JPH0353865U - - Google Patents
Info
- Publication number
- JPH0353865U JPH0353865U JP11543489U JP11543489U JPH0353865U JP H0353865 U JPH0353865 U JP H0353865U JP 11543489 U JP11543489 U JP 11543489U JP 11543489 U JP11543489 U JP 11543489U JP H0353865 U JPH0353865 U JP H0353865U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- substrate
- foil
- insulating
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例の要部の正面図、
第２図は第１図の使用状態を示す正面図、第３図
は従来のフレキシブル配線板を示す構成図、第４
図は従来の接続状態を示す斜視図、第５図は第４
図の要部の断面図、第６図は従来の問題点を示す
正面図である。
０…フレキシブル配線板、１…ベースフイルム
、２ａ…２ｄ…導箔、３…カバーレイ、４…リジ
ツド配線板、５ａ…５ｄ…導箔、６…折返部、１
０…露出部、１２…幅狭部。
Figure 1 is a front view of the main parts of an embodiment of this invention.
Figure 2 is a front view showing the usage state of Figure 1, Figure 3 is a configuration diagram showing a conventional flexible wiring board, and Figure 4 is a front view showing the usage state of Figure 1.
The figure is a perspective view showing the conventional connection state, and FIG.
FIG. 6 is a sectional view of the main part of the figure, and a front view showing the problems of the prior art. 0...Flexible wiring board, 1...Base film, 2a...2d...Conducting foil, 3...Coverlay, 4...Rigid wiring board, 5a...5d...Conducting foil, 6...Folded portion, 1
0...Exposed part, 12...Narrow part.
Claims (1)
この第１の基板の長手方向に沿つて固着した箔状
の第１の導箔と、この第１の導箔の上面を絶縁の
ため被覆したカバーレイと、このカバーレイを所
定の長さで前記第１の導箔を露出した露出部と、
この露出部の所望箇所を前記第１の導箔に直交す
る方向に折り返した折返部と、絶縁性のリジツド
な第２の基板と、この第２の基板の前記第１の導
箔に対向する位置に固着した第２の導箔と、この
第２の導箔と前記折返部の前記第１の導箔を半田
により接続した接続部と、この接続部から前記第
２の導箔と対向する前記第１の導箔の幅を狭くし
た幅狭部とからなることを特徴とする接続用プリ
ント基板。 an insulating band-shaped flexible first substrate;
A first conductive foil in the form of a foil fixed along the longitudinal direction of the first substrate, a coverlay covering the upper surface of the first conductive foil for insulating purposes, and a coverlay that is attached to a predetermined length. an exposed portion where the first conductive foil is exposed;
A folded portion formed by folding back a desired part of the exposed portion in a direction perpendicular to the first conductive foil, an insulating and rigid second substrate, and a second substrate facing the first conductive foil. a second conductive foil fixed in position; a connection portion in which the second conductive foil and the first conductive foil of the folded portion are connected by solder; and a connection portion facing the second conductive foil from this connection portion; A printed circuit board for connection, characterized in that the first conductive foil has a narrow width portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543489U JPH0353865U (en) | 1989-09-30 | 1989-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543489U JPH0353865U (en) | 1989-09-30 | 1989-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353865U true JPH0353865U (en) | 1991-05-24 |
Family
ID=31663763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11543489U Pending JPH0353865U (en) | 1989-09-30 | 1989-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353865U (en) |
-
1989
- 1989-09-30 JP JP11543489U patent/JPH0353865U/ja active Pending