JPH0354880B2 - - Google Patents

Description

Detailed Description of the Invention Technical Field The present invention relates to an electronic component mounting device that holds electronic components by a component holding section of a component holding head and automatically mounts them onto a component support member such as a printed circuit board. The present invention relates to a device in which an electronic component held in a component holding head can be mounted after changing its rotational posture about the center line of the component holding portion.

Conventional technology The above-mentioned electronic component mounting device is
This is already known from Publication No. 213496. In the electronic component mounting apparatus described in this publication, as shown in FIG. 10, a suction head 230 serving as a component holding head is attached to a suction portion (component holding portion) of a suction tube 232 that suctions and holds electronic components. The electronic component 236 is attached to the head holder 234 in a state where it can rotate around the center line, and the rotating attitude of the electronic component 236 sucked into the suction tube around the center line of the suction tube is detected by the imaging device, and the detection result is Based on this, a head rotating device 238 rotates the suction head 230 by a predetermined angle, thereby changing the attitude of the electronic component 236 and mounting it on a printed circuit board or the like. According to such an electronic component mounting apparatus, since the electronic component 236 can be mounted on a printed circuit board or the like after correcting the error in the holding posture of the electronic component 236 by the suction head 230, the mounting accuracy can be improved.

Problems to be Solved by the Invention However, in the electronic component mounting apparatus described in the above publication, the head rotation device 238 is
Since it is provided on the head holder 234 that rotatably holds the suction head 230 and moves with it, the mass that moves together with the suction head 230 is large, and the suction head 230
It is difficult to move the parts at high speed to improve the efficiency of parts mounting work.

In addition, in this electronic component mounting apparatus, the suction head 230 is provided with an arcuate held part 240 centered on the center line of the suction part of the suction tube 232, and this held part 240 supports the guide roller 242. The suction head 230 is held by the suction head 234 via the suction head 230, and the head rotation device 238 rotates the suction head 230 by bringing a driving arm 244 into contact with the end surface of the held portion 240. Therefore, the rotatable angle of the suction head 230 is limited to a relatively small angle, and although it is possible to correct errors in the rotational posture of the electronic component 236 around the center line of the suction tube,
It is not possible to rotate the device by a large angle such as 45 degrees, 90 degrees, or 180 degrees and attach it to a printed circuit board.

Means for Solving the Problems In order to solve the above-mentioned problems, the first invention of the present application has the objective of fixing the component holding head that holds the electronic components in the component holding part to the center of the part holding part by means of a head holder. An electronic component that is rotatably held around a wire and rotated by a head rotation device to change the posture of the electronic component held by the component holding head and then mounted on a component support such as a printed circuit board. In the mounting device, the head holder is moved from the component receiving position to the component mounting position by applying a motion including a component in a direction perpendicular to the center line of the component holder to the component holding head, and The holding head is provided with a driven rotating body concentric with the component holding section, and the driven rotating body is rotated near a stop position in the moving path of the component holding head from the component receiving position to the component mounting position. The driven rotary body and the component holding head are brought into contact with the driven rotary body and the component holding head by rotating the drive rotary body and the contact/separation device that brings the drive rotary body into contact with and separates it from the driven rotary body, which engages in a transmissible manner.
The head rotation device is constructed by providing a rotation drive device that can rotate the head.

Further, in order to solve the above-mentioned problem, the second invention of the present application is such that a component holding head that holds electronic components in a component holding section is rotatable around the center line of the component holding section by a head holder. In an electronic component mounting device that changes the posture of the electronic component held by the component holding head by being held and rotated by a head rotation device, the electronic component is mounted on a component support such as a printed circuit board. shall be moved from the component receiving position to the component mounting position by giving the component holding head a motion that includes a component in a direction perpendicular to the center line of the component holder, and at the same time, A driving rotary body is provided with a driven rotary body, and is engaged with the driven rotary body so as to be able to transmit rotation near a stop position in a movement path of the component holding head from the component receiving position to the component mounting position. and a contact/separation device for bringing the driving rotary body into contact with and separating from the driven rotary body, and a rotary drive device capable of rotating the driven rotary body and the component holding head once by rotationally driving the driving rotary body. The head rotation device is configured to prevent rotation of the component holding head by frictionally engaging with the component holding head or a member rotating integrally therewith, and the head rotation device rotates the component holding head. The system is equipped with a brake device that is released between the two.

In the preferred embodiments of the first and second inventions, the driven rotating body has a cylindrical inner peripheral friction surface, and the driving rotating body expands radially outward to form an inner circumferential friction surface. It includes an expansion part that frictionally engages with the friction surface, and the contact/separation device moves the drive rotating body in the axial direction to fit inside the inner circumferential friction surface and expands the expansion part. Ru.

In a further preferred embodiment, the drive rotor has a hollow shaft shape, and a ring-shaped member made of an elastic material such as rubber is fitted on the outside of a portion of the drive rotor that fits inside the inner circumferential friction surface. A plurality of radial through holes are formed at equal angular intervals in the part where the shaped member is fitted, and a ball is movably accommodated in each of these through holes, and is also slidable in the axial direction within the driving rotor. An inclined surface formed at an angle with respect to the axial direction on the expansion member fitted in the can act on each ball, and as the expansion member moves relative to the driving rotor in the axial direction, the balls and the ring-shaped The expanded portion consisting of the member is expanded and frictionally engaged with the inner circumferential friction surface.

Further, in a further preferred embodiment, an elastic member is provided between the expansion member and the driving rotor, and the elastic member urges the expansion member to a non-acting position where the inclined surface does not act on the ball. The separating device acts on the drive rotor through the expansion member and the elastic member to fit the expansion portion inside the inner circumferential friction surface, and prevents the drive rotor from moving in the axial direction at the inserted position. After this, the expansion member is moved relative to the rotary drive body against the biasing force of the elastic member, thereby expanding the expansion portion.

Functions and Effects In the electronic component mounting device according to the first aspect of the invention, the head rotation device for rotating the component holding head is provided at a fixed position and is not supported by the head holder, so it moves together with the head holder. The mass is small, and the vibration and noise generated when the head holder starts and stops moving is reduced.
It becomes possible to move the head holder at high speed, and the efficiency of component mounting work can be improved.

Moreover, although the head rotation device is commonly provided for multiple component holding heads,
Each time an individual component holding head stops close to it, the driving rotor engages with the driven rotor to rotate one component holding head by the required angle, so all component holding heads are always connected to a common head rotation device, and the rotation of one component holding head does not affect the phase of other component holding heads, unlike when they are rotated all at once. Rotation control is easy.

In addition, the component holding head is rotatably held by the head holder around the center line of the component holder, and a driven rotating body concentric with the component holder is rotated once by a rotational drive device via the driving rotating body. Since the component holding head can be rotated at any angle, it is possible to not only correct errors in rotational posture, but also rotate large angles such as 45 degrees, 90 degrees, and 180 degrees to hold printed circuit boards. It can be attached to.

Further, in the electronic component mounting device according to the second invention, the same effects as in the electronic component mounting device according to the first invention can be obtained, and the component holding head is usually prevented from rotating by a brake device. Therefore, there is no risk that the component holding head will rotate freely due to vibrations, shocks, etc. caused by the movement of the head holder, and when it is necessary to rotate, the brake device is released and the component holding head is rotated. Since it rotates easily, it has the effect of further improving the accuracy of changing the posture of electronic components.

Furthermore, in a desirable embodiment in which the driving rotary body is frictionally engaged with the inner circumferential friction surface of the driven rotary body in the extended portion, the frictional engagement force between the driving rotary body and the driven rotary body is Because the internal force of the system consisting of the body and body does not act on other members that support them, even if the driving rotor and the driven rotor are frictionally engaged with a sufficiently large force, the component holding head and the head rotation will not occur. There is no risk of relative movement between the device and the device. Therefore, the rigidity of the device can be reduced, and costs can be reduced, and the mass that moves together with the head holder is reduced, making it possible to move the head holder at high speed.

In addition, in a preferred embodiment in which the expansion part is composed of a ball and a ring-shaped member, the structure is simplified and a unique effect that can reduce costs is produced. In a further improved aspect in which the member is provided, the approaching/separating device only moves the expanding member in the axial direction to fit the expanded portion of the driving rotary body inside the inner circumferential friction surface of the driven rotary body and to remove the expanded portion. can be expanded, the structure is simple, and further cost reduction effects can be obtained.

Embodiment Hereinafter, an embodiment of the present invention will be described in detail based on the drawings.

FIG. 1 shows an external appearance of an electronic component mounting system including an electronic component mounting apparatus according to an embodiment of the present invention.
This electronic component mounting system includes a main body frame 10, a component supply device 12, a board loading device 14, a board unloading device 16, a board positioning device 18, an electronic component mounting device 20 (hereinafter simply referred to as the mounting device), and the like. The parts supply device 12 is a main body frame 1
A large number of component supply units 32 are arranged adjacent to each other in the moving direction of the movable base 30 on a movable base 30 supported movably along a straight line by unit 3
2 holds one type of taped electronic component, and is moved to a position directly facing the mounting device 20 by the movement of the moving table 30, and supplies electronic components one by one. Since this is well known, detailed explanation will be omitted.

A printed circuit board to which electronic components are attached is carried in by a board carrying device 14, and is attached to a board positioning device 18 by a loading device (not shown). The substrate positioning device 18 includes a substrate support stand 36, and the substrate support stand 36 is connected to the moving stand 3.
The X-axis direction parallel to the movement direction of 0 and the Y direction perpendicular to it
It is installed on an XY table that can be moved in both the axial direction and supports the printed circuit board in an accurate position.
Position at any position on the XY plane. Then, the mounting device 20 sequentially mounts the electronic components received from the component supply device 12 onto the positioned printed circuit board, and the printed circuit board on which all the components have been mounted is removed by an unloading device (not shown) and unloaded. It is carried out by the device 16. These operations are controlled by the control device 22. The control device 22 is mainly a computer, and controls each device based on a program stored in the computer's memory and information provided from the outside via a magnetic disk, magnetic tape, etc. Attached to this control device 22 are an operation panel 40, a display 42 that displays operating instructions for the operation panel 40, input data, operating status of each device, etc., and a suction head (described later) that is a component holding head. A monitor television 44 is provided for an operator to monitor the posture of the held electronic components. These board loading device 14, board unloading device 16, board positioning device 18, control device 22, operation panel 40, display 42, monitor television 44, etc. are well known, so a detailed explanation will be omitted and the mounting will be described below. The device 20 will be explained.

As is clear from FIG. 2, the mounting device 20 includes a rotating shaft 50 rotatably held by the main body frame 10 about a vertical axis. A rotating plate 52 is fixed to the upper end of this rotating shaft 50, and 12
Cam followers 54 are mounted and adapted to engage a cam 56 which rotates about a horizontal axis. As a result, the rotary plate 52 and the rotary shaft 50 are intermittently rotated by 30 degrees each time the cam 56 rotates once.

An intermittent rotating disk 58 is fixed to the lower end of the rotating shaft 50, and twelve suction head units 60 are attached to this intermittent rotating disk 58 at equal angular intervals. All of these adsorption head units 60 have the structure shown in FIGS. 3 and 4. As is clear from FIG. 3, the intermittent rotary disk 58
Two pairs of rods 62 are attached to the outer periphery of the rod 62 in a vertical position and movable in the axial direction, and both ends of the rods 62 are connected to connecting members 63 and 64.
are interconnected by. Upper connecting member 63
A cam follower 65 is attached to the cam follower 65, and the cam follower 65 is engaged with a cam 66 shown in FIG. The cam 66 is the main body frame 1
Since the rod 62 is fixed at 0 and has an annular cam groove 67 formed on the outer circumferential surface at an angle with respect to the horizontal plane, the rod 62 rotates as the intermittent rotary disk 58 rotates.
is raised and lowered. Further, an arm 69 is fixed to the lower connecting member 64 by a shaft member 68, and a suction head 70 as a component holding head is attached to this arm 69. Arm 6
9 is adapted to function as a head holder.

As shown most clearly in FIG. 4, each suction head 70 has a head main body 86 which is made up of a metal cylindrical member 80 and transparent plates 82 and 84 made of glass or synthetic resin fixed to both ends thereof. We are prepared. A substantially airtight space is formed inside the head main body 86, and a vertical through hole communicating with this space is formed in the lower transparent plate 84, and parts of the suction head 70 are inserted into this through hole. A suction tube 88 functioning as a holding portion is press-fitted. Head main body 8
6 is fitted to the outer cylinder 90 so as to be non-rotatable and slidable in the axial direction, and is always fitted with a spring 92.
It is held at the lower end position where it abuts against the stopper 94. The outer cylinder 90 is rotatably and axially slidably fitted into a through hole formed in the arm 69 in the vertical direction, and is normally held at the upper end position where the flange 98 abuts the arm 69 by a spring 96. A driven rotating body 102 is screwed onto the upper end of the outer cylinder 90 and has a cylindrical inner friction surface 100 centered on the center line of the suction head 70, that is, the center line of the suction tube 88. The driven rotating body 102 and the spring 96 are covered by a cover 104.

The arm 69 serving as the head holder is provided with a brake device 110 for preventing rotation of the suction head 70, specifically the outer cylinder 90 and the head body 86. Brake device 110 includes friction member 1
12, a lever 114, a spring 115, etc. The lever 114 has a pin 116 on the arm 69.
The middle part is attached so that it can rotate,
A friction member 112 is fixed to one end, and a spring 115 is installed between the other end and the arm 69. The friction member 112 is fitted into a through hole formed in the arm 69, and its tip is pressed against the outer circumferential surface of the outer cylinder 90 by the biasing force of the spring 115 to prevent rotation of the suction head 70. There is.

The suction tube 88 is connected to a space formed in the head main body 86 and a connection passage 1 formed in the cylindrical member 80.
17, a connecting passage 118 formed in the outer cylinder 90, a passage 11 formed in the arm 69 and the shaft member 68;
Passages 122 and 12 formed in the intermittent rotating disk 58 and rotating shaft 50 through 9 and 120.
4, and is further connected to a vacuum device (not shown) at a port 128 via a joint 126. A switching valve 130 is provided at the connection between the passages 120 and 122, and when switched by a valve operating device (not shown), the adsorption pipe 88 can be selectively communicated with the vacuum device and the atmosphere. ing.

Each suction head 70 is stopped at 12 positions A through L shown in FIG. 5 as the intermittent rotary disk 58 rotates intermittently. Then, at position A, an electronic component is received from the component supply device 12, and at position G, it is mounted on a printed circuit board. Position A is the parts receiving position, and position G is the parts mounting position. Further, at positions C and E, an attitude detection device 140 and a head rotation device 14 are provided, respectively.
2 is provided, position C is the posture detection position, and position E
is considered to be the posture change position. Further, at position D, if the electronic component detected at position C is different from the expected one, the switching valve 130 is switched to release the erroneous electronic component from the suction head 70. Posture detection device 140
Since the method detects the outline of the electronic component, it is possible to detect not only the posture of the electronic component but also the type of the electronic component.

As is clear from FIG. 6, the posture detection device 140 includes an auxiliary frame 1 fixed to the main body frame
44, a projector 146, a prism device 148, and an imaging device 150. The projector 146 is fixed to the auxiliary frame 144 by a bracket 152, and is positioned directly above the suction head 70 stopped at the attitude detection position C. After the light projected from the light projector 146 passes through the suction head 70, its direction is changed by 90 degrees by two prisms 154 of the prism device 148, and enters the imaging device 150. Imaging device 150
is equipped with a lens 156, and an electronic component W connected to a solid-state image sensor (not shown) by this lens 156.
This converts the projected image into a binary signal. The imaging device 150 is attached to the auxiliary frame 144 by a bracket 160, and the focal length can be adjusted by adjusting the height of the bracket 160 with an adjustment screw 162. Note that 164 is a power unit of the imaging device 150.

As shown in FIG. 7, the head rotating device 142 includes a drive rotor 174 rotatably and axially slidably held by a guide bush 172 fixed to an auxiliary frame 170. The drive rotary body 174 includes a gear 176, and this gear 17
6 is connected to a servo motor 182 shown in FIG. 8 via a gear 178 and a timing belt 180. Therefore, the drive rotating body 174 can be rotated by an arbitrary angle by the servo motor 182.

As shown in FIG. 9, the drive rotor 174 is a hollow shaft-shaped member, and a wide annular groove 184 is formed on the outer peripheral surface of its lower end, into which a rubber friction ring 186 is fitted. It is being Further, a plurality of through holes are formed in the bottom wall of the annular groove 184 and extend through the annular groove 184 in the radial direction, and one ball 188 is movably accommodated in each through hole. A rod-shaped expansion member 192 having a plurality of inclined grooves 190 at its lower end is slidably inserted into the drive rotor 174, and a pin 194 fixed to the expansion member 192 and a pin 194 formed on the drive rotor 174 are inserted into the drive rotor 174. long hole 19
6 prevents relative rotation between the expansion member 192 and the drive rotary body 174, and also defines the limit of relative movement of the two in the axial direction.

A stop ring 200 is fixed to the upper end of the drive rotary body 174, and this stops the guide bush 172.
By contacting the upper end surface of the drive rotating body 174
The lower end position of the lower end is defined. Further, a nut 202 is provided near the upper end of the expansion member 192.
is fixed, and a spring 203 as an elastic member is installed between the nut 202 and the upper end surface of the drive rotor 174 to urge the expansion member 192 upward against the drive rotor 174. .
A tapered portion 204 is formed at the upper end of the expansion member 192, and an elevating member 206 is attached to a bearing 208.
are engaged via. An engagement member 210 is also attached to the elevating member 206 and is adapted to engage with the nut 202 to raise and lower the expansion member 192 together with the elevating member 206.

As is clear from FIG. 7, the lifting member 206 includes two rods 212 and a guide block 2.
It is held movably up and down by an auxiliary frame 170 via 14, and is connected to a cam device (not shown) for driving up and down by a connecting rod 216. In addition, the elevating member 206, rod 212, guide block 214, and connecting rod 216 are
For ease of understanding, in FIG. 8, the driving rotor 174 is shown rotated at a constant angle about its axis.

The head rotating device 142 is provided at a position where the drive rotor 174 is concentric with the suction head 70 when the suction head 70 is stopped at position E. When the elevating member 206 is lowered, the elevating member 206 and the drive The rotor 174 is lowered together with the drive rotor 174, and the lower end of the drive rotor 174, that is, the portion where the friction ring 186 is attached, is the fourth member of the suction head 70.
It fits into the driven rotating body 102 shown in the figure. Then, the stopper ring 200 comes into contact with the upper end surface of the guide bush 172 and the drive rotor 174
After the downward movement of the expansion member 192 stops, the expansion member 192 descends relative to the driving rotary body 174 against the biasing force of the spring 203, and the ball 188 is moved radially outward by the action of the inclined groove 190. By extrusion, the friction ring 186 is partially bulged out and brought into frictional engagement with the inner circumferential friction surface 100 of the driven rotating body 102 .

That is, the bottom surface of the inclined groove 190 is the expansion member 19
The friction ring 186 functions as a ring-shaped member that is expanded via the ball 188 by the inclined surface.
The friction ring 186 constitutes an extension of the drive rotor. In addition, the driving rotary body 174 is fitted inside the driven rotary body 102 and its expanded portion is expanded by the elevating member 206 that acts on the expanding member 192 and the cam device for driving it up and down. A contact/separation device for frictionally engaging the driving rotary body 174 and the driven rotary body 102 is constructed.

As is clear from FIG. 7, the auxiliary frame 17
0 is attached with a release lever 220 of a brake release device 218 that releases the brake device 110. One arm of the release lever 220 is connected to the cam arrangement by a connecting rod 222, and an actuating member 224 is attached to the other arm. The connecting rod 222 is adapted to be raised and lowered in relation to the connecting rod 216 by means of a cam device, thereby causing the drive rotary body 17 to move up and down.
4 is lowered and the friction ring 186 is driven by the rotating body 1.
02, the action member 224 acts on the lever 114 to release the brake device 110, and after the suction head 70 is rotated by a predetermined angle, the drive rotor 174 is rotated. The brake device 110 is returned to its operating state prior to detachment from the driven rotating body 102.

Next, the operation of the entire electronic component mounting system will be explained. While the suction head 70 stopped at position A (component receiving position) in FIG. The rotational posture of the suction head 70 around the axis is detected, and at position E (attitude change position) the suction head 70 is rotated by the head rotation device 142, so that the rotational posture of the electronic component W around the suction head axis is changed. Further, at the position G (mounting position), the electronic component W is mounted on the printed circuit board. The operations at each of these positions are performed in parallel on different suction heads 70, but in the following, one suction head 70
The operation at each position will be explained in detail, focusing on the following.

When the suction head 70 is stopped at position A, a selected one of the many component supply units 32 of the component supply device 12 is positioned directly below the suction head 70 and is held in the component supply unit 32. The cover tape is peeled off from the component holding tape, and the electronic component W can now be taken out. Therefore, the head pressing device (not shown) in FIG.
When the head body 86 and the suction tube 88 are pushed down against the biasing force of the spring 96, the head main body 86 and the suction tube 88 are also lowered accordingly, and the lower end surface of the suction tube 88 comes into contact with the upper surface of the electronic component W. Driven rotating body 1
02 and the outer cylinder 90 are pushed down after that, but the head main body part 86 and the suction tube 88
is allowed to remain stationary by compression of spring 92. In this state, the adsorption tube 8
8 is communicated with the vacuum device, so the electronic component W is sucked into the suction tube 88, and when the action of the head pressing device is released and the suction head 70 rises, the electronic component W also rises accordingly, and the mounting device 2
0 ends receiving the electronic component W from the component supply device 12.

If the suction head 70 that has received the electronic component W is stopped at the position C in this way, the suction head 7
0 is located between the projector 146 and the prism device 148 as shown in FIG. Therefore, a projected image of the electronic component W is formed on the solid-state imaging device surface of the imaging device 150 by the light projected from the light projector 146. The imaging device 150 converts this projected image into a binary signal and outputs it to the control device 22. The control device 22 compares the binary signal with a binary signal indicating the position of the regular electronic component W, which is stored in advance in the memory of the control device 22 itself, and determines the attitude of the electronic component W with respect to the regular position. Calculate the error Δθ.

After the posture is detected as described above, if the suction head 70 stops at position E, the suction head 7
0 is located directly below the drive rotating body 174 of the head rotating device 142, as shown in FIG.
Therefore, when the elevating member 206 is lowered by the cam device, the lower end of the driving rotor 174 fits inside the driven rotor 102 shown in FIG. When the elevating member 206 is further lowered from this state, the expanding member 192 is lowered relative to the driving rotary body 174 in FIG. is pressed against the inner peripheral friction surface 100 of the driven rotating body 102. Subsequently, the brake release device 218 is operated to release the brake device 110, so that the suction head 70 becomes rotatable, and in this state, the servo motor 182 is activated to rotate the suction head 70. The servo motor 182 is rotated by an angle corresponding to the attitude error Δθ determined by the control device 22 as described above, and the suction head 70 and the electronic component W held therein cancel out the attitude error Δθ. can be rotated by the required angle. After that, the brake device 110 is activated again,
The lifting member 206 is raised and the drive rotating body 17
4 is removed from the driven rotating body 102, and the attitude change of the electronic component W is completed.

After the posture error has been eliminated as described above, by the time the suction head 70 stops at position G, the printed circuit board positioning device 18 has positioned the printed circuit board at a predetermined position. Therefore,
The suction head 70 is moved by a head pressing device (not shown).
When is pushed down, the electronic component W held by the suction tube 88 is pressed against a predetermined position on the printed circuit board and fixed by adhesive or the like. In this state, the switching valve 130 is switched and the suction tube 88 is communicated with the atmosphere, thereby releasing the electronic component W from the suction head 70. Thereafter, when the suction head 70 is raised, the electronic component W can be mounted on the printed circuit board. Complete.

As is clear from the above description, in this electronic component device system, the suction head 70 receives the electronic component W, detects its orientation, changes its orientation, and attaches it to the printed circuit board in parallel at multiple positions. Cycle time is shortened and efficiency of electronic component mounting work is improved.

Further, since only one posture detecting device 140 and one head rotating device 142 are required for each of the 12 suction heads 70, the structure of the device is simplified and manufacturing costs can be reduced.

The head rotation device 142 also includes an intermittent rotation disk 58.
Since the moment of inertia of the intermittent rotary disk 58 is reduced, the vibration and noise accompanying the intermittent rotation are reduced, and the intermittent rotary disk 58 can be rotated at high speed. becomes.

Furthermore, since the image formed on the solid-state image sensor surface of the imaging device 150 is a projected image of the electronic component W, it may be affected by the surface roughness, color, etc. of the electronic component W, like an image of the electronic component W caused by reflected light. Therefore, the attitude of the electronic component W can be detected accurately.

In the embodiment described in detail above, the component holding head is the suction head 70 that suctions electronic components using a vacuum, and since the suction tube periphery of the head main body 86 is formed of a transparent material, the electronic components W cannot be picked up. Although the component holding head has the advantage of being able to obtain a projected image over the entire circumference, the component holding head is not limited to this. If it is a head, it can be adopted. For example, it is possible to hold the electronic component W in a component holding head equipped with a pair of gripping claws together with or in place of the suction tube 88. In other words, it is possible to hold the electronic component W in a component holding head equipped with a pair of gripping claws. Any component holding head that can hold the electronic component in a state where a projected image of the part necessary for detecting the position of the electronic component, such as two sides, can be obtained can be used. In this case, if the members that support and operate the gripping claws get in the way of obtaining a projected image of the electronic component, the direction of light emitted from the projector may be tilted at a certain angle with respect to the center line of the electronic component. is also possible.

Furthermore, in the above embodiment, in order to facilitate understanding, only the posture error of the electronic component is corrected at the posture change position, but the electronic component is printed in a posture different from the posture when it is received from the component supply device. If it is necessary to mount the electronic component on the board, it is possible to rotate the electronic component by the necessary angle at this position, and in this way, the board positioning device 18 can have the function of rotating the printed board. This makes it possible to mount electronic components in any position without having to worry.

Further, in the above embodiment, only the error in the rotational posture of the electronic component is detected at the posture detection position, but the center line of the electronic component W and the reference line of the component holding head (for example, the center line of the suction head 70) are detected. By detecting the deviation from the electronic component (line) and operating the board positioning device 18 based on the detected deviation, it is possible to improve not only the mounting posture of the electronic component but also the accuracy of the absolute mounting position.

In addition, in the above embodiment, the attitude detection position and the attitude change position are separate from the component receiving position and the mounting position, but these positions can be changed as appropriate, for example by aligning the attitude change position with the component mounting position. It is also possible to change.

Furthermore, in the embodiment, the driving rotor 17
Although the expansion part 4 was supposed to be expanded mechanically, it is possible to make appropriate changes, for example, by expanding it by fluid pressure. Driven rotating body 1
It is not essential to engage the driving rotary body 174 and the driven rotary body 102 by pressing against the inner circumferential friction surface 100 of 02. For example, it is also possible that the driving rotary body 174 is fitted on the outside of the driven rotary body 102, and the contracted portion of the driving rotary body frictionally engages with the outer peripheral friction surface of the driven rotary body. Furthermore, it is also possible to frictionally engage the drive rotor and the driven rotor by concentrically abutting the end faces of the drive rotor and the driven rotor, or by connecting the drive rotor and the driven rotor in the radial direction. It is also possible to cause local frictional engagement between the outer peripheral surfaces of the two or between the outer peripheral surface of one and the inner peripheral surface of the other by relative movement. In this case, it goes without saying that the contact/separation device also needs to be changed according to each aspect.

Further, in the embodiment described above, the suction head 70 as a component holding head is attached to one intermittent rotary disk 58.
A large number of parts were attached to the head and moved from the parts receiving position to the parts mounting position as it rotated, but one part holding head was held by one moving body and could be moved circumferentially or in a straight line. It is also possible to move along an arbitrary movement route.

In addition, although no specific examples will be given, it goes without saying that the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief explanation of drawings]

FIG. 1 is a perspective view schematically showing an entire electronic component mounting system including an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a front sectional view showing the main parts of the electronic component mounting device of the electronic component mounting system shown in FIG. FIG. 3 is a - sectional view in FIG. 2. FIG. 4 is a front sectional view showing the suction head shown in FIG. 2 and its surroundings. FIG. 5 is an explanatory diagram showing the relative positional relationship between the main part of the electronic component mounting apparatus shown in FIG. 2, the attached attitude detection device, and the head rotation device, and is an explanatory diagram showing the relative positional relationship between the main part of the electronic component mounting apparatus shown in FIG. It is a V sectional view. 6 is a front view of the attitude detection device shown in FIG. 5. FIG. 7 is a front view of the brake release device and head rotation device shown in FIG. 5; FIG. FIG. 8 is a bottom view of the brake release device and head rotation device shown in FIG. 7. FIG. 9 is a - sectional view in FIG. 7. FIG. 10 is a plan view showing an example of a conventional electronic component mounting apparatus. 20: Electronic component mounting device, 58: Intermittent rotary disk,
60: Suction head unit, 69: Arm (head holder), 70: Suction head, 80: Cylindrical member,
82, 84: Transparent plate, 86: Head main body, 8
8: Adsorption tube, 90: Outer cylinder, 100: Inner peripheral friction surface,
102: Driven rotating body, 110: Brake device,
140: Attitude detection device, 142: Head rotation device, 146: Light projector, 148: Prism device, 1
50: Imaging device, 174: Drive rotating body, {176,
178: Gear, 180: Timing belt, 18
2: Servo motor (rotary drive device), {86: Friction ring, 188: Ball} (extension part), 192: Expansion member, {206: Lifting member, 208: Bearing, 2
10: Engagement member} (contact/separation device), 218: Brake release device.

Claims (1)

[Scope of Claims] 1. A component holding head that holds an electronic component in a component holding section is rotatably held by a head holder around a center line of the component holding section, and is held by a head rotation device. In an electronic component mounting apparatus that changes the posture of the electronic component held by the component holding head by being rotated and then mounts the electronic component on a component support such as a printed circuit board, the head holder is attached to the component holding head. The part is moved from the component receiving position to the component mounting position by applying a motion including a component in a direction perpendicular to the center line of the part, and the part holding head is provided with a driven rotating body concentric with the part holding part. , a driving rotary body that engages with the driven rotary body so as to transmit rotation thereto, and a driving rotary body that is close to a stop position in a movement path of the component holding head from the component receiving position to the component mounting position. The head is rotated by providing a contacting/separating device that brings the driven rotary body into contact with and separating it from the driven rotary body, and a rotation drive device that can rotate the driven rotary body and the component holding head once by rotationally driving the driving rotary body. An electronic component mounting device characterized by comprising a device. 2. The driven rotating body has a cylindrical inner circumferential friction surface, and the driving rotating body includes an expanded portion that expands radially outward and frictionally engages with the inner circumferential friction surface, 2. The electronic component mounting apparatus according to claim 1, wherein the contact/separation device moves the drive rotating body in the axial direction so as to fit it inside the inner circumferential friction surface thereof and expand the expansion portion. 3. The driving rotating body has a hollow shaft shape, and a ring-shaped member made of an elastic material is fitted on the outside of a portion of the driving rotating body that fits inside the inner circumferential friction surface, and the ring-shaped member A plurality of radial through holes are formed at equal angular intervals in the part where the member is fitted, and a ball is movably accommodated in each of the through holes, and is movable in the axial direction within the drive rotating body. An inclined surface formed on the fitted expansion member so as to be inclined with respect to the axial direction can act on each of the balls, and as the expansion member moves relative to the driving rotary body in the axial direction, the inclined surface Claim 2, wherein the ring-shaped member is expanded through a ball so as to be frictionally engaged with the inner peripheral friction surface, and the expanded portion is constituted by the ball and the ring-shaped member. The electronic component mounting device described. 4. An elastic member is provided between the expansion member and the driving rotary body to bias the expansion member to a non-acting position where the inclined surface does not act on the ball, and the contact/separation device is configured to The extended portion is fitted inside the inner circumferential friction surface by acting on the drive rotor through the member and the elastic member, and axial movement of the drive rotor is prevented at the fitted position. After that, the expansion member is moved relative to the rotational drive body against the biasing force of the elastic member to expand the expansion portion. Device. 5. A component holding head that holds electronic components in a component holding section is rotatably held around the center line of the component holding section by a head holder and rotated by a head rotation device, In an electronic component mounting apparatus that mounts an electronic component held by the component holding head on a component supporter such as a printed circuit board after changing its posture, the head holder is placed on the component holding head perpendicularly to the center line of the component holder. The component holding head is provided with a driven rotating body concentric with the component holding portion, and the component holding head is provided with a driven rotating body that is concentric with the component holding portion. A driving rotary body that engages with the driven rotary body so as to transmit rotation, and a driving rotary body that is connected to the driven rotary body in proximity to a stop position on a movement path from the component receiving position to the component mounting position. The head rotating device is configured by providing a contact/separation device that brings the component into contact with and separates from the component and a rotational drive device that can rotate the driven rotary body and the component holding head once by rotationally driving the drive rotary body, and a brake device that is always frictionally engaged with the component holding head or a member that rotates integrally with it to prevent rotation of the component holding head, and is released while the head rotating device rotates the component holding head; An electronic component mounting device characterized by being provided with.