JPH0353832U - - Google Patents
Info
- Publication number
- JPH0353832U JPH0353832U JP11446289U JP11446289U JPH0353832U JP H0353832 U JPH0353832 U JP H0353832U JP 11446289 U JP11446289 U JP 11446289U JP 11446289 U JP11446289 U JP 11446289U JP H0353832 U JPH0353832 U JP H0353832U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- heating
- cooling
- cooling means
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Description
第１図は本実施例に係るホツトプレート式オー
ブンを示す構成図、第２図は本実施例に係るウエ
ハの搬送機構の一例を示す斜視図、第３図は本実
施例に係るウエハの待機状態を示す説明図、第４
図は本実施例の他の例を示す構成図、第５図は従
来のホトリソグラフイ工程を示すブロツク図、第
６図は従来例に係るキヤリヤの一例を示す斜視図
である。
Ａ……ホツトプレート式オーブン、１……ホツ
トプレート、２……ウエハ、３……カバー、４…
…ヒータ、５……ウエハ収容空間、８……溝、９
……ワイヤ、１０……クーリングプレート、１１
……ウエハ昇降ピンである。
FIG. 1 is a configuration diagram showing a hot plate type oven according to this embodiment, FIG. 2 is a perspective view showing an example of a wafer transfer mechanism according to this embodiment, and FIG. 3 is a wafer standby according to this embodiment. Explanatory diagram showing the state, No. 4
5 is a block diagram showing a conventional photolithography process, and FIG. 6 is a perspective view showing an example of a carrier according to the conventional example. A... Hot plate type oven, 1... Hot plate, 2... Wafer, 3... Cover, 4...
...Heater, 5...Wafer storage space, 8...Groove, 9
... Wire, 10 ... Cooling plate, 11
...This is a wafer lifting pin.
Claims (1)
置において、 加熱手段、冷却手段及び移送手段を備え、上記
加熱手段と上記冷却手段が対向するように配置し
、上記移送手段によりウエハを上記加熱手段と上
記冷却手段間で移送自在にしたことを特徴とする
ウエハ加熱装置。[Claims for Utility Model Registration] A wafer heating device used for manufacturing semiconductor devices, etc., comprising a heating means, a cooling means, and a transfer means, the heating means and the cooling means being arranged to face each other, and the transfer means A wafer heating apparatus characterized in that the wafer can be freely transferred between the heating means and the cooling means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11446289U JPH0353832U (en) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11446289U JPH0353832U (en) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353832U true JPH0353832U (en) | 1991-05-24 |
Family
ID=31662830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11446289U Pending JPH0353832U (en) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353832U (en) |
-
1989
- 1989-09-29 JP JP11446289U patent/JPH0353832U/ja active Pending
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