JPH0354567A - Film type resist and formation of resist - Google Patents

Abstract

PURPOSE:To eliminate the need for an original film for formation of patterns and to eliminate the need for a washing process by providing a resist layer and a hot melt layer on a base and further providing a base on the hot melt layer at need. CONSTITUTION:This resist is formed by successively laminating the resist layer consisting of a UV curing type resist or the like and the hot melt layer essentially consisting of a low melting compd. on the base (A) consisting of a polyester film or the like and laminating the base (B) on the hot melt layer as well at need. For example, this resist is mounted on a thermal printer and is printed with desired circuit patterns. The base A is then peeled and the circuit patterns are formed on the base B. The base B is then superposed on a printed circuit board in such a manner that the patterns face each other. After the circuit board and the base are brought into thermal contact with each other, the base is irradiated with UV rays to cure the pattern parts; thereafter, the base B is stripped. The circuit patterns are thus formed on the circuit board.

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention... Regarding film-type resists with multilayer structure. Specifically, we will use a film-type resist that does not require a negative or positive pattern original and does not require a cleaning process. (Conventional technology) In the production of printed circuit boards, film resists and liquid resists have traditionally been used for etching and plating. For example, when using the film type resist disclosed in Japanese Patent Publication No. 50-9177, the resist in unexposed areas is removed with a developer. In Japanese Patent Publication No. 60-46414. A dry-developable film-type resist that can be exposed to light without removing the unexposed areas with a solvent has been proposed. This technique disclosed in Japanese Patent Publication No. 60-46414 breaks the unexposed portion. The technique is to remove it by peeling it off. In order to form a film resist into a roll, a cover sheet must be placed on the resist layer. However, this method had the disadvantage of a decrease in resolution due to sticking of the resist and film, called pronking, and breakage and peeling of unexposed areas. (Problems to be Solved by the Invention) The technique disclosed in Japanese Patent Publication No. 50-9177 has the problem of requiring a step of removing with a developer, while the technique disclosed in Japanese Patent Publication No. 60-46414 has the problem of blocking and There was a problem with resolution.

Also. Both techniques had process and cost problems because they required original film for pattern formation. The object of the present invention is to provide a film-type resist that eliminates the above-mentioned drawbacks. (Means for Solving the Problems) The present invention provides a resist layer on a support 1, and further includes a heat melting layer containing a low melting point compound as a main component on the resist and, if necessary, a rM melting layer on the rM melting layer. This is a film type resist with a support 2. The support 1 used in the present invention is a polyester film commonly used as a support for thermal transfer ribbons. Preferably, polyethylene film, polyamide film, polyimide film, condenser paper, etc. are used. Examples of the support 2 include polyester film, polyethylene film, polypropylene film, and condenser paper.

The resist layer provided on the support 1 is a resist that can be solidified after being applied. For example, thermosetting resins, active energy single-line curing resins, etc. can be used.

In the present invention, a resist layer is provided on the support 1, and a heat-melting layer containing a low melting point compound as a main component is provided on the resist.
Is the thermally fused layer solid at room temperature and has low adhesion to the support 2? rare. For this reason, there is almost no problem with prosoking.

Polyethylene wax is a low-melting compound that achieves the above purpose. Paraffin wax, oxidized wax, carnauba wax. Candelilla wax, an ester of long-chain alkyl fatty alcohol and acrylic or methacrylic acid. For example, oleyl alcohol, myristyl alcohol, stearyl alcohol, cetyl alcohol,
Examples include acrylic esters such as eicosanol, and methacrylic esters. The low melting point compound may be used in combination with the above resist. The proportion of the low melting point compound is the same as that of the above resist 100.
For parts by weight. It is preferably 10 to 500 parts by weight, more preferably 20 to 300 parts by weight. The film type resist of the present invention is. A resist layer is formed on the support 1, and a heat melting layer containing a low melting point compound as a main component is formed on the resist layer, and the support 2 is formed on the resist layer. Alternatively, the desired base materials are stacked and heated from the support L side using a thermal printer. By drawing a desired image and melting the hot-melt layer with the heat of the thermal printer, it is mixed with the resist layer and/or increases the adhesion to the support 2 or a desired base material. and the base material. Thereafter, the support 1 is released and the desired image is left on the support 2 or the desired base material to obtain the desired resist image. In addition,
When using support 2. Next, the desired image obtained and
For example, heat and press the print board and then attach the support 2 @
Let go. The adhesive strength between the support 2 and the mixed resist layer is. It is desirable that the adhesive strength be lower than the adhesive strength between the mixed resist layer and the desired base material, and if necessary, heating may be applied to create a difference in adhesive strength. In addition, before applying heat to the film resist of the present invention. The adhesive strength between the support 1 and the resist layer is low, as is the adhesive strength between the support 2 or the desired base material and the hot melt layer. Adhesive strength can be adjusted using compounds with unsaturated double bonds or polymers that impart film properties. This is possible by adjusting the amount of tackifier. Raw rubber is used as a tackifier. Styrene-butadiene copolymer. Styrene-butadiene-styrene copolymer. Ethylene-vinyl acetate copolymer, polybutadiene-styrene-isobrene copolymer. Polyisobutylene. Examples include polyacrylic acid and polyvinyl butyl ether. The amount of the tackifying substance is preferably 5 parts by weight to 100 parts by weight per 100 parts by weight of the paint.Heating with a thermal printer or the like is preferably performed from the support l side. This is to ensure transfer to the support 2 or a desired base material. However, in some cases,
Heating can also be done from the support 2 side. Note that in order to improve the resist properties of the resist obtained on the desired base material, the resist may be hardened by irradiation with active energy rays or by applying heat, depending on the type of resist.

Compared to normal film-type resists, there is no need for a pattern original to prepare the pattern on the printed substrate, and there is no need for a cleaning process after curing. Also. Recently, due to the use of computers, circuit patterns are increasingly being created on CRTs. An advantage of the present invention is that it can save labor by outputting from a computer to a thermal printer. In the present invention. The thickness of the resist layer on support 1 is . 10～
The range of 100 μm is good, and the thermal melting layer is 0. 1~10μ
A range of m is preferred. The film resist of the present invention is
This can be achieved by using a normal reverse type coater on the support 1. The present invention will be explained in more detail below using Examples. Example 1 On a polyester film (F-1) with a thickness of 25 μm, an ultraviolet curing resist (A1) of m strength shown below was applied using a reverse coater so that the solid content was 30 μm thick, and dried. After that, 50 parts by weight of ester of stearyl alcohol and methacrylic acid, the above ultraviolet curing resist (A
-1) 49.9 parts by weight and [-butylanthraquinone 0
．． A solvent-dispersed paint containing 1 part by weight of a low melting point compound (B-1) was coated with a reverse coater until the solid content was 2μ thick.
A polyester film (F-2) with a thickness of 25 μm, which had been coated to give a thickness of 9 m and then subjected to corona discharge treatment, was bonded to the film. The obtained multi-layered film resist is A4
It was cut to size and attached to a line-type thermal printer to print an arbitrary circuit pattern. After that, (F
-1) When the polyester film was peeled off, (F
-2) A circuit pattern was formed on the polyester film. Layer the polyester film (F-2) so that the printed circuit board and circuit pattern side face each other, heat and press, and apply ultraviolet rays (IKW) from the polyester film side.
The circuit pattern portion was cured by irradiating with a lamp of 30 cI1 for 10 seconds.

Thereafter, the polyester film (F-2) was peeled off to reveal the circuit pattern on the printed board.

Ultraviolet curing resist (A-1) Methyl methacrylate'-itaconic acid copolymer (molar ratio 1
7:1) 25 parts by weight of pentaerythritol triacrylate 7 parts by weight of Michler's ketone 0. 3 parts by weight Crystal violet 0.06 parts by weight Styrene-butadiene copolymer 5 parts by weight Methyl ethyl ketone 70 parts by weight Toluene
4 2. 6 4 parts by weight Example 2 In Example 1, instead of (B-1), 40 parts by weight of ester of ξ listyl alcohol and acrylic acid, 59.9 parts by weight of ultraviolet curing paint (A-1) and 0.6 parts by weight of Michler's ketone were added.
It was confirmed that the circuit pattern was formed on the printed circuit board in the same manner as in Example 1 except that a solvent-dispersed paint containing 1 part by weight of the low melting point compound (B-2) was used. Example 3 On a polyester film (F-1) with a thickness of 25 μm, a thermosetting resist of the composition shown below (A-2) was coated with a reverse coater so that the solid content was 30 μm thick. ．． After drying. A toluene solution of a low melting point compound (B-2) made by reacting stearic acid and hexamethylene diane at a molar ratio of 1:1 was applied using a reverse coater so that the solid content was 2 μm thick. ．． The resulting multi-layered film-type resist is cut into A4 size pieces, the side with the resist and heat-melting layer is stacked on the printed circuit board, and placed in a line-type thermal printer to print any circuit pattern. Print it. (F-1) Polyester film separated by #1. The circuit pattern was imprinted on the printed circuit board. Thermosetting resist (A-2) Ebicoat 1001 (epoxy resin manufactured by Shell Chemical Co., Ltd.) 18.3 parts by weight Dicyandiago 1.6 parts by weight Dimethylaminomethylphenol 0. 1 part by weight methyl ethyl ketone 60 parts by weight toluene
20 parts by weight Comparative Example 1 A circuit pattern was printed using a line printer in which the layer of the low melting point compound (B-1) was removed in Example 1, but (F-1)
) The polyester film of (F-2) was peeled off at an unspecified location, and no circuit pattern was visible on the polyester of (F-2).

Comparative Example 2 Using the same polyester film (F-3) as the polyester film (F-1) in place of the corona discharge treated polyester film (F-2) in Example 1,
The same procedure as in Example 1 was carried out. A circuit pattern was printed using a line printer, but when the polyester film (F-1) was peeled off, no circuit pattern was visible on the polyester film (F-3), which was not transferred at all.

Claims (3)

[Claims] 1. 1. A film type resist comprising a resist layer on a support 1, a heat melting layer containing a low melting point compound as a main component on the resist, and a support 2 on the heat melting layer if necessary. 2. A resist layer is laminated on a support 1, and a heat melting layer containing a low melting point compound as a main component and a support 2 are laminated on the resist,
Depending on the image, heat is applied from the support 1 side to support 1.
is peeled off to obtain the desired image on the support 2, and then the support 2 is peeled off.
A resist forming method characterized by overlapping an image of the above image with a desired base material, applying heat (heating), and transferring an image consisting of a resist layer and a heat-fused layer to a desired base material. 3. A resist layer is laminated on a support 1, and a heat melting layer containing a low melting point compound as a main component and a support 2 are laminated on the resist,
Resist formation characterized by transferring an image consisting of a resist layer and a heat-melting layer to a desired base material by applying heat (heating) from the support 1 side according to the image and peeling off the support 1. Method