JPH0354875B2 - - Google Patents
Info
- Publication number
- JPH0354875B2 JPH0354875B2 JP59115263A JP11526384A JPH0354875B2 JP H0354875 B2 JPH0354875 B2 JP H0354875B2 JP 59115263 A JP59115263 A JP 59115263A JP 11526384 A JP11526384 A JP 11526384A JP H0354875 B2 JPH0354875 B2 JP H0354875B2
- Authority
- JP
- Japan
- Prior art keywords
- layer material
- fluorocarbon resin
- inner layer
- printed wiring
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機等に用い
られる多層プリント配線板に関するものである。
〔背景技術〕
従来、多層プリント配線板は回路を形成した内
層材の上面及び又は下面にエポキシ樹脂、フエノ
ール樹脂、不飽和ポリエステル樹脂等の熱硬化性
樹脂をガラス布、ガラス不織布、紙、ガラスペー
パー等の基材に含浸させた樹脂含浸基材を所要枚
数配設してから片面金属張積層板や金属箔等の外
層材を配設、一体化して得られるものであるが、
高周波特性、寸法安定性、ドリル開孔時の耐スミ
アー性、熱時ピール性が悪いという問題があつ
た。
〔発明の目的〕
本発明の目的とするところは高周波特性、寸法
安定性、ドリル開孔時の耐スミアー性、熱時ピー
ル性に優れた多層プリント配線板を提供すること
にある。
〔発明の開示〕
本発明は回路を有する内層材の上面及び又は下
面に、所要枚数の接着用フツ素樹脂層を介して外
層材を配設又は、更に内層材を配設後、所要枚数
の接着用フツ素系樹脂層を介することを所要回数
反復して外層材を配設、一体化してなる多層プリ
ント配線板に於て、フツ素系樹脂フイルムが外側
になるようフツ素系樹脂フイルムとフツ素系樹脂
含浸基材とを交互に組合せた接着用フツ素系樹脂
層を用いたことを特徴とする多層プリント配線板
のため、フツ素系樹脂の優れた高周波特性を活用
でき、又熱可塑性であるため寸法安定性が向上し
且つフツ素系樹脂の優れた耐熱性を活用し耐スミ
アー性、熱時ピール性を改良することができたも
ので、以下本発明を詳しく説明する。
本発明に用いる回路を有する内層材としては、
片面回路内層材、両面回路内層材の各れをも用い
ることができ、更に内層材の回路形成側に所要枚
数の接着用フツ素系樹脂層を介して回路形成した
内層材を配設することにより更に多層のプリント
配線板とすることもできるものである。接着用フ
ツ素系樹脂層のフツ素系樹脂としては、四フツ化
エチレン樹脂、四フツ化エチレンパーフルオロビ
ニルエーテル共重合体、四フツ化エチレン六フツ
化プロピレン共重合体、四フツ化エチレンエチレ
ン共重合体等のフツ素系樹脂全般を用いることが
でき、基材としてはガラス、アスベスト等の無機
繊維やポリエステル、ポリアミド、ポリビニルア
ルコール、ポリアクリル等の有機合成繊維や木綿
等の天然繊維からなる織布、不織布、マツト、寒
冷紗或は紙又はこれらの組合せ基材等であるが好
ましくは寸法安定性に優れたガラス布を用いるこ
とが望ましい。接着用フツ素系樹脂層としてはフ
ツ素系樹脂フイルムが外側になるようフツ素系樹
脂フイルムとフツ素系樹脂含浸基材とを交互に組
合せたものであることが必要である。かくするこ
とにより内層回路の信頼性を維持した上で気泡残
留のない層間接着性のよい多層プリント配線板を
得ることができるものである。
外層材としては片面金属張積層板や銅、アルミ
ニウム、ステンレス鋼、真鍮、鉄、ニツケル等の
単独又は合金からなる金属箔を用いるものであ
る。一体化手段についても特に限定するものでは
ないが好ましくは積層加熱加圧方法によることが
望ましいことである。
以下本発明を実施例にもとづいて説明する。
実施例
両面に回路を形成した厚さ0.8mmのフツ素樹脂
ガラス積層板からなる内層材の上、下面に、厚さ
0.035mmの四フツ化エチレン樹脂（ダイキン工業
株式会社製、商品名ポリフロン）フイルム３枚の
各フイルム間に厚さ0.1mmの四フツ化エチレン樹
脂（ダイキン工業株式会社製、商品名ポリフロ
ン）含浸ガラス布１枚を夫々挿入した接着用フツ
素系樹脂層を介して厚さ0.018mmの銅箔を夫々配
設した積層体を380℃、30Kg／cm2で50分間積層加
熱成形して多層プリント配線板を得た。
従来例
実施例と同じ内層材の上、下面に厚さ0.11mmの
エポキシ樹脂含浸ガラス布３枚を夫々介して厚さ
0.035mmの銅箔を配設した積層材を170℃、50Kg／
cm2で90分間積層加熱成形して多層プリント配線板
を得た。
〔発明の効果〕
実施例及び従来例の多層プリント配線板の高周
波特性、寸法安定性、耐スミアー性、熱時ピール
性は第１表で明白なように本発明の多層プリント
配線板の性能はよく、本発明の優れていることを
確認した。
【表】DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a multilayer printed wiring board used in electrical equipment, electronic equipment, computers, etc. [Background technology] Conventionally, multilayer printed wiring boards have been manufactured using thermosetting resins such as epoxy resin, phenolic resin, and unsaturated polyester resin on the upper and/or lower surfaces of inner layer materials on which circuits are formed. It is obtained by disposing the required number of resin-impregnated base materials such as resin-impregnated base materials, and then disposing and integrating an outer layer material such as a single-sided metal-clad laminate or metal foil.
There were problems with high frequency characteristics, dimensional stability, smear resistance during drilling, and poor peelability when heated. [Object of the Invention] An object of the present invention is to provide a multilayer printed wiring board that is excellent in high frequency characteristics, dimensional stability, smear resistance during drilling, and peelability when heated. [Disclosure of the Invention] The present invention provides an outer layer material that is disposed on the upper and/or lower surface of an inner layer material having a circuit via a required number of adhesive fluororesin layers, or further provided with an inner layer material, and then a required number of inner layer materials. In a multilayer printed wiring board formed by disposing and integrating the outer layer material by repeating the process of interposing the fluorocarbon resin layer for adhesion a required number of times, the fluorocarbon resin film and the fluorocarbon resin film are placed on the outside of the fluorocarbon resin film. This multilayer printed wiring board is characterized by using fluorocarbon resin layers for adhesion, which are alternately combined with fluorocarbon resin-impregnated base materials, so it is possible to utilize the excellent high frequency properties of fluorocarbon resin, and it also has heat resistance. Due to its plasticity, dimensional stability is improved, and smear resistance and hot peelability can be improved by utilizing the excellent heat resistance of fluororesin.The present invention will be described in detail below. The inner layer material having a circuit used in the present invention includes:
Either a single-sided circuit inner layer material or a double-sided circuit inner layer material can be used, and furthermore, the inner layer material on which the circuit is formed can be provided on the circuit forming side of the inner layer material via the required number of adhesive fluorocarbon resin layers. Accordingly, it is also possible to form a multilayer printed wiring board. Examples of the fluororesin for the adhesive fluororesin layer include tetrafluoroethylene resin, tetrafluoroethylene perfluorovinyl ether copolymer, tetrafluoroethylene hexafluoropropylene copolymer, and tetrafluoroethylene ethylene copolymer. All fluorocarbon resins such as polymers can be used, and the base material can be woven fabrics made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and polyacrylic, and natural fibers such as cotton. The base material may be cloth, nonwoven fabric, mat, cheesecloth, paper, or a combination thereof, but it is preferable to use glass cloth, which has excellent dimensional stability. The fluororesin layer for adhesion must be a combination of fluororesin films and fluororesin-impregnated base materials alternately so that the fluororesin film is on the outside. By doing so, it is possible to obtain a multilayer printed wiring board with good interlayer adhesion without residual bubbles while maintaining the reliability of the inner layer circuit. As the outer layer material, a single-sided metal-clad laminate or a metal foil made of copper, aluminum, stainless steel, brass, iron, nickel, etc. alone or made of an alloy is used. Although there are no particular limitations on the integration means, it is preferable to use a lamination heating and pressing method. The present invention will be explained below based on examples. Example: An inner layer material consisting of a 0.8 mm thick fluoropolymer glass laminate with circuits formed on both sides.
Glass impregnated with 0.1 mm thick ethylene tetrafluoride resin (manufactured by Daikin Industries, Ltd., trade name Polyflon) between three films of 0.035 mm tetrafluoroethylene resin (manufactured by Daikin Industries, Ltd., trade name Polyflon). Multilayer printed wiring is produced by laminating and heating-molding a laminate in which copper foils each having a thickness of 0.018 mm are placed through fluorine-based adhesive layers in which one cloth is inserted, at 380°C and 30 kg/cm 2 for 50 minutes. Got the board. Conventional example Three sheets of epoxy resin-impregnated glass cloth with a thickness of 0.11 mm are placed on the top and bottom surfaces of the same inner layer material as in the example.
Laminated material with 0.035mm copper foil placed at 170℃, 50Kg/
A multilayer printed wiring board was obtained by laminating and heating molding at cm 2 for 90 minutes. [Effects of the Invention] As is clear from Table 1, the performance of the multilayer printed wiring board of the present invention is as follows: We have confirmed the superiority of the present invention. 【table】
Claims (1)
所要枚数の接着用フツ素系樹脂層を介して外層材
を配設又は、更に内層材を配設後、所要枚数の接
着用フツ素樹脂層を介することを所要回路反復し
て外層材を配設、一体化してなる多層プリント配
線板に於て、フツ素系樹脂フイルムが外側になる
ようフツ素系樹脂フイルムとフツ素樹脂含浸基材
とを交互に組合せた接着用フツ素系樹脂層を用い
たことを特徴とする多層プリント配線板。1. On the upper and/or lower surface of the inner layer material having a circuit,
After disposing the outer layer material through the required number of adhesive fluororesin layers, or further disposing the inner layer material, repeating the process through the required number of adhesive fluororesin layers for the required circuit to distribute the outer layer material. In the integrated multilayer printed wiring board, a fluorocarbon resin layer for adhesion is formed by alternately combining a fluorocarbon resin film and a fluorocarbon resin-impregnated base material so that the fluorocarbon resin film is on the outside. A multilayer printed wiring board characterized by using
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60257592A JPS60257592A (en) | 1985-12-19 |
| JPH0354875B2 true JPH0354875B2 (en) | 1991-08-21 |
Family
ID=14658338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11526384A Granted JPS60257592A (en) | 1984-06-04 | 1984-06-04 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60257592A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62285498A (en) * | 1986-06-03 | 1987-12-11 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH0815235B2 (en) * | 1986-06-14 | 1996-02-14 | 松下電工株式会社 | Multilayer printed wiring board |
| JPH07120858B2 (en) * | 1990-03-30 | 1995-12-20 | 株式会社日立製作所 | Multilayer printed circuit board and manufacturing method thereof |
| JPH0818403B2 (en) * | 1993-06-03 | 1996-02-28 | 日本ピラー工業株式会社 | Laminates and green composite films for laminates |
| GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
| KR101574374B1 (en) | 2008-08-18 | 2015-12-03 | 셈블란트 리미티드 | Halo-hydrocarbon polymer coating |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745997A (en) * | 1980-09-02 | 1982-03-16 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
| JPS57150567A (en) * | 1981-03-13 | 1982-09-17 | Hitachi Cable | Copper lined laminated board |
| JPS5846691A (en) * | 1981-09-14 | 1983-03-18 | 東レ株式会社 | High frequency electric circuit board and method of producing same |
-
1984
- 1984-06-04 JP JP11526384A patent/JPS60257592A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60257592A (en) | 1985-12-19 |
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