JPH0354476Y2 - - Google Patents
Info
- Publication number
- JPH0354476Y2 JPH0354476Y2 JP9776486U JP9776486U JPH0354476Y2 JP H0354476 Y2 JPH0354476 Y2 JP H0354476Y2 JP 9776486 U JP9776486 U JP 9776486U JP 9776486 U JP9776486 U JP 9776486U JP H0354476 Y2 JPH0354476 Y2 JP H0354476Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- polyetherimide
- diaphragm
- polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は耐熱性、耐久性、成形加工性、接着加
工性の優れた音響機器用振動板に関するものであ
る。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a diaphragm for audio equipment that has excellent heat resistance, durability, moldability, and adhesiveness.
一般に音響機器用振動板（以下振動板と称す
る）は、長期間反復される振動に耐え得る靱性、
耐熱性、耐湿性、振巾追従性、成形加工性、接着
加工性などが要求される。
In general, diaphragms for audio equipment (hereinafter referred to as diaphragms) have the toughness to withstand repeated vibrations over long periods of time.
Heat resistance, moisture resistance, amplitude followability, moldability, adhesion processability, etc. are required.
従来、プラスチツクフイルムを成形加工してな
る音響機器用振動板には、ポリエステルフイルム
ポリカーボネートフイルムポリイミドフイルム、
芳香族ポリサルホンフイルム、ポリエーテルイミ
ドフイルム等が用いられてきた。スピーカーの場
合における駆動源であるボイスコイル近傍は駆動
時に高温となるため、振動板は十分に高温に耐え
得る耐熱性のある素材で構成させることが望まれ
る。又、振動板はボイスコイルボビン、エツヂ、
センターキヤツプとをそれぞれ接着剤を介し接着
されるため、素材は接着剤に含まれる有機溶剤、
硬化前低分子量有機物などに対する耐溶剤性が優
れていることが望まれる。しかるに、ポリエステ
ルフイルムは実用耐熱温度が70〜80℃と低く、前
述の駆動による発熱によつてヤング率（常温で
4.3×104Kg／cm2、140℃では0.8Kg／cm2）が大巾に
低下し周波数特性が低下するばかりでなく、変形
伸びに伴なうボイスコイルボビンの磁気回路の接
触による異常音の発生、ひいてはボイスコイルの
焼損等の原因となる。 Conventionally, diaphragms for audio equipment made by molding plastic films include polyester film, polycarbonate film, polyimide film,
Aromatic polysulfone films, polyetherimide films, etc. have been used. In the case of a speaker, the vicinity of the voice coil, which is the driving source, becomes high temperature during driving, so it is desirable that the diaphragm be made of a heat-resistant material that can sufficiently withstand high temperatures. In addition, the diaphragm is a voice coil bobbin,
Since the center cap and the center cap are each bonded via adhesive, the material is the organic solvent contained in the adhesive,
It is desired that the resin has excellent solvent resistance to low molecular weight organic substances before curing. However, polyester film has a low practical heat resistance temperature of 70 to 80°C, and the Young's modulus (at room temperature) decreases due to the heat generated by the drive described above.
4.3×10 4 Kg/cm 2 (0.8 Kg/cm 2 at 140°C), which not only deteriorates frequency characteristics but also causes abnormal noise due to contact of the magnetic circuit of the voice coil bobbin due to deformation and elongation. This may cause the voice coil to burn out, etc.
又、ポリカーボネートフイルムも耐熱温度が低
く、ポリエステルフイルムと同様の問題があり、
さらに耐溶剤等も劣つているためスピーカー組立
時に用いられる接着剤によりストレスクラツクが
発生し、組立接着剤が制約され実用的でない。 In addition, polycarbonate film also has a low heat resistance and has the same problem as polyester film.
Furthermore, since the speaker has poor solvent resistance, stress cracks occur due to the adhesive used when assembling the speaker, and the assembly adhesive is limited, making it impractical.
一方、芳香族ポリサルホンフイルム、ポリエー
テルイミドフイルムは、耐熱性に優れているもの
のポリカーボネートフイルム同様耐溶剤性が悪
い。 On the other hand, aromatic polysulfone films and polyetherimide films have excellent heat resistance, but like polycarbonate films, they have poor solvent resistance.
ポリイミドフイルムは耐熱性や耐溶剤性は優れ
ているが、熱硬化性樹脂であるため熱成形性が困
難でフイルムが高価である点もあいまつて工業的
実用性に乏しい。 Although polyimide film has excellent heat resistance and solvent resistance, since it is a thermosetting resin, it is difficult to thermoform, and the film is expensive, so it has poor industrial practicality.
本考案はポリエーテルイミドフイルムの耐熱
性、ヤング率の温度依存性が低い点、成形加工性
に優れた点に、又ポリエステルフイルムの耐溶剤
性及び耐久性に着目し、ポリエステルル−ポリエ
ーテルイミド−ポリエステルの三層構成の複合フ
イルムを成形加工することにより、耐熱性、耐久
性、成形加工性の優れた音響機器用振動板を得る
ことを見出したものである。
This invention focuses on the heat resistance of polyetherimide film, low temperature dependence of Young's modulus, and excellent moldability, and the solvent resistance and durability of polyester film. - It has been discovered that a diaphragm for audio equipment with excellent heat resistance, durability, and moldability can be obtained by molding a polyester composite film having a three-layer structure.
本考案は、第一層がポリエステルフイルム、第
二層がポリエーテルイミドフイルム、第三層がポ
リエステルフイルムである複合フイルムを加熱成
形して成ることを特徴とする音響機器用振動板で
ある。
The present invention is a diaphragm for audio equipment, characterized in that it is made by thermoforming a composite film in which the first layer is a polyester film, the second layer is a polyetherimide film, and the third layer is a polyester film.
本考案で用いられるポリエーテルイミドフイル
ムは、その構造単位に芳香核結合と、エーテル結
合、イミド結合を含む熱可塑性重合体をフイルム
化したものとして定義され、例えば科学構造式と
しては次の構造式から成るものが挙げられる。 The polyetherimide film used in the present invention is defined as a thermoplastic polymer film containing aromatic nuclear bonds, ether bonds, and imide bonds in its structural units.For example, its scientific structural formula is as follows: Examples include those consisting of.
一方、ポリエステルフイルムは、その構造単位
に芳香核結合とエステル結合、アルキレン鎖を含
む熱可塑性重合体をフイルム化したものとして定
義され、例えば次の構造式から成るものが挙げら
れる。 On the other hand, a polyester film is defined as a film formed from a thermoplastic polymer containing an aromatic nuclear bond, an ester bond, and an alkylene chain in its structural unit, and includes, for example, a film having the following structural formula.
本考案で用いられるポリエーテルイミドフイル
ム及びポリエステルフイルムは目的に応じ、滑
剤、耐熱安定剤、無機充填剤、顔料、染料を加え
ても良い。 Depending on the purpose, a lubricant, a heat stabilizer, an inorganic filler, a pigment, or a dye may be added to the polyetherimide film and polyester film used in the present invention.
本考案の複合フイルムの各層の厚み構成は限定
されるものではないが、好ましくはポリエステ
ル：ポリエーテルイミド：ポリエステルの各層の
厚み構成は１：１：１ないし１：10：１が好まし
い。ポリエステルフイルム層比率が低くなりすぎ
ると耐久性の点で充分でなくなり、ポリエーテル
イミドフイルム層比率が低くなりすぎると耐熱性
が不足する。又、ポリエステルフイルムとポリエ
ーテルイミドフイルムの間に接着剤を介すること
は本考案の限定するものではない。 The thickness structure of each layer of the composite film of the present invention is not limited, but preferably the thickness structure of each layer of polyester:polyetherimide:polyester is 1:1:1 to 1:10:1. If the polyester film layer ratio is too low, durability will not be sufficient, and if the polyetherimide film layer ratio is too low, heat resistance will be insufficient. Further, the use of an adhesive between the polyester film and the polyetherimide film is not a limitation of the present invention.
本考案の複合フイルムの製膜方法は、共押出
法、熱圧着法、ドライラミネート法、ポリエーテ
ルイミドを押出して得られる押出ラミ法等が用い
られる。 The method for forming the composite film of the present invention includes a coextrusion method, a thermocompression bonding method, a dry lamination method, an extrusion lamination method obtained by extruding polyetherimide, and the like.
なお、ポリエステルフイルム層は非結晶状態、
結晶状態、二軸延伸状態のいずれでも良いが、よ
り良好な物性を得るには二軸延伸状態とするのが
好ましい。 Note that the polyester film layer is in an amorphous state,
Although it may be in either a crystalline state or a biaxially stretched state, it is preferably in a biaxially stretched state to obtain better physical properties.
本考案の加熱成形は、真空成形、圧空成形、雌
雄熱成形等の一般のフイルム加熱成形で得ること
ができる。 The thermoforming of the present invention can be obtained by general film thermoforming such as vacuum forming, pressure forming, and male and female thermoforming.
本考案で得られる複合フイルムは常温でヤング
率が3.5×104Kg／cm2以上であり、140℃に於ても
2.0×104Kg／cm2と高く加熱成形して得られた振動
板は高温での周波数特性が良好で、かつ150℃雰
囲気下の寸法変化も１％以下と小さく、振動板成
形品の変形もほとんど認められなかつた。又成形
加工性も良く、雌雄熱成形も容易に行なえ、耐溶
剤性も外層がポリエステルであるため接着剤によ
る組立時のストレスクラツクも生じなかつた。
The composite film obtained by this invention has a Young's modulus of 3.5×10 4 Kg/cm 2 or more at room temperature, and even at 140℃.
The diaphragm obtained by heat forming with a high temperature of 2.0×10 4 Kg/cm 2 has good frequency characteristics at high temperatures, and the dimensional change in an atmosphere of 150℃ is small, less than 1%, and the diaphragm molded product does not deform. was hardly recognized. It also has good molding processability, can be easily thermoformed into male and female parts, has solvent resistance, and because the outer layer is made of polyester, no stress cracks occur during assembly using an adhesive.
第１図は本考案の振動板の加熱成形前のフイル
ム構成を表わす複合フイルム断面図である。第２
図は本考案の振動板を用いた音響機器の部分断面
図である。
FIG. 1 is a sectional view of a composite film showing the structure of the film before heat forming of the diaphragm of the present invention. Second
The figure is a partial sectional view of an audio device using the diaphragm of the present invention.
Claims (1)
エーテルイミドフイルム、第三層がポリエステル
フイルムである複合フイルムを加熱成形して成る
音響機器用振動板。 A diaphragm for audio equipment made by thermoforming a composite film in which the first layer is a polyester film, the second layer is a polyetherimide film, and the third layer is a polyester film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9776486U JPH0354476Y2 (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9776486U JPH0354476Y2 (en) | 1986-06-27 | 1986-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS635795U JPS635795U (en) | 1988-01-14 |
| JPH0354476Y2 true JPH0354476Y2 (en) | 1991-12-02 |
Family
ID=30965056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9776486U Expired JPH0354476Y2 (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0354476Y2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2710830B2 (en) * | 1989-07-05 | 1998-02-10 | 株式会社ケンウッド | Vibration system members for sound |
| JP3915600B2 (en) * | 2002-05-29 | 2007-05-16 | オンキヨー株式会社 | Speaker diaphragm |
| JP2008205974A (en) | 2007-02-21 | 2008-09-04 | Sony Corp | Speaker diaphragm |
| JP2011061311A (en) * | 2009-09-07 | 2011-03-24 | Minebea Co Ltd | Diaphragm for speaker, and speaker using the same |
| JP2010045863A (en) * | 2009-11-24 | 2010-02-25 | Sony Corp | Speaker diaphragm and speaker system with the same |
-
1986
- 1986-06-27 JP JP9776486U patent/JPH0354476Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS635795U (en) | 1988-01-14 |
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