JPH0353503Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of the one-piece IC carrier proposed in US Pat. No. 3,529,277.

As shown in FIG. 1, the above prior patent includes a first base plate 1 and a second base plate 2 juxtaposed on the same plane, and both ends of the opposing front edges of the first and second base plates 1 and 2 are arranged side by side on the same plane. 1st
The frame piece 3 and the second frame piece 4 are connected, and a window 5 is defined in the center by the first and second base plates 1 and 2 and the first and second frame pieces 3 and 4. 1. By arranging a large number of long grooves 6 that reach the windows 5 on the surfaces of the second base plates 1 and 2, the IC package body 7 is accommodated within the window 5, and the first and second IC package bodies are Base plate 1,
Each of the leads 8 protruding toward the surface of the first
A first elastic latch arm 9 and a second elastic latch arm 10 are extended along the inner sides of the frame piece 3 and the second frame piece 4, and the base ends of the first and second elastic latch arms 9, 10 are connected to the first or second elastic latch arms 10, respectively. The two base plates 1 and 2 are directly connected to the opposite ends of their front edges to form a cantilevered structure, and the first and second elastic latch arms 9 and 10 are elastically displaced inward and outward using the directly connected portions as fulcrums. Latch portions 11 and 12 provided at the free ends are adapted to engage and disengage from the IC package.

This IC carrier is a typical one-piece type,
In addition to being able to form a thin shape, the first and second elastic latch arms 9 and 10 are arranged using the space along the first and second frame pieces 3 and 4 where the IC leads do not protrude in parallel, so the IC leads can be arranged in parallel. It is easier to manufacture than U.S. Patent No. 3,652,974, which has a latch bar on the protruding side, and it is not necessary to insert a latch part between IC leads as in the same patent, so it is also suitable for miniaturizing the lead pitch. It has the advantage that the latch can be made larger and stronger.

However, as mentioned above, the above IC carrier is
Since the second elastic latch arms 9 and 10 are configured to extend straight along the insides of the first and second frame pieces 3 and 4 and are directly connected to the front edge ends of the first and second base plates 1 and 2,
When the latch arms 9 and 10 are elastically displaced inward and outward, a direct bending load is applied to the joint interface, causing deterioration and deformation due to repeated attachment and detachment of the IC package.
There is a risk that the springiness will be attenuated and the holding force will be weakened.

In addition, since the joint is used as a fulcrum and the arm is extended linearly and elastically displaced from there, it has poor bending elasticity (restoring elasticity) and has a so-called hard elasticity, which has the disadvantage of requiring a relatively large force to attach and detach the IC package cage. be.

Therefore, the present invention aims to improve the above-mentioned drawbacks while making full use of the features of the prior patent.The present invention aims to improve the above-mentioned drawbacks by making use of the elbow portions 13, 14 in which the proximal ends of the first elastic latch arm 9 and the second elastic latch arm 10 are bent into arcuate shapes. The structure is such that they are connected to the first frame piece 3 and the second frame piece 4, respectively, via.

That is, in the present invention, the first base plates 1 are arranged side by side on the same plane.
and the opposite ends of the front edges of the second base plate 2 are connected to the first frame piece 3
and a second frame piece 4, a window 5 is defined in the center by the first and second frame pieces 3 and 4 and the first and second base plates 1 and 2, and an IC is connected to the window 5. The main body 7 of the IC package is accommodated, and the first and second
In an IC carrier configured such that each lead 8 protruding on the base plates 1 and 2 is housed in a long groove 6 formed in parallel on the surface of each base plate, the second frame piece 3 and the second
A first elastic latch arm 9 and a second elastic latch arm 10 extend along the inside of the frame piece 4, and
Elastic latch arm 9 and second elastic latch arm 10
Elbow parts 13 and 14 are formed by bending the base ends into an arc shape, respectively, and are connected to the respective ends of the first frame piece 3 and the second frame piece 4 via the elbow parts 13 and 14, The above-mentioned first and second
The structure is such that elastic displacement necessary for engaging and disengaging the elastic latch arms 9 and 10 from the IC package is obtained.

The latch portions 11 and 12 are preferably provided at the free ends of the first and second resilient latch arms 9 and 10, respectively, as shown, and each latch arm 9 and 10 has an IC package adjacent to the latch portions 11 and 12. Support pieces 15 and 16 arranged on the center line of the main body 7
are provided so that the bottom surface of the main body can be supported by the supporting pieces 15 and 16 while the main body 7 is held by the latch parts 11 and 12.

In the present invention, as in the embodiment, the first elastic latch arm 9 is connected to the end of the first frame piece 3 on the first base plate 1 side via the elbow part 13, and the second elastic latch arm 1 is connected to the end of the first frame piece 3 on the first base plate 1 side.
0 is connected to the end of the second frame piece 4 on the second base plate 2 side via the elbow part 14 and extends in opposite directions, and
Elbow parts 13 and 1 are provided at the ends of the second frame pieces 3 and 4 on the same side.
This includes the case of connecting via 4. Also, the latch part 11,
12 is configured to engage with the lead base of the IC package body 7 as shown in the figure, and also to engage and hold the edge of the IC package body 7.

As explained above, according to the present invention, the first and second elastic latch arms for the purpose of holding the IC package are extended along the inside of the first and second frame pieces, and the proximal ends of each latch arm are shaped into an arcuate shape. When connected to the ends of the first and second frame pieces through bent elbows,
The first and second elastic latch arms can be elastically displaced inward and outward using the arc-shaped bent portion of the elbow portion as a fulcrum, and no large bending load is applied to the joint interface between each elbow portion and the first and second frame pieces. Therefore, there is no risk of deterioration or deformation in the joint, and the holding function can be properly maintained even if the IC package is repeatedly attached and detached.

In addition, each latch arm can be elastically displaced using a small external force using the bending part of each elbow part as a fulcrum, so the IC package cage can be easily attached and detached.
It has the advantage of being highly elastic and can hold the IC package securely, compared to the conventional one-piece type.
To effectively solve the shortcomings of IC carriers.

[Brief explanation of the drawing]

Figure 1 shows a conventional one-piece IC carrier.
Fig. 2 is a perspective view of the one-piece IC carrier according to the present invention as seen from the front side, Fig. 3 is a perspective view of the same as seen from the bottom side, and Fig. 4 is the same plane. FIG. 5 is a bottom view of the same. 1...First base plate, 2...Second base plate, 3...First base plate
Frame piece, 4... Second frame piece, 5... Window, 6... Long groove for housing leads, 7... IC package body, 8...
...Lead, 9...First elastic latch arm, 10...
...Second elastic latch arm, 11, 12... Latch portion, 13, 14... Elbow portion.

Claims (1)

[Scope of utility model registration request] Both ends of the opposing front edges of the first base plate and the second base plate, which are arranged side by side on the same plane, are connected by the first frame piece and the second frame piece, respectively, and the first and second frame pieces and the first frame piece are connected in the center part. , and a second base plate to define a window, the main body of the IC package is accommodated in the window, and each lead protruding from the IC package body onto the first and second base plates is connected to the surface of each base plate. In the IC carrier configured to be housed in long grooves arranged in parallel with each other, a first elastic latch arm and a second elastic latch arm are respectively extended along the inner sides of the first frame piece and the second frame piece. The base ends of the first elastic latch arm and the second elastic latch arm are respectively connected to the respective ends of the first frame piece and the second frame piece through arc-shaped bent elbow parts, and the first elastic latch arm , a one-piece IC carrier configured to obtain the elastic displacement required for engaging and disengaging the second elastic latch arm from the IC package.