JPH0353839U - - Google Patents

Info

Publication number
JPH0353839U
JPH0353839U JP1989115549U JP11554989U JPH0353839U JP H0353839 U JPH0353839 U JP H0353839U JP 1989115549 U JP1989115549 U JP 1989115549U JP 11554989 U JP11554989 U JP 11554989U JP H0353839 U JPH0353839 U JP H0353839U
Authority
JP
Japan
Prior art keywords
resin
lead frame
pellet
supplied
closed container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115549U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115549U priority Critical patent/JPH0353839U/ja
Publication of JPH0353839U publication Critical patent/JPH0353839U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る樹脂加熱装置
の一部破断分解斜視図、第２図及び第３図は第１
図−線に沿つた要部断面図であり、第２図は
加圧状態を示し、第３図は減圧状態を示している
。第４図は従来の樹脂加熱装置の概略説明図であ
る。 １……リードフレーム、２……ペレツトマウン
ト部、３……樹脂、４……半導体ペレツト、１０
……密閉容器、２０……加圧部。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームのペレツトマウント部に供給さ
    れた樹脂を加熱硬化させて半導体ペレツトをダイ
    ボンデイングするための樹脂硬化装置であつて、 上記ペレツトマウント部に供給された樹脂上に
    半導体ペレツトを載置したリードフレームを収容
    する密閉容器と、該密閉容器内を加圧するための
    加圧部とを有することを特徴とする樹脂硬化装置
    。
JP1989115549U 1989-09-29 1989-09-29 Pending JPH0353839U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115549U JPH0353839U (ja) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115549U JPH0353839U (ja) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353839U true JPH0353839U (ja) 1991-05-24

Family

ID=31663876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115549U Pending JPH0353839U (ja) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353839U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098608A (ja) * 2006-09-15 2008-04-24 Lintec Corp 半導体装置の製造方法
JP2009135309A (ja) * 2007-11-30 2009-06-18 Lintec Corp 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098608A (ja) * 2006-09-15 2008-04-24 Lintec Corp 半導体装置の製造方法
JP2009135309A (ja) * 2007-11-30 2009-06-18 Lintec Corp 半導体装置の製造方法

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