JPH0233473U - - Google Patents
Info
- Publication number
- JPH0233473U JPH0233473U JP11096088U JP11096088U JPH0233473U JP H0233473 U JPH0233473 U JP H0233473U JP 11096088 U JP11096088 U JP 11096088U JP 11096088 U JP11096088 U JP 11096088U JP H0233473 U JPH0233473 U JP H0233473U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pattern
- rigid
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- 239000011888 foil Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図は第１図の要部の正面図、第３図は第１図の
断面図、第４図はこの考案の他の実施例を示す正
面図、第５図は従来の正面図、第６図は第５図の
要部の正面図、第７図は第５図の断面図である。
１０……リジツドプリント基板、１２，１８…
…接続部、１３……フレキシブルプリント基板、
１６……折り返し部。
Figure 1 is a front view showing one embodiment of this invention, Figure 2 is a front view of the main parts of Figure 1, Figure 3 is a sectional view of Figure 1, and Figure 4 is another embodiment of this invention. FIG. 5 is a front view of the conventional example, FIG. 6 is a front view of the main part of FIG. 5, and FIG. 7 is a cross-sectional view of FIG. 5. 10... Rigid printed circuit board, 12, 18...
... Connection part, 13 ... Flexible printed circuit board,
16...Folding section.
Claims (1)
れた回路パターンの上面にソルダーレジストを塗
布してなるリジツドプリント基板と、このリジツ
ドプリント基板のパターンの所定箇所をソルダー
レジストを施さずに形成した第１の接続部と、帯
状のフレキジブルな絶縁基板上に導箔を固着して
形成されたパターンの上面にカバーコートを貼着
してなるフレキシブルプリント基板と、このフレ
キシブルプリント基板の少なくとも一端部分にパ
ターンを含めて平面上に折り返した折り返し部と
、この折り返し部の先端のカバーコートを剥がし
て前記パターンを露出して形成した第２の接続部
とからなり、前記第２の接続部を第１の接続部に
半田付けし、前記フレキシブルプリント基板を前
記折り返し部から前記リジツドプリント基板の反
対面に配置してなることを特徴とするフレキシブ
ルプリント基板による接続装置。 A rigid printed circuit board is made by applying a solder resist to the top surface of a circuit pattern formed by fixing a conductive foil on a rigid insulating substrate, and a rigid printed circuit board is manufactured by applying a solder resist to a predetermined part of the pattern of this rigid printed circuit board without applying a solder resist. a flexible printed circuit board formed by adhering a cover coat to the upper surface of a pattern formed by fixing a conductive foil on a band-shaped flexible insulating substrate; and at least one end of this flexible printed circuit board. It consists of a folded part that is folded back on a plane including the pattern, and a second connecting part formed by peeling off the cover coat at the tip of this folded part to expose the pattern, and the second connecting part is 1. A connecting device using a flexible printed circuit board, characterized in that the first connecting portion is soldered, and the flexible printed circuit board is disposed on the opposite side of the rigid printed circuit board from the folded portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11096088U JPH0233473U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11096088U JPH0233473U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233473U true JPH0233473U (en) | 1990-03-02 |
Family
ID=31348592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11096088U Pending JPH0233473U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233473U (en) |
-
1988
- 1988-08-24 JP JP11096088U patent/JPH0233473U/ja active Pending