resins with a molecular weight of 10,000 or less,
Usually, one thousand to several thousand low molecular weight polymers (prepolymers) can be mentioned. The present invention will be explained in more detail below using Examples and Comparative Examples. In addition, parts in Examples and Comparative Examples are parts by weight unless otherwise specified. Example 1 and Comparative Example 1 100 parts (0.28 mol) of bis(4-maleimidophenyl)methane, 5 parts (0.025 mol) of bis(4-aminophenyl)methane and 20 parts of triallylisocyanurate were mixed, and the mixture was heated at 145°C. A heating reaction was performed for 2 hours to obtain a prepolymer. Add 2,2-bis(4-cyanaphenyl)propane to this prepolymer.
67 parts of a prepolymer pre-reacted at 150°C for 1 hour was added, mixed at 120°C for 1 hour, and then cooled to obtain a brown transparent resin liquid with a viscosity of 3400PS (at 30°C). Pour this resin liquid into a mold and heat it at 150℃ for 2 hours at 180℃.
After curing at 240°C for 2 hours, the mixture was cured at 240°C for 20 hours to obtain a cast plate with a thickness of 4 mm. The test results for this casting board are shown in Table 1. Further, the above resin liquid was mixed with N,N-dimethylformamide to form a brown transparent solution at room temperature with a concentration of 55%, and to 182 parts of this solution, 0.05 part of zinc octylate and 0.1 part of dicumyl peroxide were added as a catalyst. The mixture was added and mixed, impregnated into a glass woven fabric with a thickness of 0.2 mm, and heated and dried to form a B-stage prepreg. Electrolytic copper foil with a thickness of 35μ was layered on both sides of eight sheets of this prepreg, and the mixture was heated at a temperature of 180℃ and a pressure of 50Kg/ cm2. Lamination molding was carried out for 120 minutes, and post-curing was further carried out at 240°C for 24 hours. The test results of the obtained copper-clad laminates are shown in Table 1. Example 2 Bis(3-chloro-4-maleimidophenyl)
1 part benzoguanamine to 100 parts (0.23 mol) methane
part (0.0053 mol), triallyl isocyanurate
30 parts and 0.1 part of hydroquinone were mixed and reacted by heating at 160°C for 1 hour to obtain a prepolymer. To this prepolymer, 150 parts of a prepolymer prepared by pre-reacting 2,2-bis(4-cyanatophenyl)propane at 150°C for 1 hour was added, and after mixing at 140°C for 1 hour, it was cooled to give a brown transparent viscosity of 12,000 PS ( A resin liquid was obtained at a temperature of 30°C. A casting plate was obtained in the same manner as in Example 1 except that this resin liquid was used. The test results for this casting board are shown in Table 1. Further, a copper-clad laminate was obtained and tested in the same manner as in Example 1, except that the above resin liquid was mixed with N,N-dimethylformamide to form a brown transparent solution at room temperature with a concentration of 55%. The test results are shown in Table 1. Comparative Example 1 A preliminary reaction similar to Example 1 was attempted except that triallyl isocyanurate was not used. but,
A homogeneous reaction solution could not be obtained at a reaction temperature of 145°C, so when the reaction temperature was increased to 160°C, gelation occurred after 15 minutes, making it impossible to obtain a prepolymer. Comparative Example 2 The same method as in Example 1 was attempted except that bis(4-aminophenyl)methane was not used. At a pre-reaction temperature of 145°C, rapid gelation occurred after 45 minutes, so the pre-reaction temperature was set to 120°C and a heating reaction was carried out for 2 hours. After the preliminary reaction, 2,2-
Bis(4-cyanatophenyl)propane at 150℃
After adding 67 parts of prepolymer pre-reacted for 1 hour at 120 DEG C. and mixing for 1 hour, the mixture was cooled to give a yellowish brown, opaque paste-like resin that was close to a solid state. Comparative Example 3 100 parts of bis(4-maleimidophenyl)methane, 67 parts of 2,2-bis(4-cyanatophenyl)propane and 20 parts of triallylisocyanurate were mixed, reacted by heating at 145°C for 2 hours, and cooled. A yellow-brown opaque resin liquid with a viscosity of 31,000 PS (30°C) was obtained. A cast plate and a copper-clad laminate were obtained in the same manner except that this resin liquid was used. In the case of making a varnish, since the resin liquid is non-uniform, it is necessary to stir and mix the resin liquid and impregnate it immediately when impregnating the glass woven fabric. The test results are shown in Table 1. Comparative Example 4 In Example 1, 2,2-bis(4-cyanatophenyl) was prepared without pre-reacting the mixture of bis(4-maleimidophenyl)methane, bis(4-aminophenyl)methane and triallylisocyanurate. Propane pre-reacted at 150°C for 1 hour was added and mixed at 120°C for 1 hour, but the resin liquid did not become homogeneous and transparent, and a large amount of bis(4-maleimidophenyl)methane was precipitated into an almost solid state. It became a mixture of shapes. A cast plate was obtained using this mixture in the same manner as in Example 1, except that the casting temperature was 120° C. under heating.
The results are shown in Table 1. In addition, an attempt was made to produce prepreg in the same manner as in Example 1, but only a very non-uniform varnish was obtained.
Moreover, due to this non-uniformity, the flow was abnormally large, making it impossible to produce a good prepreg. 【table】
Claims (1)
有する多官能性マレイミド、トリアルケニルイ
ソシアヌレートおよび多官能性アミンを加熱反
応させてなるプレポリマーと B 分子中にシアナト基を2個以上含有する多官
能性シアン酸エステル、該シアン酸エステルプ
レポリマー或いは該シアン酸エステルとアミン
とのプレポリマーとを必須成分としてなる硬化
性樹脂組成物[Scope of Claims] 1. A. A prepolymer obtained by heat-reacting a polyfunctional maleimide, trialkenyl isocyanurate, and a polyfunctional amine containing two or more N-maleimide groups in the molecule, and B. A cyanato group in the molecule. A curable resin composition comprising as an essential component a polyfunctional cyanate ester containing two or more of the above, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4021784A JPS60184520A (en) | 1984-03-02 | 1984-03-02 | Heat-resistant resin composition |
| US06/706,981 US4585855A (en) | 1984-03-02 | 1985-02-28 | Process for producing curable resin composition from cyanate ester and maleimide/diamine reaction product |
| DE19853507609 DE3507609A1 (en) | 1984-03-02 | 1985-03-04 | METHOD FOR PRODUCING CURABLE RESIN MATERIALS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4021784A JPS60184520A (en) | 1984-03-02 | 1984-03-02 | Heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60184520A JPS60184520A (en) | 1985-09-20 |
| JPH0352769B2 true JPH0352769B2 (en) | 1991-08-13 |
Family
ID=12574604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4021784A Granted JPS60184520A (en) | 1984-03-02 | 1984-03-02 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60184520A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4968044B2 (en) * | 2007-12-19 | 2012-07-04 | 日立化成工業株式会社 | Method for producing polyimide compound, thermosetting resin composition, and prepreg and laminate using the same |
-
1984
- 1984-03-02 JP JP4021784A patent/JPS60184520A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60184520A (en) | 1985-09-20 |
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