JPH0354839B2 - - Google Patents
Info
- Publication number
- JPH0354839B2 JPH0354839B2 JP58190217A JP19021783A JPH0354839B2 JP H0354839 B2 JPH0354839 B2 JP H0354839B2 JP 58190217 A JP58190217 A JP 58190217A JP 19021783 A JP19021783 A JP 19021783A JP H0354839 B2 JPH0354839 B2 JP H0354839B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- organic
- glass substrate
- sealing
- transparent glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 60
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 239000011521 glass Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 12
- 238000001723 curing Methods 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Description
【発明の詳細な説明】
技術分野
この発明はELの製造方法に関し、より詳しく
はガラスパツケージ型有機ELの製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for manufacturing an EL, and more particularly to a method for manufacturing a glass package type organic EL.
背景技術
有機型ELは、EL素子を樹脂外皮フイルムで熱
圧着封止したものが一般的であるが、樹脂外皮フ
イルムがある程度透湿性を有するので、耐湿性に
難があり、寿命が短いという欠点があつた。BACKGROUND TECHNOLOGY Organic EL generally has an EL element sealed by thermocompression with a resin outer film, but since the resin outer film has some degree of moisture permeability, it has poor moisture resistance and a short lifespan. It was hot.
そこで、有機EL素子をガラスでパツケージし
たガラスパツケージ型ELが提案されている。第
１図はこの種ELの断面図を示す。このELは一対
の透明ガラス基板１，２間に有機EL素子３を挾
持し、この有機EL素子３の周囲をエポキシなど
の封口樹脂４で封止した構造を有する。前記有機
EL素子３は、透明ガラス基板１に形成されたI.
T.O.などの透明電極５と、発光層６と、白色反
射絶縁層７と、アルミニウムなどの背面電極８と
を順次積層した構造を有する。 Therefore, a glass package type EL, in which an organic EL element is packaged with glass, has been proposed. FIG. 1 shows a cross-sectional view of this type of EL. This EL has a structure in which an organic EL element 3 is sandwiched between a pair of transparent glass substrates 1 and 2, and the periphery of the organic EL element 3 is sealed with a sealing resin 4 such as epoxy. the organic
The EL element 3 includes an I.
It has a structure in which a transparent electrode 5 made of TO or the like, a light emitting layer 6, a white reflective insulating layer 7, and a back electrode 8 made of aluminum or the like are sequentially laminated.
このようなELは、従来のようにして製造され
ていた。第１の方法は、第２図に示すように、透
明ガラス基板１上に有機EL素子３を形成したの
ち、有機EL素子３の周囲に封口樹脂４を被着し
ておいて、上から透明ガラス基板２を押し当てて
接着し、封口樹脂４を加熱硬化せしめる方法であ
る。第２の方法は、第３図に示すように、透明ガ
ラス基板１上に有機EL素子３を形成したのち、
有機EL素子３の全面に封口樹脂４を被着してお
いて、上から透明ガラス基板２を押し当てて接着
し、封口樹脂４を加熱硬化せしめる方法である。
第３の方法は、第４図に示すように、透明ガラス
基板１上に有機EL素子３を形成したのち、この
有機EL素子３の周囲に封口樹脂４を薄く被着す
るとともに、透明ガラス基板２の周辺部にも封口
樹脂４′を被着しておいて、この透明ガラス基板
２を上から押し当て、前記封口樹脂４，４′を一
体化して両透明ガラス基板１，２を接着し、封口
樹脂４，４′を加熱硬化せしめる方法である。 Such ELs have been manufactured in a conventional manner. As shown in Fig. 2, the first method is to form an organic EL element 3 on a transparent glass substrate 1, cover the area around the organic EL element 3 with a sealing resin 4, and then apply a transparent In this method, the glass substrate 2 is pressed and bonded, and the sealing resin 4 is heated and hardened. In the second method, as shown in FIG. 3, after forming an organic EL element 3 on a transparent glass substrate 1,
In this method, a sealing resin 4 is applied to the entire surface of the organic EL element 3, a transparent glass substrate 2 is pressed and bonded from above, and the sealing resin 4 is heated and cured.
As shown in FIG. 4, the third method is to form an organic EL element 3 on a transparent glass substrate 1, apply a thin layer of sealing resin 4 around the organic EL element 3, and then attach the sealing resin 4 to the transparent glass substrate 1. A sealing resin 4' is also applied to the periphery of the transparent glass substrate 2, and this transparent glass substrate 2 is pressed from above to integrate the sealing resins 4 and 4' and bond both transparent glass substrates 1 and 2 together. This is a method of heating and curing the sealing resins 4, 4'.
ところで、上記第１〜３のいずれの方法で製造
した場合でも、寿命が顕著には延びないというこ
とが分つた。これは、透明ガラス基板１，２で有
機EL素子３を挾持し封口樹脂４で封口しても、
有機EL素子３の発光層６や白色反射絶縁層７が
吸湿している場合があり、そのような場合は外気
浸入はなく、内部湿気によつて寿命劣化を来たす
のである。また、仮に内部湿気を封止前に放出し
たとしても、封口樹脂の加熱硬化迄の間、あるい
は加熱硬化時に封口樹脂の含有水分によつて、再
び吸湿することがあり、耐湿性があまり向上しな
かつた。
By the way, it has been found that the lifespan is not significantly extended when manufactured by any of the above-mentioned methods 1 to 3. Even if the organic EL element 3 is sandwiched between the transparent glass substrates 1 and 2 and sealed with the sealing resin 4,
The light emitting layer 6 and the white reflective insulating layer 7 of the organic EL element 3 may absorb moisture, and in such a case, there is no outside air infiltration, and the internal moisture deteriorates the lifespan. Furthermore, even if the internal moisture is released before sealing, it may be absorbed again by the moisture contained in the sealing resin until it heats and hardens, or during heat curing, and the moisture resistance will not improve much. Nakatsuta.
発明の開示
〔目的〕
この発明は、耐湿性の高い長寿命のガラスパツ
ケージ型ELの製造方法を提供することを目的と
する。DISCLOSURE OF THE INVENTION [Objective] The object of the present invention is to provide a method for manufacturing a glass package type EL with high moisture resistance and long life.
この発明は透明ガラス基板上に有機EL素子を
形成する工程と、この有機EL素子を加熱して吸
蔵している水分を放散させる工程と、前記有機
EL素子の周辺部に封口樹脂を塗布して加熱硬化
する工程と、前記透明ガラス基板と他のガラス基
板の少なくとも一方に封口樹脂を塗布して両ガラ
ス基板を接着したのち封口樹脂を加熱硬化する工
程とを含むことを特徴とするものである。
This invention comprises a step of forming an organic EL element on a transparent glass substrate, a step of heating the organic EL element to dissipate occluded moisture, and a step of heating the organic EL element to release occluded moisture.
A process of applying a sealing resin to the peripheral area of the EL element and heating and curing it, and applying a sealing resin to at least one of the transparent glass substrate and another glass substrate to bond both glass substrates, and then heating and curing the sealing resin. It is characterized by including a process.
この発明は上記のように、封口前に有機EL素
子を加熱して内部吸蔵水分を放散させたのち、有
機EL素子の周辺部に封口樹脂を塗布して加熱硬
化させることにより、再び発光層などが水分を吸
着することを防止し、しかるのちに封口樹脂を介
して両ガラス基板を接着して封口樹脂を加熱硬化
するようにしたのでで、外気浸入の機会がなくな
り、耐湿性の高い長寿命のELを製造することが
できる。
As described above, this invention heats the organic EL element before sealing to dissipate the internally occluded moisture, and then applies a sealing resin to the periphery of the organic EL element and heat-cures it, thereby re-emitting the light emitting layer. After that, both glass substrates are bonded together via a sealing resin and the sealing resin is heated and cured, eliminating the chance of outside air infiltrating, resulting in a long life with high moisture resistance. EL can be manufactured.
発明を実施するための最良の形態
以下に、この発明の実施例を図面を参照して説
明する。BEST MODE FOR CARRYING OUT THE INVENTION Examples of the present invention will be described below with reference to the drawings.
第５図ないし第８図はこの発明の製造方法につ
いて説明するための各段階のELの断面図を示す。
まず、一方の透明ガラス基板１の上に有機EL素
子３を形成する（第５図）。次にこの有機EL素子
３を、後述する封口樹脂の加熱硬化温度よりも高
い温度で加熱する。例えば、封口樹脂としてエポ
キシ樹脂を用いる場合、その加熱硬化温度は130
〜150℃程度であるので、それよりも20〜30℃高
い150〜180℃で10〜30分間程度加熱乾燥して、有
機EL素子３の発光層６や白色反射絶縁層７に吸
蔵されている水分を蒸発放散せしめる。このの
ち、乾燥空気または窒素などの不活性ガス雰囲気
中で、有機EL素子３の周辺部に封口樹脂４ａの
一例として硬化条件130〜150℃で90〜60分間のエ
ポキシ樹脂を塗布し、上記と同様の雰囲気中で
130〜150℃で90〜60分間加熱して、封口樹脂４ａ
を硬化させる（第６図）。このとき、封口樹脂４
ａが仮に含水していても、封口樹脂４ａの塗布量
そのものが少ないので、封口樹脂４ａから発光層
などへ浸入する水分は無視できる。次に、前記硬
化せしめた封口樹脂４ａ上に、同様の封口樹脂４
ｂを塗布するとともに、他の透明ガラス基板２の
下面周辺部にも同様の封口樹脂４ｃを塗布する
（第７図）。そして、前記両ガラス基板１，２に塗
布した封口樹脂４ｂ，４ｃの硬化が進む前に、両
ガラス基板１，２を押し付け、両封口樹脂４ｂ，
４ｃを一体化して両ガラス基板１，２を接着し、
前記同様の雰囲気中で130〜150℃で90〜60分間程
度加熱して、封口樹脂４ｂ，４ｃを硬化せしめる
（第８図）。このとき、封口樹脂４ｂ，４ｃの量は
多く、仮にこれらの封口樹脂４ａ，４ｂが含水し
ている場合、その含水量は多いが、有機EL素子
３との間に加熱硬化済みの封口樹脂４ａが介在し
ているので、封口樹脂４ｂ，４ｃの水分が発光層
などに浸入することもない。 5 to 8 show cross-sectional views of the EL at each stage for explaining the manufacturing method of the present invention.
First, the organic EL element 3 is formed on one transparent glass substrate 1 (FIG. 5). Next, this organic EL element 3 is heated at a temperature higher than the heating curing temperature of the sealing resin, which will be described later. For example, when using epoxy resin as the sealing resin, the heating curing temperature is 130
Since the temperature is approximately 150°C, it is heated and dried at 150 to 180°C, which is 20 to 30°C higher than that temperature, for about 10 to 30 minutes, and is occluded in the light emitting layer 6 and white reflective insulating layer 7 of the organic EL element 3. Allows moisture to evaporate and dissipate. Thereafter, in an atmosphere of dry air or an inert gas such as nitrogen, an epoxy resin as an example of the sealing resin 4a is applied to the periphery of the organic EL element 3 at a curing condition of 130 to 150°C for 90 to 60 minutes. in a similar atmosphere
Heat at 130-150℃ for 90-60 minutes to seal the sealing resin 4a.
(Figure 6). At this time, the sealing resin 4
Even if the sealant a contains water, the amount of the sealing resin 4a applied is small, so the water that permeates from the sealing resin 4a into the light emitting layer etc. can be ignored. Next, a similar sealing resin 4 is placed on the cured sealing resin 4a.
At the same time, a similar sealing resin 4c is applied to the peripheral portion of the lower surface of the other transparent glass substrate 2 (FIG. 7). Then, before the sealing resins 4b, 4c applied to both the glass substrates 1, 2 are hardened, both the glass substrates 1, 2 are pressed together, and the sealing resins 4b, 4c applied to the glass substrates 1, 2 are pressed together.
4c and glue both glass substrates 1 and 2 together,
The sealing resins 4b and 4c are cured by heating at 130 to 150 DEG C. for about 90 to 60 minutes in the same atmosphere as described above (FIG. 8). At this time, the amount of the sealing resins 4b, 4c is large, and if these sealing resins 4a, 4b contain water, the water content is large, but the heat-hardened sealing resin 4a is placed between the organic EL element 3 and the sealing resin 4a, 4c. is present, so moisture in the sealing resins 4b and 4c does not infiltrate into the light emitting layer or the like.
上記の製造方法によれば、有機EL素子３を加
熱乾燥して吸蔵水分を放散させたのち、有機EL
素子３の周辺部に封口樹脂４ａを塗布してこれを
加熱硬化せしめて、再び有機EL素子３が吸湿し
ないようにしておいて、封口樹脂４ｂ，４ｃを用
いて両ガラス基１，２を接着し、封口樹脂４ｂ，
４ｃを加熱硬化させて封口するから、封止前の有
機EL素子３に吸蔵水分がなく、しかもこれを封
口樹脂４ｂ，４ｃで封口して外気水分の浸入を確
実に防止でき、耐湿性の高い長寿命のELを提供
できる。 According to the above manufacturing method, after heating and drying the organic EL element 3 to dissipate occluded moisture, the organic EL element 3 is
A sealing resin 4a is applied to the periphery of the element 3 and cured by heating to prevent the organic EL element 3 from absorbing moisture again, and both glass substrates 1 and 2 are bonded together using sealing resins 4b and 4c. and sealing resin 4b,
Since the organic EL element 3 is heat-cured and sealed, there is no occluded moisture in the organic EL element 3 before sealing, and by sealing it with the sealing resins 4b and 4c, it is possible to reliably prevent moisture from entering from outside air, resulting in high moisture resistance. Can provide long-life EL.
第９図は50℃−90％RHの恒温恒湿槽内で1KHz
−100Vrmsで点灯した場合の点灯時間対輝度特
性図で、曲線Ａは上記したこの発明により製造し
たEL、曲線Ｂは有機EL素子３の加熱乾燥および
封口樹脂４ａの加熱硬化を行なうことなく、封口
樹脂４ｂ，４ｃのみを加熱硬化したEL、曲線Ｃ
は有機EL素子３の加熱乾燥および封口樹脂４ａ
の加熱硬化を行なうことなく、しかも封口樹脂４
ｂ，４ｃを加熱硬化していないELの特性を示す。
これらの曲線Ａ〜Ｃの比較により、この発明によ
り製造したELの特性が最も優れていることが分
る。 Figure 9 shows 1KHz in a constant temperature and humidity chamber at 50℃-90%RH.
In the lighting time vs. brightness characteristic diagram when lighting at -100Vrms, curve A is the EL manufactured according to the above-mentioned invention, and curve B is the EL produced by sealing without heat drying the organic EL element 3 or heat curing the sealing resin 4a. EL, curve C, where only resins 4b and 4c were heated and cured
is heating drying of organic EL element 3 and sealing resin 4a
Without heat curing, the sealing resin 4
Figures b and 4c show the characteristics of EL without heat curing.
A comparison of these curves A to C shows that the EL produced according to the present invention has the best characteristics.
なお、上記実施例では、封口樹脂４ｂを加熱硬
化済みの封口樹脂４ａ上にのみ塗布するととも
に、透明ガラス基板２の下面周辺部にも封口樹脂
４ｃを塗布しておいて、両ガラス基板１，２を接
着する場合について説明したが、第２図と同様に
透明ガラス基板１側のみに封口樹脂を塗布して接
着してもよいし、第３図と同様に、有機EL素子
３の全面に封口樹脂を塗布して、透明ガラス基板
２の封口樹脂の塗布を省略してもよい。 In the above embodiment, the sealing resin 4b is applied only to the heat-cured sealing resin 4a, and the sealing resin 4c is also applied to the peripheral portion of the lower surface of the transparent glass substrate 2, so that both the glass substrates 1, Although we have explained the case of bonding 2, it is also possible to apply a sealing resin only to the side of the transparent glass substrate 1 and bond it as in FIG. A sealing resin may be applied and the application of the sealing resin on the transparent glass substrate 2 may be omitted.
第１図はガラスパツケージ型ELの断面図であ
る。第２図ないし第４図は従来の異なるELの製
造方法について説明するための接着前のELの分
解断面図である。第５図ないし第８図はこの発明
の一実施例のELの製造方法について説明するた
めの各段階のELの断面図である。第９図はこの
発明により製造したELおよび比較例のELの点灯
時間対輝度特性図である。
１，２……透明ガラス基板、３……有機EL素
子、４……封口樹脂、４ａ……加熱硬化済み封口
樹脂、４ｂ，４ｃ……接着用封口樹脂、Ａ……こ
の発明のEL、Ｂ，Ｃ……比較例のEL。
FIG. 1 is a cross-sectional view of a glass package type EL. FIGS. 2 to 4 are exploded cross-sectional views of the EL before bonding to explain different conventional EL manufacturing methods. 5 to 8 are cross-sectional views of an EL at each stage for explaining a method of manufacturing an EL according to an embodiment of the present invention. FIG. 9 is a lighting time vs. luminance characteristic diagram of the EL manufactured according to the present invention and the EL of a comparative example. 1, 2...Transparent glass substrate, 3...Organic EL element, 4...Sealing resin, 4a...Heat-cured sealing resin, 4b, 4c...Adhesive sealing resin, A...EL of this invention, B , C...EL of comparative example.
Claims (1)
程と、 前記有機EL素子を加熱して吸蔵している水分
を蒸発放散させる工程と、 前記有機EL素子の周辺部に封口樹脂を塗布し
て加熱硬化する工程と、 前記透明ガラス基板と他のガラス基板の少なく
とも一方に封口樹脂を塗布して両ガラス基板を接
着したのち封口樹脂を加熱硬化する工程とを含む
ELの製造方法。[Scope of Claims] 1. A step of forming an organic EL element on a transparent glass substrate, a step of heating the organic EL element to evaporate occluded moisture, and applying a sealing resin around the periphery of the organic EL element. and a step of applying a sealing resin to at least one of the transparent glass substrate and another glass substrate, bonding both glass substrates, and then heating and curing the sealing resin.
EL manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58190217A JPS6081797A (en) | 1983-10-11 | 1983-10-11 | Method of producing el |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58190217A JPS6081797A (en) | 1983-10-11 | 1983-10-11 | Method of producing el |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6081797A JPS6081797A (en) | 1985-05-09 |
| JPH0354839B2 true JPH0354839B2 (en) | 1991-08-21 |
Family
ID=16254415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58190217A Granted JPS6081797A (en) | 1983-10-11 | 1983-10-11 | Method of producing el |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6081797A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121167A (en) | 1997-10-16 | 1999-04-30 | Tdk Corp | Organic EL device |
| JP3278611B2 (en) | 1998-05-18 | 2002-04-30 | 日本電気株式会社 | Organic EL element sealing method |
-
1983
- 1983-10-11 JP JP58190217A patent/JPS6081797A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6081797A (en) | 1985-05-09 |
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