JPH0353791B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] Terminals are installed in through holes, and the component body is attached to the base.By temporarily placing the off-board mounted component on the dummy side edge, the component body is placed on the printed circuit board. To reduce mounting costs by making it possible to dip solder at the same time as mounting components on a certain board.

[Industrial application field]

The present invention relates to an improvement in a method for mounting components onto a printed board.

As shown in the cross-sectional view of printed board installation in Figure 3,
The printed circuit board 2 is removably attached to the bottom plate of the base 1 in parallel using mounting screws 3.

Most of the parts mounted on the printed circuit board 2 are
This is a mounted component whose main body is placed on a printed circuit board 2 and whose terminals are attached to through holes, that is, an in-board mounted component 4.

However, in some semiconductor components, such as a three-terminal regulator, the terminal 6 is connected to the printed circuit board.
The component body 5A is a mounting component to be attached to the base 1, that is, an external mounting component 5.
There is.

Such an off-board mounted component 5 is a component body 5A.
By firmly fixing the lower surface of the base edge member 1A to the upper end surface of the base edge member 1A with machine screws 7, it is possible to thermally connect the metal base 1 with a large surface area, improving cooling efficiency. can be measured.

At this time, the components mounted outside the board 5 are replaced by the components mounted inside the board 4.
At the same time, it is desired to perform solder dipping to reduce mounting costs.

[Conventional technology]

FIGS. 4a and 4b are a side sectional view and a perspective view showing a conventional mounting process for off-board components.

Conventionally, as shown in FIG. 4a, with the terminals of the internally mounted components 4 inserted into the through holes of the printed circuit board 2, the side edges of the printed circuit board 2 are inserted into the opposing grooves of the carrier 11, and the terminals are inserted into the carrier 11. I am wearing it.

Then, the carrier 11 is lowered, and the lower surface of the printed circuit board 2 is immersed in the molten solder 10 contained in the solder tank 10A to perform a solder dip.
First, the in-board components 4 are mounted on the printed circuit board 2 by soldering. Thereafter, the carrier 11 is moved to automatically cut off the excess length of the terminal protruding from the bottom surface of the printed circuit board 2.

Next, as shown in FIG. 4b, the component body 5A is placed horizontally outside the printed board 2, and the terminal 6
into the through hole 16. In this state, the terminals 6 and the through holes 16 are manually connected by soldering, and the off-board components 5 are mounted on the printed circuit board 2. Thereafter, the extra length of the terminal 6 is manually cut off.

The reason why the mounting process for the internally mounted component 4 and the externally mounted component 5 is separated in this way is that the component body 5A of the externally mounted component 5 is mounted so as to protrude outside the printed circuit board 2. This is because the side edges of 2 cannot be held between the carriers 11.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional component mounting method, since the components mounted on the board 4 and the components mounted outside the board 5 are separate processes, the number of steps required for soldering and cutting the extra length of the terminal increases, resulting in high mounting costs. There's a problem.

[Means for solving problems]

According to the present invention, the printed circuit board 2 has a frame area surrounded by at least two part lines 12 that can be bent and separated, and an outside part of the parts line, which indicates the mounting range of the parts 4 mounted on the board. Dummy side edge 13 for placing off-board components on
the dummy side edge has a width that allows the mounting outer end of the off-board mounting component 5 to be positioned within the board;
The component mounted on the board 4 is placed and fixed with the terminal inside the frame inserted into the through hole 16, and the component mounted outside the board 5 is mounted and fixed with the terminal inserted into the through hole 1 inside the frame.
6 and placed on the dummy side edge so that its mounting hole matches the hole provided on the dummy side edge corresponding to the position where it should be installed outside the air plate, and the back side of the printed circuit board is soldered. This is achieved by a method of mounting parts on a printed board, which is characterized in that after being dipped, the dummy side edge is separated at a parts line.

[Effect]

According to the means of the present invention, on the outside of the frame-shaped parts line 12, the mounting end of the component body of the off-board mounted component 5 is provided with a rectangular dummy side edge having a width sufficient to fit within the board. Since the portion 13 is provided, the terminal 6 can be inserted into the through hole 16 and the component body 5A can be positioned on the dummy side edge portion 13 so as to match the mounting position, and the printed circuit board 2 can be placed in the carrier. It becomes possible to hold the

Therefore, the components 5 to be mounted outside the board can be soldered-dipped at the same time as the components 4 to be mounted inside the board, and the excess lengths of the terminals can also be automatically cut, thereby reducing mounting costs.

〔Example〕

The present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a perspective view of essential parts of another embodiment.

In FIG. 1, a printed circuit board 2 is provided with a frame-shaped part line 12 parallel to each of its four sides, such as a perforation or a V-groove, which can be cut by bending by hand. is the area within the frame that is the mounting range of components mounted on the board.

Outside this parts line 12, a rectangular dummy side edge 13 having a width such that the mounting outer end of the component body 5A of the off-board mounted component 5 is inside the board.
is formed.

The internally mounted components 4 have their respective terminals inserted into through holes at desired locations within the frame of the parts line 12, and the externally mounted components 5 have their terminals inserted so that the lower surface of the component body 5A is placed on the dummy side edge 13. The terminal 6 is inserted into the through hole 16.

Note that a pin 17 passes through a hole provided in the component body 5A and a hole provided in the dummy side edge 13 for fixing the component body 5A to the base with a machine screw (machine screw 7 shown in FIG. 3). is used to prevent the off-board mounted components 5 from shifting. In this case, the position of the hole in the dummy side edge is determined to correspond to the position of the hole fixed with the screw 7 of the base 1 shown in FIG.

After placing the internally mounted components 4 and the externally mounted components 5 on the printed circuit board 2 in this manner, the side edges of the opposing dummy side edges 13 and the carrier clamping side edge 14 portion shown by the diagonal shaded line in the figure are The printed circuit board 2 is inserted into the groove of the carrier and attached to the carrier.

Then, the printed circuit board 2 is soldered-dipped, and the terminals of the internally mounted components 4 and the terminals 6 of the externally mounted components 5 are simultaneously soldered and connected to their respective through-hole portions. Subsequently, the excess length of the terminal protruding from the lower surface of the printed circuit board 2 is automatically cut off.

As described above, after mounting the internally mounted components 4 and the externally mounted components 5 on the printed circuit board 2 at the same time, the externally mounted components are removed by the dummy side edges 13, the dummy side edges are bent, and the parts line is removed. Separate into 12 pieces.

The component mounting method shown in FIG. 2 is an embodiment in which the off-board mounting component 5 is mounted so that the lower surface of the component main body 5A is located above the surface of the printed circuit board 2.

In such a case, the component main body 5A and the dummy side edge 13 are brought into close contact with each other via a spacer 15 of a desired thickness, and the pin 17 is used to prevent displacement.

Thereafter, the internally mounted components 4 and the externally mounted components 5 are simultaneously mounted on the printed circuit board 2 by the same procedure as explained in FIG.

〔Effect of the invention〕

As explained above, the present invention mounts the components mounted outside the board on the printed circuit board at the same time as the components mounted inside the board by placing the component body of the components mounted outside the board on the dummy side edge that can be easily separated by hand. This has the excellent effect of reducing the man-hours required for soldering dips, the man-hours required for cutting the excess terminal length, and the mounting cost.

[Brief explanation of drawings]

Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a perspective view of main parts of another embodiment, Fig. 3 is a sectional view of a printed board installed, and Figs. FIG. 3 is a perspective view showing a mounting process of mounting components. In the figure, 1 is the base, 2 is the printed circuit board, 4
is a component mounted inside the board, 5 is a component mounted outside the board, 5A is the component body, 6 is a terminal, 12 is a parts line, 13
indicates a dummy side edge, and 16 indicates a through hole.

Claims (1)

[Claims] 1 The printed circuit board 2 has an inner part surrounded by at least two bendable and separable part lines 12, which indicate the mounting range of the parts 4 mounted on the board, and an outer part mounted outside the parts lines. It has a dummy side edge 13 for placing a component, and the dummy side edge has a width that allows the mounting outer end of the outer board mounting component 5 to be located inside the board, and a width that allows the mounting outer end of the outer board mounting component 5 to be positioned inside the board. The component 4 is mounted and fixed in the frame with the terminal inserted into the through hole 16, and the component 5 mounted outside the board has the terminal inserted into the through hole 16 of the component inside the frame, and its mounting hole is inserted into the through hole 16 of the component inside the frame. To match the hole provided on the dummy side edge corresponding to the position where it should be installed outside,
A method for mounting components on a printed circuit board, characterized in that the printed circuit board is placed on a dummy side edge, the back side of the printed circuit board is solder-dipped, and then the dummy side edge is separated at a parts line.