JPH0354850B2 - - Google Patents
Info
- Publication number
- JPH0354850B2 JPH0354850B2 JP17668084A JP17668084A JPH0354850B2 JP H0354850 B2 JPH0354850 B2 JP H0354850B2 JP 17668084 A JP17668084 A JP 17668084A JP 17668084 A JP17668084 A JP 17668084A JP H0354850 B2 JPH0354850 B2 JP H0354850B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- vacuum container
- discharge
- processing
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 9
- 238000009832 plasma treatment Methods 0.000 claims description 5
- 238000003672 processing method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17668084A JPS6154627A (ja) | 1984-08-27 | 1984-08-27 | プラズマ処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17668084A JPS6154627A (ja) | 1984-08-27 | 1984-08-27 | プラズマ処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6154627A JPS6154627A (ja) | 1986-03-18 |
| JPH0354850B2 true JPH0354850B2 (cs) | 1991-08-21 |
Family
ID=16017841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17668084A Granted JPS6154627A (ja) | 1984-08-27 | 1984-08-27 | プラズマ処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6154627A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812855B2 (ja) * | 1986-09-10 | 1996-02-07 | 株式会社日立製作所 | エツチング装置の圧力制御方法および装置 |
| AU2010302301B2 (en) * | 2009-09-30 | 2015-05-07 | Koninklijke Philips Electronics N.V. | Gas concentration arrangement |
| JP2023178190A (ja) * | 2022-06-03 | 2023-12-14 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法、圧力弁制御装置、圧力弁制御方法及び圧力調整システム |
-
1984
- 1984-08-27 JP JP17668084A patent/JPS6154627A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6154627A (ja) | 1986-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |