JPH0355742A - Manufacture of electron tube - Google Patents

Manufacture of electron tube

Info

Publication number
JPH0355742A
JPH0355742A JP19083589A JP19083589A JPH0355742A JP H0355742 A JPH0355742 A JP H0355742A JP 19083589 A JP19083589 A JP 19083589A JP 19083589 A JP19083589 A JP 19083589A JP H0355742 A JPH0355742 A JP H0355742A
Authority
JP
Japan
Prior art keywords
glass
semiconductor crystal
tube
electron tube
vacuum container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19083589A
Other languages
Japanese (ja)
Other versions
JPH0677437B2 (en
Inventor
Tokuaki Futahashi
得明 二橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP19083589A priority Critical patent/JPH0677437B2/en
Publication of JPH0355742A publication Critical patent/JPH0355742A/en
Publication of JPH0677437B2 publication Critical patent/JPH0677437B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)

Abstract

PURPOSE:To eliminate the possibility of sealing a gas into an electron tube with a simple device and process by vacuuming a glass enclosure and a space between a vacuum vessel and the glass enclosure in the vacuum vessel having a size sufficient to enclose the glass outside, and heating a semiconductor crystal from the outside. CONSTITUTION:A glass enclosure 10 of electron tube is enclosed with a bell jar 12 and a table 14, a vacuuming glass tube 16 is disposed through the table 14, and the enclosure 10 is fused and connected to the top end of the glass tube 16 in the communicated state, and the enclosure 10 is vacuumed through the tube 16 by a vacuum pump. The space around the enclosure 10 formed by the bell jar 12 and the table 14 is vacuumed from an exhaust hole 18 formed on the table 14. Under this state, a semiconductor crystal 20 mounted on the top end inner surface of the glass enclosure 10 is heated from the outside of the bell jar 12 by an infrared lamp 22.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

この発明はガラス外囲器の内開面に接着した半導体結晶
光電而を有する電子管の製造方法に関する.
This invention relates to a method for manufacturing an electron tube having a semiconductor crystal photoelectric structure bonded to the inner open surface of a glass envelope.

【従来の技術】[Conventional technology]

ガラス外囲器内に、ガラスと接着した半導体結晶を配置
し、これを半導体結晶光電面とした電子管がある. 一般に、光電面形成のための表面活性化工程においては
、半桿体結晶を真空中におき、約600〜640″C位
まで加熱し、表面を清浄化しなければならないが、半導
体結晶を接着させるガラスは、例えばGa As /G
a AJ!As半導体結晶の場合は、これらと同じ位の
熱膨脹率のガラス、例えばコーニング7056 (商品
名)が用いられる.このガラスは、前述の、半導体結晶
表面の清浄化に必要な温度約600〜640℃の条件で
は、軟化してしまう. 従って、例えば、電子管内部を真空とし、外側を常圧と
した場合は、内外の圧力差によって電子管のガラスが変
形してしまう. このため、電子管に光電面を形成する場合は、必ず真空
中で行わなければならない. このような電子管の製造方法は、従来、半導体結晶をガ
ラス面板に接着し、これを電子管の部品として、他の部
品と同時に大型の同一の真空装置内に置き、この真空装
置内において、前記半導体結晶を加熱し、その表面を清
浄化した後、Cs及び02によりその表面の電子親和力
を低くあるいは零あるいは負にすることによって光電面
とし、しかる後、マジックハンド等を用いて、電子管の
他の部分と、所要個所でシール材、例えばインジュウム
を介在させて一体化し、真空を保持するものである.
There is an electron tube in which a semiconductor crystal bonded to glass is placed inside a glass envelope, and this serves as a semiconductor crystal photocathode. Generally, in the surface activation process for forming a photocathode, a semi-rod crystal must be placed in a vacuum and heated to approximately 600 to 640"C to clean the surface, but this process does not allow the semiconductor crystal to adhere. Glass is, for example, GaAs/G
a AJ! In the case of As semiconductor crystals, a glass having a coefficient of thermal expansion similar to these, such as Corning 7056 (trade name), is used. This glass softens under the above-mentioned temperature conditions of about 600 to 640°C, which are necessary for cleaning the semiconductor crystal surface. Therefore, for example, if the inside of an electron tube is set to a vacuum and the outside is set to normal pressure, the glass of the electron tube will be deformed due to the pressure difference between the inside and outside. For this reason, when forming a photocathode on an electron tube, it must be done in a vacuum. Conventionally, in the manufacturing method of such an electron tube, a semiconductor crystal is bonded to a glass face plate, and this is placed as a component of the electron tube in the same large vacuum device at the same time as other components. After heating the crystal and cleaning its surface, use Cs and 02 to make the electron affinity of the surface low, zero, or negative, thereby making it a photocathode. The parts are integrated with a sealing material such as indium at required points to maintain a vacuum.

【発明が解決しようとする課題】[Problem to be solved by the invention]

上記のような従来の電子管の!!!遣方法は、光電面と
なる部品を含め、複数の部品を大型の真空装置内に持込
み、それをマジックハンド等で組立てるという複雑且つ
コストの高い工程、装置が必要となり、更に、最終工程
では各部品を互いにシール材を介在させて真空を保持さ
せなければならないが、シールの際にインジウム等のシ
ール材からの放出ガスを充分に取除いておかなければ、
電子管内にガスが残り、該電子管の特性を低下させると
いう問題点がある. この発明は上記従来の問題点に鴛みてなされたものであ
って、簡単な装置、及び工程で、低コストで、且つ電子
管内にガスを封じ込める恐れのない電子管の製造方法を
提供することを目的とする.(課題を解決するための手
V1】 この発明は、ガラス外囲器の内側面に接着した半導体結
晶から半導体結晶光電面を形成する電子管の製造方法に
おいて、前記ガラス外囲器の外測を、着脱自在の真空容
器により取囲むと共に、前記ガラス外囲器から真空引き
用のガラス管を、前記真空容器を貫通して配置し、この
ガラス管と前記真空容器から真空引きし、前記ガラス外
囲器の外側から前記半導体結晶を加熱することをにより
上記目的を達成するものである. 又、前記真空容器を、前記ガラス外囲器の外径よりも大
きく、且つ、前記カラス管がシール状態で貫通されるテ
ーブルと一端が開口され、ガラス外囲器を内包する大き
さの有底簡形状であって、開口側端面が前記テーブルに
シール状態で着脱自在とすることにより上記目的を達或
するものである. 更に、前記テーブルに、前記真空容器内を真空引きする
ための排気孔を形戒することにより上記目的を達成する
ものである. 又、前記半導体結晶を、前記真空容器の外側から赤外光
により加熱するようにして上記目的を達成するものであ
る. 更に又、前記真空容器の内開の、前記半導体結晶に対す
る位置に発然体を配置し、これにより半導体結晶を加熟
するようにして上記目的を達成するものである. 又、前記ガラス外囲器を、前記ガラス管の前記テーブル
を貫通した先端に連通状態で溶触8続し、半導体結晶を
加熱により清浄化し,CS、02を吸着させCS、O2
層を形成した後、該ガラス外囲器を、前記ガラス管先端
を溶解して真空状態で封止し、該ガラス管から分離させ
るようにして上記目的を達成するものである. 〔作用】 この発明においては、ガラス外囲器の外聞を取囲むだけ
の大きさの真空容器内で、ガラス外囲器及び真空容器と
ガラス外囲器との間の両者を真空とし、外測から半導体
結晶を加熱することによって、大掛りな装置を用いるこ
となく、小型の真空容器内で、容易に光電面を形或して
電子管を製造でき、しかも、インジウム等のシール材を
必要としないので、工程か簡単になり、且つ電子管内へ
のガスの封じ込め及びこれによる特性の著しい低下を防
止することができる.
Conventional electron tube like above! ! ! This method involves bringing multiple parts, including the photocathode, into a large vacuum device and assembling them with a magic hand, which is a complex and costly process and equipment.Furthermore, in the final process, each It is necessary to maintain a vacuum between the parts by interposing a sealing material between them, but if the gas released from the sealing material such as indium is not sufficiently removed during sealing,
There is a problem in that gas remains inside the electron tube and deteriorates the characteristics of the electron tube. The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a method for manufacturing an electron tube using simple equipment and processes, at low cost, and without the risk of trapping gas within the electron tube. Suppose that (Meaning for Solving the Problems V1) The present invention provides a method for manufacturing an electron tube in which a semiconductor crystal photocathode is formed from a semiconductor crystal adhered to the inner surface of a glass envelope, in which an external measurement of the glass envelope is performed. It is surrounded by a removable vacuum container, and a glass tube for drawing a vacuum from the glass envelope is placed through the vacuum container, and a vacuum is drawn from this glass tube and the vacuum container. The above object is achieved by heating the semiconductor crystal from the outside of the container.Also, the vacuum container has a diameter larger than the outer diameter of the glass envelope, and the glass tube is in a sealed state. The above object is achieved by having a simple bottomed shape with an opening at one end of the table to be penetrated and a size for enclosing a glass envelope, and the end surface on the opening side is removably attached to the table in a sealed state. Furthermore, the above object is achieved by forming an exhaust hole in the table to evacuate the inside of the vacuum container.Furthermore, the semiconductor crystal is removed from the outside of the vacuum container. The above object is achieved by heating with infrared light.Furthermore, a developing body is placed in the opening of the vacuum container at a position relative to the semiconductor crystal, thereby ripening the semiconductor crystal. In this way, the above object is achieved. Also, the glass envelope is melted in communication with the tip of the glass tube passing through the table, the semiconductor crystal is cleaned by heating, and the CS, adsorbs 02, CS, O2
After forming the layer, the glass envelope is separated from the glass tube by melting the tip of the glass tube and sealing it in a vacuum, thereby achieving the above object. [Function] In this invention, in a vacuum container large enough to surround the outer circumference of the glass envelope, both the glass envelope and between the vacuum container and the glass envelope are evacuated, and the outer circumference of the glass envelope is evacuated. By heating a semiconductor crystal from a semiconductor crystal, it is possible to easily form a photocathode and manufacture an electron tube in a small vacuum container without using large-scale equipment, and there is no need for a sealing material such as indium. Therefore, the process is simplified, and it is possible to prevent gas from being trapped in the electron tube and the resulting significant deterioration of characteristics.

【実施例】【Example】

以下本発明による電子管の製造方法を、該方法を実施す
るための装置を示す図面を参照して詳細に説明する. この実施例は、電子管のガラス外囲器10の外測を、ベ
ルジャー12及びテーブルl4で取囲むと共に、該テー
ブルl4を貫通して真空引き用のガラス管16を配置し
、このガラス管16の先端に、前記カラス外囲器10を
連通状態で溶融接続し、前記ガラス管16から真空ポン
プでガラス外囲器10内を真空引きし、更に、ベルジャ
ー12及びテーブル14によって形成されたガラス外囲
器10周囲の空間を、テーブル14に形成された排気孔
18から真空引きし、この状態で、前記ガラス外囲器1
0の先端内開面に取付けられた半導体結晶20を、赤外
線ランプ22により、ベルジャー12の外側から加熱す
るようにしたものである. 図の符号24はガラス管16とテーブル14との間をシ
ールするためのオーリング、26はテーブル14とベル
ジャー12の開口側端面との間をシールするオーリング
をそれぞれ示す.前記テーブル14は、ガラス外囲器1
0が取付けられていない状態で、ガラス管16に挿通し
て固定する. ガラス外囲器10は、テーブル14から突出したガラス
管16の先端に連通状態で溶融接続する.この状態で、
ベルジャー12で、ガラス外囲器10を囲むようにして
、第1図に示されるように、オーリング26を介して、
該ベルジャー12の開口先端を密着させ、ベルジャー1
2をセットする.この状態で、ガラス管16を介してガ
ラス外囲器10内を、又排気孔18を介してガラス外囲
器10周囲のベルジャー12内開空間を、それぞれ真空
引きする. 所定の真空圧となったとき、半導体結晶20を、前記赤
外線ランブ22により、ガラス外囲器10及びベルジャ
ー12の外■から加熱して、半導体結晶20表面の清浄
化を行う. 該半導体結晶20表面へのCS、02の吸着工程は、ガ
ラス管l6から通常の如く行う.第2図に、ガラスに接
着した完戒状態の半導体結晶光電面21を示す. 第2図においてガラスIOAは前記ガラス外囲器10の
一部であり、例えば、前述のコーニング7056が用い
られる.半導体結晶20は、Si02層2 O Aと、
GaAJ2As層20Bと、GaAs層20Cとから構
成され、これに、加熱による清浄化の後、Cs、O2を
吸着させ、Cs , 02層21Aを形或し、半導体結
晶光電面21を完成させる. なお、上記実施例は、ベルジャー12及びテーブル14
により、ガラス管16が貫通した状態でガラス外囲器1
0を取囲むようにしたものであるが、これらは、ガラス
管16が貫通し、且つガラス外囲器10がガラス管l6
に対して着脱自在となるように該ガラス外囲器10を取
囲む真空容器であればよい. 更に、上記実施例は、半導体結晶20をベルジャー12
の外側から赤外線ランプ22によって加熱するようにし
たものであるが、これは、例えば、ガラス外囲器10と
ベルジャー12との間に、半導体結晶20と対向する位
置に、第1図において2点鎖線で示されるように、ヒー
トブロック30等の発熱体を配置し、ここから、半導体
結晶20を加熱するようにしてもよい. この場合は、ベルジャー12を介することなくガラス外
囲器10の底面のガラスIOAを介してのみ半導体結晶
20を加熱することになるので、効率的な加熱を行うこ
とができると共に、ベルジャー12を構戒するガラスの
耐熟性を考慮する必要がないという利点がある.
The method for manufacturing an electron tube according to the present invention will be explained in detail below with reference to the drawings showing an apparatus for carrying out the method. In this embodiment, the outside of the glass envelope 10 of the electron tube is surrounded by a bell jar 12 and a table 14, and a glass tube 16 for evacuation is placed through the table 14. The glass envelope 10 is melt-connected to the tip in a communicating state, the inside of the glass envelope 10 is evacuated with a vacuum pump from the glass tube 16, and the glass envelope 10 formed by the bell jar 12 and the table 14 is further connected to the glass envelope 10. The space around the glass envelope 10 is evacuated through an exhaust hole 18 formed in the table 14, and in this state, the glass envelope 1
The semiconductor crystal 20 attached to the opening inside the tip of the bell jar 12 is heated from the outside of the bell jar 12 by an infrared lamp 22. The reference numeral 24 in the figure indicates an O-ring for sealing between the glass tube 16 and the table 14, and the reference numeral 26 indicates an O-ring for sealing between the table 14 and the open end surface of the bell jar 12. The table 14 includes a glass envelope 1
0 is not attached, insert it into the glass tube 16 and fix it. The glass envelope 10 is fused and connected to the tip of a glass tube 16 protruding from the table 14 in a communicating state. In this state,
With the bell jar 12 surrounding the glass envelope 10, as shown in FIG.
The open end of the bell jar 12 is brought into close contact with the bell jar 1.
Set 2. In this state, the inside of the glass envelope 10 is evacuated through the glass tube 16, and the open space inside the bell jar 12 around the glass envelope 10 is evacuated through the exhaust hole 18. When a predetermined vacuum pressure is reached, the semiconductor crystal 20 is heated from the outside of the glass envelope 10 and bell jar 12 by the infrared lamp 22 to clean the surface of the semiconductor crystal 20. The step of adsorbing CS and 02 onto the surface of the semiconductor crystal 20 is carried out in the usual manner from a glass tube 16. FIG. 2 shows the semiconductor crystal photocathode 21 in a perfect state adhered to glass. In FIG. 2, the glass IOA is a part of the glass envelope 10, and for example, the aforementioned Corning 7056 is used. The semiconductor crystal 20 includes a Si02 layer 2OA,
It is composed of a GaAJ2As layer 20B and a GaAs layer 20C, and after cleaning by heating, Cs and O2 are adsorbed thereto to form a Cs,02 layer 21A, thereby completing a semiconductor crystal photocathode 21. In addition, in the above embodiment, the bell jar 12 and the table 14
As a result, the glass envelope 1 is opened with the glass tube 16 passing through it.
0, the glass tube 16 passes through it, and the glass envelope 10 surrounds the glass tube l6.
Any vacuum container may be used as long as it surrounds the glass envelope 10 so as to be detachable from the glass envelope 10. Furthermore, in the above embodiment, the semiconductor crystal 20 is used as the bell jar 12.
Heating is performed from the outside by an infrared lamp 22, for example, at two points in FIG. As shown by the chain line, a heating element such as a heat block 30 may be arranged to heat the semiconductor crystal 20 from there. In this case, since the semiconductor crystal 20 is heated only through the glass IOA on the bottom of the glass envelope 10 without going through the bell jar 12, efficient heating can be performed and the bell jar 12 can be The advantage is that there is no need to consider the aging resistance of the glass.

【発明の効果】【Effect of the invention】

本発明は上記のように構成したので、大掛りな装置や複
雑な工程を経ることなく、簡単で且つ低コストで、特性
の優れた半導体結晶光電面を持つ電子管を製造すること
ができるという優れた効果を有する.
Since the present invention is constructed as described above, it has the advantage that an electron tube having a semiconductor crystal photocathode with excellent characteristics can be manufactured easily and at low cost without going through large-scale equipment or complicated processes. It has a beneficial effect.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る電子管のIl!遠方法を実施する
ための装置を示す断面図、第2図は本発明方法により製
造された電子管における半導体結晶光電面を示す拡大断
面図である. 10・・・ガラス外囲器、  l2・・・ベルジャー1
4・・・テーブル、   l6・・・ガラス管、18・
・・排気孔、     20・・・半導体結晶、21・
・・半導体結晶光電面、 22・・・赤外線ランプ、 30・・・ビートブロック.
FIG. 1 shows Il! of the electron tube according to the present invention. FIG. 2 is an enlarged sectional view showing a semiconductor crystal photocathode in an electron tube manufactured by the method of the present invention. 10...Glass envelope, l2...Bell jar 1
4...Table, l6...Glass tube, 18.
...Exhaust hole, 20...Semiconductor crystal, 21.
...Semiconductor crystal photocathode, 22...Infrared lamp, 30...Beat block.

Claims (6)

【特許請求の範囲】[Claims] (1)ガラス外囲器の内側面に接着した半導体結晶から
半導体結晶光電面を形成する電子管の製造方法において
、前記ガラス外囲器の外側を、着脱自在の真空容器によ
り取囲むと共に、前記ガラス外囲器から真空引き用のガ
ラス管を、前記真空容器を貫通して配置し、このガラス
管と前記真空容器から真空引きし、前記ガラス外囲器の
外側から前記半導体結晶を加熱することを特徴とする電
子管の製造方法。
(1) In a method for manufacturing an electron tube in which a semiconductor crystal photocathode is formed from a semiconductor crystal adhered to the inner surface of a glass envelope, the outside of the glass envelope is surrounded by a detachable vacuum container, and the glass A glass tube for evacuation from the envelope is placed through the vacuum container, the glass tube and the vacuum container are evacuated, and the semiconductor crystal is heated from outside the glass envelope. Characteristic electron tube manufacturing method.
(2)請求項1において、前記真空容器は、前記ガラス
外囲器の外径よりも大きく、且つ、前記ガラス管がシー
ル状態で貫通されるテーブルと、一端が開口され、ガラ
ス外囲器を内包する大きさの有底筒形状であつて、開口
側端面が前記テーブルにシール状態で着脱自在とされた
ベルジヤと、から構成されたことを特徴とする電子管の
製造方法。
(2) In claim 1, the vacuum container includes a table having an outer diameter larger than the outer diameter of the glass envelope and through which the glass tube is passed through in a sealed state, and a table having an open end and extending from the glass envelope. 1. A method for manufacturing an electron tube, comprising: a bell gear having a bottomed cylindrical shape of a size that accommodates the electron tube, and whose open end surface is removably attached to the table in a sealed state.
(3)請求項2において、前記テーブルに、前記真空容
器内を真空引きするための排気孔を形成してなる電子管
の製造方法。
(3) The method of manufacturing an electron tube according to claim 2, wherein an exhaust hole for evacuating the inside of the vacuum container is formed in the table.
(4)請求項1、2又は3において、前記半導体結晶を
、前記真空容器の外側から赤外光により加熱することを
特徴とする電子管の製造方法。
(4) A method of manufacturing an electron tube according to claim 1, 2 or 3, characterized in that the semiconductor crystal is heated with infrared light from outside the vacuum container.
(5)請求項1、2又は3において、前記真空容器の内
側の、前記半導体結晶に対する位置に発熱体を配置し、
これにより半導体結晶を加熱することを特徴とする電子
管の製造方法。
(5) In claim 1, 2 or 3, a heating element is arranged inside the vacuum container at a position relative to the semiconductor crystal,
A method for manufacturing an electron tube, characterized by heating a semiconductor crystal thereby.
(6)請求項1乃至5において、前記ガラス外囲器を、
前記ガラス管の前記テーブルを貫通した先端に連通状態
で溶融接続し、半導体結晶を加熱により清浄化し、Cs
、O_2を吸着させCs、O_2層を形成した後、該ガ
ラス外囲器を、前記ガラス管先端を溶解して真空状態で
封止し、該ガラス管から分離させることを特徴とする電
子管の製造方法。
(6) In any one of claims 1 to 5, the glass envelope comprises:
The tip of the glass tube passing through the table is fused and connected in a communicating state, the semiconductor crystal is cleaned by heating, and Cs
, O_2 is adsorbed to form a Cs, O_2 layer, and then the glass envelope is sealed in a vacuum state by melting the tip of the glass tube, and is separated from the glass tube. Method.
JP19083589A 1989-07-24 1989-07-24 Electron tube manufacturing method Expired - Fee Related JPH0677437B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19083589A JPH0677437B2 (en) 1989-07-24 1989-07-24 Electron tube manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19083589A JPH0677437B2 (en) 1989-07-24 1989-07-24 Electron tube manufacturing method

Publications (2)

Publication Number Publication Date
JPH0355742A true JPH0355742A (en) 1991-03-11
JPH0677437B2 JPH0677437B2 (en) 1994-09-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP19083589A Expired - Fee Related JPH0677437B2 (en) 1989-07-24 1989-07-24 Electron tube manufacturing method

Country Status (1)

Country Link
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Also Published As

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JPH0677437B2 (en) 1994-09-28

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