JPH0355268Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] In a socket for mounting a semiconductor integrated circuit, a contactor having contact pieces facing each other with a gap is housed in a hole in an insulator having a raised part on the inner side surface, and the raised part By displacing the tip of the contact inward to generate a preload on the contact piece, manufacturing of the contact is facilitated. In addition, a hole is provided on the inner side surface of the hole into which the protrusion provided at the tip of the contact piece is inserted, and by bringing the protrusion into contact with the wall of the groove, deformation of the contact due to overload (overstrain) is prevented. ing.

[Industrial application field]

The present invention relates to a socket for a semiconductor integrated circuit which is mounted on a printed wiring board and allows the semiconductor integrated circuit to be inserted into and removed from the printed wiring board.

Generally, semiconductor integrated circuits (hereinafter abbreviated as IC) are mounted by inserting lead terminals into holes in a printed wiring board.
The lead terminals and the wiring conductors on the printed wiring board are connected by soldering, but for example, semiconductor memory, especially read-only semiconductor memory, etc., must be removed from the printed wiring board when changing the built-in program. It is often mounted on a printed wiring board via a semiconductor integrated circuit socket (hereinafter referred to as an IC socket).

Such IC sockets often operate at low voltage levels, and noise generation at contact points must be avoided as much as possible. For this purpose, the contacts are plated with a metal that has low contact resistance and is resistant to deterioration. In order to construct a high quality IC socket, it is necessary to develop a contact structure that can be easily and reliably fitted.

Furthermore, since IC sockets have a large number of contacts and are mounted in a narrow space, they are susceptible to overload when inserting and removing ICs, and the overload can deform the contacts and cause poor contact. If a defective contact occurs, it will take a lot of time to replace the IC socket, and the equipment incorporating it may stop working while the IC socket is replaced, or if the deformation of the contact is not noticed, an unknown failure may occur. This causes serious damage, as a lot of time is wasted searching for the cause. Therefore, it is desired to realize an IC socket which has a structure in which the contacts are not easily deformed even if overload is applied during the mounting and removal of the IC, and which can realize low cost.

[Conventional technology]

FIG. 4 is a divided perspective view showing an example of a conventional IC socket.

In the figure, the contact 1 includes opposing contact pieces 11 and 12 and a lead terminal 13.
Contact pieces 11 and 12 are configured to come into elastic contact under a predetermined pressure (preload) so that sufficient contact pressure can be obtained when a lead terminal of an IC (not shown) is inserted between 1 and 12. has been done.

On the other hand, the insulator 2 is provided with a plurality of holes 21 for accommodating the contacts 1, and the holes 21 are provided with guide portions 22 at the upper portions for introducing the lead terminals of the IC between the contact pieces 11 and 12.

[Problem that the invention attempts to solve]

In the above IC socket, the contact 1 is constructed so that the opposing contact pieces 11 and 12 come into elastic contact under a predetermined pressure, and when the contact 1 is molded into such a shape and then plated, the elastic contact occurs. Not only will the parts not be plated, but they will also be contaminated by the plating solution and cleaning solution, causing noise and poor contact.
Therefore, plating is performed between the first bending step for forming the contact piece and the second bending step for making the contact piece face each other. However, inserting a plating process between the first bending process and the second bending process not only divides the bending process and increases the time required for the work, but also requires the second bending process to be performed on the plated surface. Do not damage the product or get oil, etc. on it. Also contact piece 1
1 and 12 have a cantilever structure, which causes plastic deformation when subjected to overload when installing and removing ICs.
There is a problem in that sufficient contact pressure cannot be obtained when inserting the IC lead terminal.

[Means for solving problems]

FIG. 1 is a divided perspective view showing an embodiment of an IC socket according to the present invention.

The above-mentioned problem is caused by a plurality of contacts 3 made of elastic metal and having contact pieces 11 and 12 facing each other with a gap 31 as shown in FIG. A protrusion 42 is provided on the inner side surface of the hole 41 to displace the tip of the contact 3 inward when the contact 3 is accommodated in the hole 41 of the insulator 4. A protrusion 32 is provided at the tip of the hole 41 to prevent deformation due to overload, and a groove 43 for accommodating the protrusion 32 is provided on the inner side surface of the hole 41.
Solved by IC socket.

[Effect]

By arranging the contact pieces 11 and 12 provided on the contactor 3 in FIG. Since the process and the second bending process can be performed continuously, the time required for the work is shortened, and there is no possibility of damaging the plated surface or attaching oil or the like. In addition, contact 3
When the contact piece 3 is housed in the hole 41, the tip of the contact piece 3 is displaced inward by the raised part 42, and the contact pieces 11 and 12
A preload is generated between the two and enough contact pressure can be obtained when inserting the IC lead terminal.

Furthermore, even if an overload is applied to the contact piece 11 or 12 and the contact piece is bent in the direction of expansion, the protrusion 32 will come into contact with the wall of the groove 43 and the contact piece 11 or 12 will have a beam structure with both ends supported, and will not be bent any further. This can prevent plastic deformation from occurring.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Figure 1 is a divided perspective view showing one embodiment of the IC socket of the present invention, Figure 2 is a divided perspective view showing another embodiment of the present invention, and Figure 3 is a divided perspective view showing a modification of the present invention. In the figures, the same objects are represented by the same symbols throughout the figures.

The IC socket shown in Fig. 1 is manufactured by performing the first bending process and the second bending process continuously as described above, thereby shortening the time required for the work and reducing the manufacturing cost of the IC socket. It is possible to improve quality by eliminating problems such as scratches or adhesion of oil, etc. Furthermore, even if an overload is applied to the contact piece 11 or 12 and the contact piece is bent in the direction of expansion, the protrusion 32 can be prevented from coming into contact with the wall of the groove 43 and being further bent and causing plastic deformation, etc. It has the advantages of

Also, the IC socket shown in Figure 2 is shown in Figure 1.
The protrusions 22 provided at the tips of the contact pieces 11 and 12 and the grooves 43 provided on the inner side of the hole 41 are removed from the IC socket, simplifying the processing of the contacts 3 and the insulator 4, and facilitating the manufacture of the IC socket. In addition to further reducing the price, it is possible to improve quality by eliminating problems such as scratches on the plated surface or adhesion of oil or the like.

Furthermore, in FIG.
The contact piece 52 is provided with contact pieces 52 and 53 and a lead terminal 54 that face each other with the contact piece 52 interposed therebetween, and a protrusion 32 is formed at the tip of the contact piece 52 to prevent deformation due to overload.

On the other hand, the insulator 6 has a plurality of holes 61 for accommodating the contacts 5, and the holes 61 have lead terminals 5 at the bottom.
It has a through hole 62 for passing through the contactor 4, and a raised part 4 on the side surface that displaces the tip of the contactor 5 inward.
2, and a groove 43 into which the protrusion 32 is inserted is formed.

Like the IC socket shown in Figure 1, the IC socket with this structure also simplifies the process of bending the contact, shortens the time required for the work, reduces the manufacturing cost of the IC socket, and prevents scratches on the plated surface. It is possible to improve quality by eliminating problems such as adhesion of oil or oil. Further, even if an overload is applied to the contact piece 53 and the contact piece is bent in the direction of expansion, the protrusion 32 comes into contact with the wall of the groove 43, and even if the protrusion 32 is bent further, plastic deformation can be prevented.

[Effect of idea]

As described above, according to the present invention, it is possible to provide a high-quality, inexpensive IC socket equipped with a mechanism for preventing contact deformation due to overload.

[Brief explanation of the drawing]

Figure 1 is a divided perspective view showing one embodiment of the IC socket of the present invention, Figure 2 is a divided perspective view showing another embodiment of the present invention, and Figure 3 is a divided perspective view showing a modification of the present invention. 4 are split perspective views showing a conventional IC socket. In the figure, 3 and 5 are contacts, 4 and 6 are insulators, 11, 12, 52, and 53 are contact pieces, 22 is a guide portion, 31 and 51 are gaps, 32 is a protrusion, 41,
61 represents a hole, 42 a raised portion, 43 a groove, 54 a lead terminal, and 62 a through hole, respectively.

Claims (1)

[Claims for Utility Model Registration] 1. A contactor 3 and an insulator 4, the contactor 3 having a plurality of contact pieces 11 and 12 facing each other with a gap 31 in between, and having elasticity. The insulator 4 houses the contact 3, and
and a plurality of holes 41 provided with protrusions 42 on the inner surface for displacing the contact pieces 11, 12 inwardly.
A socket for a semiconductor integrated circuit, characterized in that when the contactor 3 is housed in the insulator 4, contact pieces 11 and 12 come into elastic contact with each other. 2. The contactor 3 has a protrusion 32 at the tip of the contact pieces 11, 12 to prevent deformation due to overload, and the insulator 4 has a groove 43 on the inner surface in which the protrusion 32 is accommodated. A socket for a semiconductor integrated circuit according to claim 1 of the utility model registration claim.