JPH0353852U - - Google Patents

Info

Publication number
JPH0353852U
JPH0353852U JP1989115318U JP11531889U JPH0353852U JP H0353852 U JPH0353852 U JP H0353852U JP 1989115318 U JP1989115318 U JP 1989115318U JP 11531889 U JP11531889 U JP 11531889U JP H0353852 U JPH0353852 U JP H0353852U
Authority
JP
Japan
Prior art keywords
heat sink
bottom plate
column
semiconductor
semiconductor case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115318U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115318U priority Critical patent/JPH0353852U/ja
Publication of JPH0353852U publication Critical patent/JPH0353852U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例に係るヒートシンク
を示す図で、aは正面図、bは平面図、第2図a
,bは従来のヒートシンクの使用状態を示す図で
ある。 1……ヒートシンク本体、2……底板、3……
支柱、4……放熱板、5……半導体ケース。
Fig. 1 is a diagram showing a heat sink according to an embodiment of the present invention, in which a is a front view, b is a plan view, and Fig. 2 a is a top view.
, b are diagrams showing how a conventional heat sink is used. 1...Heat sink body, 2...Bottom plate, 3...
Pillar, 4... Heat sink, 5... Semiconductor case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に半導体素子を搭載した半導体ケースの冷
却に使用されるヒートシンクにおいて、半導体ケ
ースの上面部に実装する底板と、底板のほぼ中央
付近に設けられ底板からの熱を伝える支柱と、支
柱を中心に固定された放熱板とを具備したしたこ
とを特徴とするヒートシンク。
In a heat sink used to cool a semiconductor case with semiconductor elements mounted inside, there is a bottom plate mounted on the top of the semiconductor case, a column installed near the center of the bottom plate that transmits heat from the bottom plate, and a column centered around the column. A heat sink characterized by comprising a fixed heat sink.
JP1989115318U 1989-09-30 1989-09-30 Pending JPH0353852U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115318U JPH0353852U (en) 1989-09-30 1989-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115318U JPH0353852U (en) 1989-09-30 1989-09-30

Publications (1)

Publication Number Publication Date
JPH0353852U true JPH0353852U (en) 1991-05-24

Family

ID=31663650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115318U Pending JPH0353852U (en) 1989-09-30 1989-09-30

Country Status (1)

Country Link
JP (1) JPH0353852U (en)

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